Data assurance in three-dimensional forming

ABSTRACT

Provided herein are apparatuses, and non-transitory computer readable media regarding data assurance for instructions data utilized in forming at least one requested 3D object, and methods associated therewith. Data assurance may comprise (i) security, (ii) certification, (iii) validation, (iv) integrity, or (v) authentication. Data assurance may be implemented in a pre-formation environment and/or by a manufacturing device that forms the requested 3D object(s). The pre-formation environment may include one or more stages, and/or modules of a pre-formation environment (e.g., application).

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.18/098,304 filed Jan. 18, 2023, which is a continuation of U.S. patentapplication Ser. No. 17/956,961 filed Sep. 30, 2022, which is acontinuation of U.S. patent application Ser. No. 17/844,928 filed Jun.21, 2022, which is a continuation of U.S. patent application Ser. No.17/695,130 filed Mar. 15, 2022, which is a continuation of U.S. patentapplication Ser. No. 17/541,552 filed Dec. 3, 2021, which is acontinuation of U.S. patent application Ser. No. 17/411,588 filed Aug.25, 2021, which is a continuation of U.S. patent application Ser. No.17/322,060 filed May 17, 2021, which is a continuation of U.S. patentapplication Ser. No. 17/163,799 filed Feb. 1, 2021, which is acontinuation of U.S. patent application Ser. No. 16/183,557 filed Nov.7, 2018, which is entirely incorporated herein by reference.

BACKGROUND

Three-dimensional (3D) forming (e.g., additive manufacturing) is aprocess for making a three-dimensional object of any shape from adesign. The design may be in the form of a data source, such as anelectronic data source, or may be in the form of a hard copy. The hardcopy may be a two-dimensional representation of a 3D object. The datasource may be an electronic 3D model. 3D forming (e.g., printing) may beaccomplished through an additive process in which successive layers ofmaterial are laid down one on top of another. This process may becontrolled (e.g., computer controlled, manually controlled, or both). Amanufacturing device that is suitable for 3D forming can be anindustrial robot.

3D forming can generate custom parts. A variety of materials can be usedin a 3D printing process including elemental metal, metal alloy,ceramic, elemental carbon, or polymeric material. In some 3D printingprocesses (e.g., additive manufacturing), a first layer of hardenedmaterial is formed, and thereafter successive layers of hardenedmaterial are added one by one, wherein each new layer of hardenedmaterial is added on a pre-formed layer of hardened material, until theentire designed three-dimensional structure (3D object) is layer-wisematerialized.

3D models may be generated with a computer aided design package, via a3D scanner, or manually. The modeling process of preparing geometricdata for 3D computer graphics may be similar to those of the plasticarts, such as sculpting or animating. 3D scanning is a process ofanalyzing and collecting digital data on the shape and appearance of areal object (e.g., real-life object). Based on these data, 3D models ofthe scanned object can be produced.

Many additive processes are currently available. They may differ in themanner layers are deposited and/or formed to create the materializedstructure. They may vary in the material(s) that are used to generatethe designed structure. Some methods melt and/or soften material toproduce the layers. Examples of 3D printing methods include selectivelaser melting (SLM), selective laser sintering (SLS), direct metal lasersintering (DMLS), shape deposition manufacturing (SDM) or fuseddeposition modeling (FDM). Other methods cure liquid materials usingdifferent technologies such as stereo lithography (SLA). In the methodof laminated object manufacturing (LOM), thin layers (made inter alia ofpaper, polymer, and/or metal) are cut to shape and joined together.

Sometimes, a (e.g., virtual) pre-formation environment provides aformation model to assist in preparing a requested 3D object forformation by one or more manufacturing devices. The pre-formationenvironment may comprise a software and/or computing environment. Thepre-formation environment may provide a capability of displaying a(e.g., virtual) model of the requested 3D object. At times, apre-formation environment may provide a capability of specifying variousformation variable category options (e.g., process parameters) relatedto the formation of the requested 3D object, and/or various propertiesof the requested 3D object. The specification of the processparameter(s) may be to at least a surface and/or volumetric portion ofthe requested 3D object. The pre-formation environment may generateforming (e.g., printing) instructions data (e.g., for the requested 3Dobject) considering the specification of the process parameter(s). Theforming instructions data may comprise commands for at least onemanufacturing device to form the requested 3D object. The pre-formationenvironment may generate (e.g., layout) instructions data considering abuild volume of a given manufacturing device that is suitable forforming the requested 3D object. The instructions data may betransmitted between the pre-formation environment and at least onemanufacturing device that is suitable for 3D forming. The manufacturingdevice may be suitable for forming a plurality of 3D objects (e.g., inparallel, and/or serially).

Manufacturing devices may be configured to receive forming directionsdevoid of assurance. For example, non-assured printing instructions maycomprise non-secured and non-encrypted (or unencrypted) formingdirections for forming 3D objects. Some files associated with formingdirections for forming a 3D object may be devoid of assurance such asprotection (such as, e.g., encryption). The non-assured forminginstruction may be compatible with a variety of manufacturing devices.The variety of manufacturing devices may be of various types, made byone or more entities (e.g., manufacturers), controlled by one or moreentities, and/or owned by one or more entities. One or more modules thatgenerate the non-assured forming instructions may be compatible with thevariety of manufacturing devices.

At times, a lack of data security during the reading, writing, storing,and/or transmission of the instructions data (e.g., to the manufacturingdevice) may promote unauthorized access, and/or unauthorized tampering(e.g., data alteration), to a computer or electronic file containing orassociated with forming instructions. A forming instructions relatedfile may be any file related to the forming instructions and/or any fileused in the generation of the forming instructions. Unauthorized accessto the forming instructions related file(s) may lead to breach, damageand/or loss. For example, alteration to the forming instructions relatedfile(s) may lead to generation of a defective 3D object, lead tomaterial harm, and/or an unsafe operating condition of the manufacturingdevice. A defective 3D object may be unfit for its intended purpose. Thematerial harm may be to the forming equipment, forming environment,forming facility, and/or personnel involved with the formation of the 3Dobject and/or disposed at a location in which the 3D object is formed.

SUMMARY

At times, it is requested to provide data assurance (e.g., measures) to(e.g., at least a portion of) instructions data for forming at least aportion of a requested 3D object. Data assurance may comprise (i)security, (ii) certification, (iii) validation, (iv) integrity, or (v)authentication. Data security (e.g., a security level) may compriseencryption and/or error verification (e.g., detection). The instructionsdata may be generated in a pre-formation (e.g., virtual) environment. Apre-formation environment may comprise an application. A pre-formationenvironment may comprise one or more stages. In some embodiments, atleast one (e.g., any) of the stages comprises one or more modules (e.g.,software modules). A module may receive, process, and/or generate datarelated to the requested 3D object and/or to its formation. Theinstructions data may comprise forming instructions and/or layoutinstructions. The forming instructions may comprise commands for amanufacturing device to form a requested 3D object. The commands may befor control of at least one apparatus and/or component of themanufacturing device (e.g., manufacturing system). The layoutinstructions may comprise commands for a given manufacturing device toform at least one requested 3D object (i) according to a requestedarrangement, (ii) according to a specified sequence with which one ormore transforming agents (e.g., and/or generators thereof) are operated,and/or (iii) to have a requested marking (e.g., label). Data assurancemay be implemented for (e.g., during) generation of instructions data,and/or for (e.g., during) the process (e.g., virtual and/or physical)formation of a requested 3D object. Data assurance may be implementedfor a (e.g., first) file that comprises and/or is related to forminginstructions. Data assurance may generate at least one assured file,e.g., for use by a manufacturing unit for forming at least onethree-dimensional object. In some embodiments, data security may deter(e.g., restrain and/or prevent) unauthorized access to at least aportion of the instructions data. The security may comprise encryptionof at least one forming instructions related file.

The operations of any of the methods, non-transitory computer readablemedia, and/or controller directions described herein can be in anyorder. At least two of the operation in any of the methods,non-transitory computer readable media, and/or controller(s) can beperformed simultaneously.

In another aspect, a system for processing a first file associated withinstructions for forming at least one three-dimensional object,comprises: computer memory configured to store the first file associatedwith the instructions for forming the at least one three-dimensionalobject; and one or more computer processors operatively coupled to thecomputer memory, wherein the one or more computer processors areindividually or collectively programmed to: (i) assure the first file toyield at least one assured file usable by a manufacturing unit that isconfigured to form the at least one three-dimensional object, and (ii)output the at least one assured file for use by the manufacturing unit.

In some embodiments, to assure the first file comprises (i) to encrypt,(ii) to certify, (iii) to validate, (iv) to verify an integrity, or (v)to authenticate, the first file. In some embodiments, to output the atleast one assured file comprises: to store the at least one assured filein a computer memory device. In some embodiments, to output the at leastone assured file comprises: to transmit the at least one assured file tothe manufacturing unit. In some embodiments, the manufacturing unit isconfigured to process the at least one assured file to print the atleast one three-dimensional object using three-dimensional printing. Insome embodiments, the manufacturing unit is configured to process the atleast one assured file to form the at least one three-dimensionalobject. In some embodiments, to process the at least one assured filecomprises to execute at least a portion of the at least one assuredfile. In some embodiments, the at least one assured file comprises atleast one encrypted file, and wherein to process the at least oneassured file comprises to decrypt at least a portion of the at least oneencrypted file. In some embodiments, the computer memory comprises adecryption key. In some embodiments, the decryption key is configured todecrypt the at least the portion of the at least one encrypted file. Insome embodiments, the decryption key is included in the output of the atleast one assured file for use by the manufacturing unit. In someembodiments, the at least one assured file is usable by themanufacturing unit upon decryption. In some embodiments, themanufacturing unit comprises a manufacturing device or a manufacturingsystem. In some embodiments, the manufacturing unit comprises at leastone computer operatively coupled with the manufacturing device and/orwith the manufacturing system. In some embodiments, the manufacturingunit is a three-dimensional printer. In some embodiments, the computermemory comprises: a non-transitory computer-readable medium, anelectrical circuit, or a socket. In some embodiments, the one or morecomputer processors are configured to generate the first file. In someembodiments, the computer memory is a first computer memory, wherein (a)the first computer memory or (b) a second computer memory that isoperatively coupled to the first computer memory, comprises apre-formation application that is operable to instruct the one or morecomputer processors to assure the first file. In some embodiments, thepre-formation application is a non-transitory computer readable media.In some embodiments, the pre-formation application comprises (i) atleast one stage or (ii) at least one module; and wherein the (I) atleast one stage, and/or (II) the at least one module, is operable toinstruct the one or more computer processors to assure the first file.In some embodiments, the at least one module comprises operationsassociated with: (A) a requested three-dimensional object model, (B) aregion of interest designation in the requested three-dimensional objectmodel, (C) an estimation of a likelihood of formation failure of therequested three-dimensional object model, (D) a simulation of formingthe requested three-dimensional object model, and/or (E) processinginstructions for a forming apparatus to form the requestedthree-dimensional object model, wherein the requested three-dimensionalobject model is associated with a three-dimensional object of the atleast one three-dimensional object. In some embodiments, instructions toassure the first file precede or occur during (a) a transmission from afirst stage to a second stage, and/or (b) a transmission from a firstmodule to a second module, of the pre-formation application. In someembodiments, the pre-formation application is further configured toimplement an assurance scheme, wherein the assurance scheme comprises:(I) an encryption scheme, (II) a validation scheme, or (III) anintegrity verification scheme. In some embodiments, the encryptionscheme comprises a symmetric encryption scheme or an asymmetricencryption scheme. In some embodiments, at least a portion of the atleast one assured file is encrypted. In some embodiments, the assurancescheme is associated with a given stage and/or a given module. In someembodiments, the assurance scheme is associated with operationsperformed in a given stage and/or a given module. In some embodiments,the system further comprises a first computing device and a secondcomputing device, wherein the first computing device comprises a firstcomputer processor of the one or more computer processors, and thesecond computing device comprises a second computer processor of the oneor more computer processors. In some embodiments, a first portion of thefirst file is assured by the first computer processor to yield a firstportion of the at least one assured file, and wherein a second portionof the first file is assured by the second computer processor to yield asecond portion of the at least one assured file. In some embodiments, afirst portion of the first file is generated by the first computerprocessor, and wherein a second portion of the first file is generatedby the second computer processor. In some embodiments, the firstcomputer processor and the second computer processor are operativelycoupled by a communication component. In some embodiments, thecommunication component is configured to communicate by a wired or awireless connection. In some embodiments, the communication componentcomprises an optical fiber, or electrical wire. In some embodiments,operatively coupled comprises a local connection. In some embodiments,operatively coupled comprises a network connection. In some embodiments,operatively coupled comprises a connection through a firewall. In someembodiments, the firewall is hosted by the first computing device or bythe second computing device. In some embodiments, the firewall is hostedby a network that comprises the first computing device and/or the secondcomputing device. In some embodiments, the network further comprises themanufacturing unit. In some embodiments, at least two of the firstcomputing device, the second computing device, and the manufacturingunit are operatively coupled by a local connection. In some embodiments,at least two of the first computing device, the second computing device,and the manufacturing unit are operatively coupled by a remoteconnection. In some embodiments, remote is with respect to a location ofthe manufacturing unit. In some embodiments, remote is with respect to alocation of the computer memory, or a location of the one or morecomputer processors. In some embodiments, the location of the computermemory is remote with respect to the location of the one or morecomputer processors. In some embodiments, the at least one assured filecomprises an implementation of at least two security levels. In someembodiments, the at least one assured file comprises a first assuredfile and a second assured file, and wherein a first security level isimplemented for the first assured file, and a second security level isimplemented for the second assured file. In some embodiments, thepre-formation application comprises at least two stages and at least twomodules, wherein a first security level is implemented in a first stageand/or in a first module, and a second security level is implemented ina second stage and/or in a second module. In some embodiments,operations of the first stage and/or of the first module precedeoperations of the second stage and/or of the second module. In someembodiments, to assure the first file comprises implementation of afirst security level for a first portion of the at least one assuredfile, and implementation of a second security level for a second portionof the at least one assured file. In some embodiments, to assure thefirst file increases a (e.g., file) size and/or complexity of the atleast one assured file, which increase is relative to the first fileassociated with the instructions. In some embodiments, the systemfurther comprises an archive, wherein the archive comprises the firstassured file and the second assured file. In some embodiments, thecomputer memory comprises the archive. In some embodiments, the archivecomprises an archive file (e.g., compressed folder). In someembodiments, the at least one assured file comprises a specification ofat least one of a plurality of process parameters. In some embodiments,the plurality of process parameters comprises one or more settings ofthe manufacturing unit. In some embodiments, the plurality of processparameters comprises (i) a characteristic of a transforming agent, (ii)a characteristic of a transforming agent generator, (iii) or ametrology. In some embodiments, the at least one assured file compriseslayout instructions of the at least one three-dimensional object in avolume and/or above a platform, and wherein the manufacturing unitcomprises the volume and/or the platform. In some embodiments, thelayout instructions comprise commands for the manufacturing unit to formthe at least one three-dimensional object (i) according to a requestedarrangement, (ii) according to a specified sequence with which one ormore transforming agents (e.g., and/or generators thereof) of themanufacturing unit are operated, and/or (iii) to have a requestedmarking (e.g., label). In some embodiments, the at least one assuredfile comprises authentication of an identity prior to use thereof toform the three-dimensional object. In some embodiments, the identitycomprises an identity of an accessing party of the at least one assuredfile. In some embodiments, the identity of the accessing party comprisesdata associated with a (i) manufacturing party, (ii) owning party, (iii)controlling party, or (iv) operating party, of the manufacturing unit.In some embodiments, the identity of the accessing party comprises dataassociated with a (I) developing party, (II) owning party, (III)controlling party, or (IV) operating party, of a pre-formationapplication that processes the at least one assured file. In someembodiments, the identity is associated with the at least one assuredfile. In some embodiments, the at least one assured file comprises arepresentation of the identity. In some embodiments, the computer memorycomprises the at least one assured file that comprises therepresentation of the identity, which representation of the identity isusable to authenticate the identity, wherein the representation of theidentity is output in (ii). In some embodiments, to authenticate theidentity comprises to verify the representation of the identity to be ofa same manufacture, type, and/or model, of an (e.g., manufacturing)entity that is authorized to process the at least one assured file. Insome embodiments, an authorized identity comprises a model (e.g.,serial) number. In some embodiments, to authenticate the identitycomprises to verify the representation of the identity to be of anymanufacturing unit that is controlled, owned, and/or operated, by a samelegal (e.g., business) entity, the legal entity being authorized toprocess the at least one assured file. In some embodiments, toauthenticate the identity comprises to verify a pre-formationapplication that accesses the at least one assured file to be anypre-formation application that is of a same (i) type of, or (ii) versionof, or (iii) that is developed by, a (e.g., development) entity that isauthorized to process the at least one assured file. In someembodiments, to authenticate the identity comprises to verify apre-formation application that accesses the at least one assured file tobe any pre-formation application that is (i) owned, (ii) controlled,and/or (iii) operated, by a same legal (e.g., business) entity, thelegal entity that is authorized to process the at least one assuredfile.

In another aspect, a method for processing a first file associated withinstructions for forming at least one three-dimensional object,comprises: providing the first file associated 1 with the instructionsfor forming the at least one three-dimensional object; assuring thefirst file to yield at least one assured file usable by a manufacturingunit that is configured to form the at least one three-dimensionalobject; and outputting the at least one assured file for use by themanufacturing unit.

In some embodiments, the method is a computer-implemented method forthree-dimensional printing, wherein the method comprises using at leastone processor to perform (a), (b), and/or (c). In some embodiments,assuring the file comprises (i) encrypting, (ii) certifying, (iii)validating, (iv) verifying an integrity, or (v) authenticating, thefile. In some embodiments, providing the first file comprises (i)receiving the first file or (ii) generating the first file. In someembodiments, outputting the at least one assured file comprises storingthe at least one assured file in a computer memory device. In someembodiments, outputting the at least one assured file comprisestransmitting the at least one assured file to the manufacturing unit. Insome embodiments, the manufacturing unit is configured for processingthe at least one assured file to form the at least one three-dimensionalobject. In some embodiments, providing the first file comprisesexecuting the first file. In some embodiments, the at least one assuredfile is usable by the manufacturing unit upon decryption. In someembodiments, the manufacturing unit comprises a manufacturing device ora manufacturing system. In some embodiments, the manufacturing unitcomprises at least one computer operatively coupled with themanufacturing device and/or with the manufacturing system. In someembodiments, the method further comprises authenticating an identityprior to processing the at least one assured file to form the at leastone three-dimensional object. In some embodiments, authenticating theidentity comprises authenticating an identity of an accessing party. Insome embodiments, authenticating the identity of the accessing partycomprises authenticating data associated with a (i) manufacturing party,(ii) owning party, (iii) controlling party, or (iv) operating party, ofthe manufacturing unit. In some embodiments, the method furthercomprises accessing the at least one assured file with a pre-formationapplication, wherein authenticating the identity of the accessing partycomprises authenticating data associated with a (I) developing party,(II) owning party, (III) controlling party, or (IV) operating party, ofthe pre-formation application. In some embodiments, authenticating theidentity comprises authenticating data associated with the at least oneassured file. In some embodiments, the at least one assured filecomprises a representation of the identity. In some embodiments, therepresentation of the identity is stored in a computer memory device. Insome embodiments, authenticating the identity comprises verifying themanufacturing unit to be of a same manufacture, type, and/or model, ofan (e.g., manufacturing) entity that is authorized for processing the atleast one assured file. In some embodiments, authenticating anauthorized identity comprises authenticating a model (e.g., serial)number of a (e.g., single) manufacturing unit. In some embodiments,authenticating the identity comprises verifying the manufacturing unitto be any manufacturing unit that is controlled, owned, and/or operated,by a same legal (e.g., business) entity, the legal entity (e.g., in therelevant jurisdiction) being authorized for processing the at least oneassured file. In some embodiments, authenticating the identity comprisesverifying a pre-formation application that accesses the at least oneassured file to be any pre-formation application that is of a same (i)type, or (ii) version, or (iii) that is developed by an (e.g.,development) entity that is authorized for processing the at least oneassured file. In some embodiments, authenticating the identity comprisesverifying a pre-formation application that accesses the at least oneassured file to be any pre-formation application that is (i) owned, (ii)controlled, and/or (iii) operated, by a same legal (e.g., business)entity, the legal entity being authorized for processing the at leastone assured file. In some embodiments, assuring the at least one file isperformed by a pre-formation application. In some embodiments, thepre-formation application comprises (i) at least one stage or (ii) atleast one module, and wherein an operation is performed during: the (I)at least one stage, and/or (II) at least one module, for assuring thefirst file. In some embodiments, the at least one module performsoperations associated with: (A) a requested three-dimensional objectmodel, (B) a region of interest designation in the requestedthree-dimensional object model, (C) an estimation of a likelihood offormation failure of the requested three-dimensional object model, (D) asimulation of forming the requested three-dimensional object model,and/or (E) processing instructions for the manufacturing unit to formthe requested three-dimensional object model, wherein the requestedthree-dimensional object model is associated with a three-dimensionalobject of the at least one three-dimensional object. In someembodiments, assuring the first file is performed prior to or during:(a) a first stage to a second stage, and/or (b) a first module to asecond module, of the pre-formation application. In some embodiments,assuring the first file is performed prior to or during: (a) atransmission from a first stage to a second stage, and/or (b) atransmission from a first module to a second module, of thepre-formation application. In some embodiments, assuring the first fileis according to an assurance scheme, wherein the assurance schemecomprises implementing: (I) an encryption scheme, (II) a validationscheme, or (III) an integrity verification scheme. In some embodiments,implementing the encryption scheme comprises implementing: (a) asymmetric encryption scheme or (b) an asymmetric encryption scheme. Insome embodiments, implementing the encryption scheme comprisesimplementing a first assurance scheme for the first stage and a secondassurance scheme for the second stage. In some embodiments, the firstassurance scheme and the second assurance scheme are different. In someembodiments, implementing the encryption scheme comprises implementing asame assurance scheme for the first module and the second module. Insome embodiments, the assurance scheme is associated with a given stageand/or a given module. In some embodiments, the assurance scheme isassociated with operations performed in a given stage and/or a givenmodule. In some embodiments, assuring the first file comprisesimplementing at least two security level s. In some embodiments,implementing the at least two security levels comprises implementing afirst security level in a first stage and/or a first module, andimplementing a second security level in a second stage and/or a secondmodule. In some embodiments, implementing the at least two securitylevels comprises performing operations of the first stage and/or of thefirst module prior to performing operations of the second stage and/orof the second module. In some embodiments, assuring the first filecomprises implementing a first security level for a first portion of theat least one assured file, and implementing a second security level fora second portion of the at least one assured file. In some embodiments,the at least one assured file comprises a first assured file and asecond assured file, wherein assuring the first file comprisesimplementing a first security level for the first assured file, andimplementing a second security level for the second assured file. Insome embodiments, the method further comprises storing the first assuredfile and the second assured file in an archive. In some embodiments,assuring the first file increases a (e.g., file) size and/or complexityof the at least one assured file, which increase is as compared to thefirst file associated with the instructions that is not assured. In someembodiments, the instructions comprise a specification of at least oneof a plurality of process parameters. In some embodiments, the pluralityof process parameters comprises one or more settings of themanufacturing unit. In some embodiments, the one or more settingscomprise (a) a voltage setpoint, (b) a current setpoint, (c) a (e.g.,activation) timing (e.g., duty cycle), or (d) a power (e.g., output), ofan apparatus of the manufacturing unit. In some embodiments, theplurality of process parameters comprises (i) a characteristic of atransforming agent, (ii) a characteristic of a transforming agentgenerator, (iii) or a metrology. In some embodiments, the plurality ofprocess parameters comprises (I) a position of a footprint of an energybeam at a target surface, (II) a power of an energy source thatgenerates the energy beam, (III) a power density of the energy beam,(IV) a fluence of the energy beam, or (V) a focus of the footprint ofthe energy beam at the target surface. In some embodiments, theinstructions comprise layout instructions for the manufacturing unit. Insome embodiments, the layout instructions comprise commands for themanufacturing unit to form at least the at least one three-dimensionalobject (i) according to a requested arrangement, (ii) according to aspecified sequence with which one or more transforming agents (e.g.,and/or generators thereof) of the manufacturing unit are operated, or(iii) to have a requested marking (e.g., label). The method of claim 48,wherein the requested arrangement comprises a location of the at leastone three-dimensional object within a build volume of the manufacturingunit.

In another aspect, a non-transitory computer-readable medium, comprises:machine-executable code that comprises commands according to any of themethods for processing the first file associated with instructions forforming at least one three-dimensional object as described herein (e.g.,the methods described above).

In another aspect, a non-transitory computer-readable medium comprisesmachine-executable code that, upon execution by one or more processors,implement any of the methods (e.g., the methods described above) forprocessing at least one file associated with instructions for forming atleast one three-dimensional object.

In another aspect, a computer-implemented method for processing at leastone file associated with instructions for forming at least onethree-dimensional object, comprises any of the methods (e.g., themethods described above).

In another aspect, a computer software product, comprises: anon-transitory computer-readable medium storing program instructionsthat comprise commands according to any of the methods for processingthe first file associated with instructions for forming at least onethree-dimensional object as described herein (e.g., the methodsdescribed above).

In another aspect, one or more computer-readable non-transitory storagemedia embodying software that comprises: commands according to any ofthe methods for processing the first file associated with instructionsfor forming at least one three-dimensional object as described herein(e.g., the methods described above).

In another aspect, a non-transitory computer-readable medium comprisesmachine-executable code that, upon execution by one or more processors,implement a method for processing a first file associated withinstructions for forming at least one three-dimensional object, themachine-executable code comprises commands for: providing the first fileassociated with the instructions for forming the at least onethree-dimensional object; assuring the first file to yield at least oneassured file usable by a manufacturing unit that is configured to formthe at least one three-dimensional object; and outputting the at leastone assured file for use by the manufacturing unit.

In another aspect, a system for forming at least one three-dimensionalobject, comprises: a target surface configured to support the at leastone three-dimensional object during formation; a transforming agentgenerator that is configured to generate a transforming agent thattransforms a pre-transformed material to a transformed material to format least a portion of the at least one three-dimensional object; and oneor more controllers that are operatively coupled with the transformingagent generator, wherein the one or more controllers are collectively orindividually configured to: (i) process at least one assured file toyield instructions for forming the at least one three-dimensionalobject; and (ii) using at least the instructions, direct thetransforming agent generator to generate the transforming agent thattransforms the pre-transformed material to the transformed material toform the at least the portion of the at least one three-dimensionalobject.

In some embodiments, to process the at least one assured file comprisesto receive the at least one assured file. In some embodiments, toprocess the at least one assured file comprises to read at least aportion of the at least one assured file. In some embodiments, the atleast one assured file comprises a file that is (i) encrypted, (ii)certified, (iii) validated, (iv) of a verified integrity, and/or (v)authenticated. In some embodiments, to process the at least one assuredfile comprises to decrypt at least a portion of at least one encryptedfile. In some embodiments, the system further comprises a data storageunit that comprises a decryption key, wherein the one or morecontrollers are operatively coupled with the data storage unit, whichone or more controllers are configured to use the decryption key todecrypt the at least the portion of the at least one encrypted file. Insome embodiments, the data storage unit comprises a computer memory, anon-transitory computer-readable medium, an electrical circuit, or asocket. In some embodiments, to process the at least one assured filecomprises to execute at least a portion of the at least one assuredfile. In some embodiments, usage of the instructions comprises executingthe instructions. In some embodiments, the target surface is configuredto indirectly or directly support the at least one three-dimensionalobject during formation. In some embodiments, the system furthercomprises at least one computer, wherein the one or more controllers areoperatively coupled with the at least one computer. In some embodiments,the one or more controllers are further configured to authenticate anidentity prior to (i) or (ii). In some embodiments, the identitycomprises an identity of an accessing party. In some embodiments, theidentity of the accessing party comprises data associated with a (i)manufacturing party, (ii) owning party, (iii) controlling party, and/or(iv) operating party, of the system. In some embodiments, the identityof the accessing party comprises data associated with a (I) developingparty, (II) owning party, (III) controlling party, and/or (IV) operatingparty, of a pre-formation application that processes the at least oneassured file. In some embodiments, the identity is associated withand/or embedded in the at least one assured file. In some embodiments,the at least one assured file comprises a representation of theidentity. In some embodiments, the system further comprises a computermemory device that stores the representation of the identity, whereinthe one or more controllers are operatively coupled with the computermemory device, and wherein the one or more controllers are configured touse the representation of the identity to authenticate the identity. Insome embodiments, to authenticate the identity comprises to verify therepresentation of the identity to be of a same manufacture, type, and/ormodel, of an (e.g., manufacturing) entity that is authorized to processthe at least one assured file. In some embodiments, an authorizedidentity comprises a model (e.g., serial) number. In some embodiments,to authenticate the identity comprises to verify the representation ofthe identity to be of any manufacturing unit that is controlled, owned,and/or operated, by a same legal (e.g., business) entity, which legalentity (e.g., in the relevant jurisdiction) is authorized to process theat least one assured file. In some embodiments, to authenticate theidentity comprises to verify a pre-formation application that accessesthe at least one assured file to be any pre-formation application thatis of a same (i) type of, or (ii) version of, or (iii) that is developedby, a (e.g., development) entity that is authorized to process the atleast one assured file. In some embodiments, the authenticating theidentity comprises verifying a pre-formation application that accessesthe at least one assured file to be any pre-formation application thatis (i) owned, (ii) controlled, and/or (iii) operated, by a same legal(e.g., business) entity, the legal entity being authorized forprocessing the at least one assured file. In some embodiments, at leasta portion of the at least one assured file is generated by apre-formation application. In some embodiments, the system furthercomprises a non-transitory computer-readable medium operatively coupledwith the one or more controllers, which non-transitory computer-readablemedium is processing: (i) at least one stage and/or (ii) at least onemodule, of the pre-formation application, and wherein the non-transitorycomputer-readable medium generates the at least the portion of the atleast one assured file. In some embodiments, the system furthercomprises a computer system that is operatively coupled with the one ormore controllers, wherein the computer system comprises thenon-transitory computer-readable medium. In some embodiments, thecomputer system comprises one or more processors, the one or moreprocessors configured to perform at least one operation of the at leastone stage or the at least one module. In some embodiments, the computersystem is operatively coupled with the one or more controllers by acommunication component. In some embodiments, the communicationcomponent is configured to communicate by a wired or a wirelessconnection. In some embodiments, the wired communication comprisesoptical fiber, or electrical wire. In some embodiments, the computersystem is configured to communicate locally or over a network. In someembodiments, the at least one assured file comprises an assurancescheme, wherein the assurance scheme comprises (I) an encryption scheme,(II) a validation scheme, or (III) an integrity verification scheme. Insome embodiments, the encryption scheme comprises a symmetric encryptionscheme, or an asymmetric encryption scheme. In some embodiments, theencryption scheme comprises at least two security level s. In someembodiments, a first security level is implemented for a first portionof the at least one assured file, and a second security level isimplemented for a second portion of the at least one assured file. Insome embodiments, a first security level is implemented for a firstencrypted file, and a second security level is implemented for a secondencrypted file. In some embodiments, the system further comprises anarchive, wherein the archive comprises the first encrypted file and thesecond encrypted file. In some embodiments, the instructions comprise aspecification of at least one of a plurality of process parameters. Insome embodiments, the plurality of process parameters comprises one ormore system settings. In some embodiments, the one or more systemsettings comprise at least one characteristic of the (i) transformingagent and/or (ii) transforming agent generator. In some embodiments, thesystem further comprises a guidance system that is coupled with thetransforming agent generator, wherein the guidance system is configuredto direct the transforming agent toward the target surface, wherein theone or more controllers are operatively coupled with the guidancesystem, which one or more controllers are configured to direct theguidance system to move the generated transforming agent along a path.In some embodiments, the one or more system settings comprise (a) avoltage setpoint, (b) a current setpoint, (c) a (e.g., activation)timing (e.g., duty cycle), or (d) a power (e.g., output), of thetransforming agent generator and/or the guidance system. In someembodiments, the plurality of process parameters comprises (I) a motioncommand of a guidance element (e.g., a scanner) of the guidance system,or (II) a power profile of a transforming agent generator. In someembodiments, the transforming agent is an energy beam, and wherein theplurality of process parameters comprises (I) a position of a footprintof an energy beam at a target surface, (II) a power of an energy sourcethat generates the energy beam, (III) a power density of the energybeam, (IV) a fluence of the energy beam, or (V) a focus of the footprintof the energy beam at the target surface. In some embodiments, theinstructions comprise layout instructions associated with the targetsurface. In some embodiments, the layout instructions comprise commandsto form the at least one three-dimensional object (i) according to arequested arrangement, (ii) according to a specified sequence with whichone or more transforming agents (e.g., and/or generators thereof) areoperated, or (iii) to have a requested marking (e.g., label). In someembodiments, the requested arrangement comprises a location of the atleast one three-dimensional object within a build volume of themanufacturing unit.

In another aspect, a method for forming at least one three-dimensionalobject, comprises: providing at least one assured file associated withinstructions for forming the at least one three-dimensional object;computer processing the at least one assured file to yield theinstructions in a computer memory; and using at least the instructionsfrom the computer memory to form the at least one three-dimensionalobject.

In some embodiments, computer processing the at least one assured filecomprises receiving the at least one assured file. In some embodiments,computer processing the at least one assured file comprises reading atleast a portion of the at least one assured file. In some embodiments,the at least one assured file comprises a file that is: (i) encrypted,(ii) certified, (iii) validated, (iv) of a verified integrity, and/or(v) authenticated. In some embodiments, the at least one assured filecomprises at least one encrypted file, and wherein computer processingthe at least one assured file comprises decrypting at least a portion ofthe at least one encrypted file. In some embodiments, wherein computerprocessing comprises using a decryption key for decrypting the at leastthe portion of the at least one encrypted file. In some embodiments,computer processing the at least one assured file comprises executing atleast a portion of the at least one assured file. In some embodiments,using the instructions comprises executing the instructions. In someembodiments, the method further comprises authenticating an identityprior to using the instructions to form the at least onethree-dimensional object. In some embodiments, authenticating theidentity comprises authenticating the identity of an accessing party. Insome embodiments, authenticating the identity of the accessing partycomprises authenticating data associated with a (i) manufacturing party,(ii) owning party, (iii) controlling party, or (iv) operating party, ofa manufacturing unit that is configured to form the at least onethree-dimensional object. In some embodiments, the method furthercomprises a pre-formation application that accesses the at least oneassured file, wherein authenticating the identity of the accessing partycomprises authenticating data associated with a (I) developing party,(II) owning party, (III) controlling party, or (IV) operating party, ofthe pre-formation application. In some embodiments, authenticating theidentity authenticating data is associated with and/or embedded in theat least one assured file. In some embodiments, the at least one assuredfile comprises a representation of the identity. In some embodiments,the method further comprises storing the representation of the identityin a computer memory device. In some embodiments, authenticating theidentity comprises verifying the manufacturing unit to be of a samemanufacture, type, and/or model, of an (e.g., manufacturing) entity thatis authorized for processing the at least one assured file. In someembodiments, authenticating an authorized identity comprises verifying amodel (e.g., serial) number of a (e.g., single) manufacturing unit. Insome embodiments, authenticating the identity comprises verifying themanufacturing unit to be any manufacturing unit that is controlled,owned, and/or operated, by a same legal (e.g., business) entity, thelegal entity (e.g., in the relevant jurisdiction) being authorized forprocessing the at least one assured file. In some embodiments,authenticating the identity comprises verifying a pre-formationapplication that accesses the at least one assured file to be anypre-formation application that is of a same (i) type, or (ii) version,or (iii) that is developed by an (e.g., development) entity that isauthorized for processing the at least one assured file. In someembodiments, authenticating the identity comprises verifying apre-formation application that accesses the at least one assured file tobe any pre-formation application that is (i) owned, (ii) controlled,and/or (iii) operated, by a same legal (e.g., business) entity, thelegal entity being authorized for processing the at least one assuredfile. In some embodiments, providing the at least one assured filecomprises (i) receiving the at least one assured file or (ii) generatingthe at least one assured file. In some embodiments, providing the atleast one assured file comprises storing the at least one assured filein the computer memory or in another computer memory. In someembodiments, providing the at least one assured file comprisestransmitting the at least one assured file to a manufacturing unit thatis configured to form the at least one three-dimensional object. In someembodiments, computer processing the instructions is by themanufacturing unit to form the at least one three-dimensional object. Insome embodiments, computer processing the instructions comprisesexecuting the instructions. In some embodiments, the manufacturing unitcomprises a manufacturing device or a manufacturing system. In someembodiments, the manufacturing unit comprises a three-dimensionalprinter. In some embodiments, the manufacturing unit comprises at leastone computer operatively coupled with the manufacturing device and/orwith the manufacturing system. In some embodiments, the at least oneassured file is generated by a pre-formation application. In someembodiments, the pre-formation application comprises (i) at least onestage or (ii) at least one module, and wherein the at least one assuredfile is generated during an operation of the (I) at least one stage,and/or (II) at least one module. In some embodiments, the at least oneassured file further comprises an assurance scheme, wherein theassurance scheme comprises (I) an encryption scheme, (II) a validationscheme, or (III) an integrity verification scheme. In some embodiments,the encryption scheme comprises a symmetric encryption scheme or anasymmetric encryption scheme. In some embodiments, the at least oneassured file comprises at least two security level s. In someembodiments, a first security level is implemented for a first portionof the at least one assured file, and a second security level isimplemented for a second portion of the at least one assured file. Insome embodiments, the at least one assured file further comprises afirst assured file and a second assured file, wherein a first securitylevel is implemented for the first assured file, and a second securitylevel is implemented for the second assured file. In some embodiments,the method further comprises an archive, wherein the archive comprisesthe first assured file and the second assured file. In some embodiments,the instructions comprise a specification of at least one of a pluralityof process parameters. In some embodiments, the plurality of processparameters comprises one or more settings of a manufacturing unit thatcomputer processes the instructions to form the at least onethree-dimensional object. In some embodiments, one or more settingscomprise at least one characteristic of a (i) transforming agent and/or(ii) a transforming agent generator, of the manufacturing unit. In someembodiments, the plurality of process parameters comprises (i) acharacteristic of the transforming agent, (ii) a characteristic of thetransforming agent generator, (iii) or a metrology. In some embodiments,the transforming agent is an energy beam, and wherein the plurality ofprocess parameters comprises (I) a position of a footprint of the energybeam at a target surface, (II) a power of an energy source thatgenerates the energy beam, (III) a power density of the energy beam,(IV) a fluence of the energy beam, or (V) a focus of the footprint ofthe energy beam at the target surface. In some embodiments, the one ormore settings of the manufacturing unit comprise (a) a voltage setpoint,(b) a current setpoint, (c) a (e.g., activation) timing (e.g., dutycycle), or (d) a power (e.g., output), of an apparatus of themanufacturing unit. In some embodiments, the instructions compriselayout instructions, the method further comprises computer processingthe layout instructions by the manufacturing unit to form the at leastone three-dimensional object. In some embodiments, the layoutinstructions comprise commands causing the manufacturing unit to form atleast the at least one three-dimensional object (i) according to arequested arrangement, (ii) according to a specified sequence with whichone or more transforming agents (e.g., and/or generators thereof) of themanufacturing unit are operated, or (iii) to have a requested marking(e.g., label). In some embodiments, the requested arrangement comprisesa location of the at least one three-dimensional object within a buildvolume of the manufacturing unit.

In another aspect, a non-transitory computer-readable medium, comprises:machine-executable code that comprises commands according to any of themethods described herein (e.g., the method described above) for formingat least one three-dimensional object.

In another aspect, a non-transitory computer-readable medium comprisesmachine-executable code that, upon execution by one or more processors,implement any of the methods (e.g., the methods described above) forprocessing at least one file associated with instructions for forming atleast one three-dimensional object.

In another aspect, a computer-implemented method for processing at leastone file associated with instructions for forming at least onethree-dimensional object, comprises any of the methods (e.g., themethods described above).

In another aspect, a computer software product, comprises: anon-transitory computer-readable medium storing program instructionsthat comprise commands according to any of the methods described herein(e.g., the methods described above) for forming at least onethree-dimensional object.

In another aspect, one or more computer-readable non-transitory storagemedia embodying software that comprises: commands according to any ofthe methods described herein (e.g., the methods described above) forforming at least one three-dimensional object.

In another aspect, a non-transitory computer-readable medium comprisesmachine-executable code that, upon execution by one or more processors,implement a method for forming at least one three-dimensional object,the machine-executable code comprises commands for: providing at leastone assured file associated with instructions for forming the at leastone three-dimensional object; computer processing the at least oneassured file to yield the instructions in a computer memory; and usingat least the instructions from the computer memory to form the at leastone three-dimensional object.

Another aspect of the present disclosure provides a method that utilizesa system (and/or any component thereof) disclosed herein

Another aspect of the present disclosure provides a method that utilizesan apparatus (and/or any component thereof) disclosed herein.

Another aspect of the present disclosure provides a method that utilizesan apparatus comprising a controller. In some embodiments, the methodeffectuates one or more operations of the controller. For example, themethod may include one or more operations directed by the controller.For example, the method may include controlling one or more apparatuses,systems, and/or components thereof that are controlled by thecontroller, e.g., in a manner directed by the controller.

Another aspect of the present disclosure provides a method that utilizesa computer system comprising one or more computer processors and atleast one non-transitory computer-readable medium coupled thereto. Insome embodiments, the method effectuates one or more operations by theone or more computer processors. For example, the method may includeoperations executed by the one or more computer processors. For example,the method may include one or more operations that are embodied asmachine-executable code that is stored by the non-transitorycomputer-readable medium. For example, the method may includecontrolling operations of the computer system upon execution of themachine-executable code, e.g., by the one or more computer processors.

Another aspect of the present disclosure provides a method that utilizesat least one non-transitory computer-readable medium comprisingmachine-executable code. In some embodiments, the method effectuates oneor more operations by one or more computer processors. For example, themethod may include operations executed by the one or more computerprocessors. For example, the method may include controlling operationsof the one or more computer processors upon execution of themachine-executable code, e.g., that is stored by the at least onenon-transitory computer-readable medium.

Another aspect of the present disclosure provides a system foreffectuating the methods disclosed herein.

Another aspect of the present disclosure provides an apparatus foreffectuating the methods disclosed herein.

Another aspect of the present disclosure provides an apparatuscomprising a controller that directs effectuating one or more operationsin the method disclosed herein, wherein the controller is operativelycoupled to the apparatuses, systems, and/or mechanisms that it controlsto effectuate the method.

Another aspect of the present disclosure provides a computer systemcomprising one or more computer processors and a non-transitorycomputer-readable medium coupled thereto. The non-transitorycomputer-readable medium comprises machine-executable code that, uponexecution by the one or more computer processors, implements any of themethods above or elsewhere herein.

Another aspect of the present disclosure provides an apparatus forprinting one or more 3D objects comprises a controller that isprogrammed to direct a mechanism used in a 3D printing methodology toimplement (e.g., effectuate) any of the method disclosed herein, whereinthe controller is operatively coupled to the mechanism.

Another aspect of the present disclosure provides a computer softwareproduct, comprising a non-transitory computer-readable medium in whichprogram instructions are stored, which instructions, when read by acomputer, cause the computer to direct a mechanism used in the 3Dprinting process to implement (e.g., effectuate) any of the methoddisclosed herein, wherein the non-transitory computer-readable medium isoperatively coupled to the mechanism.

Another aspect of the present disclosure provides a non-transitorycomputer-readable medium comprising machine-executable code that, uponexecution by one or more computer processors, implements any of themethods disclosed herein.

Additional aspects and advantages of the present disclosure will becomereadily apparent to those skilled in this art from the followingdetailed description, wherein only illustrative embodiments of thepresent disclosure are shown and described. As will be realized, thepresent disclosure is capable of other and different embodiments, andits several details are capable of modifications in various obviousrespects, all without departing from the disclosure. Accordingly, thedrawings and description are to be regarded as illustrative in nature,and not as restrictive.

INCORPORATION BY REFERENCE

All publications, patents, and patent applications mentioned in thisspecification are herein incorporated by reference to the same extent asif each individual publication, patent, or patent application wasspecifically and individually indicated to be incorporated by reference.

BRIEF DESCRIPTION OF DRAWINGS

The novel features of the invention are set forth with particularity inthe appended claims. A better understanding of the features andadvantages of the present invention will be obtained by reference to thefollowing detailed description that sets forth illustrative embodiments,in which the principles of the invention are utilized, and theaccompanying drawings or figures (also “Fig.,” Figs.,” “FIG.” or “FIGs.”herein), of which:

FIG. 1 shows a schematic cross-sectional view of a three-dimensional(3D) printing system and its components;

FIG. 2A depicts a 3D object; and FIG. 2B depicts various 3D objects in avirtual environment;

FIG. 3 illustrates a flowchart;

FIG. 4 illustrates a flowchart;

FIG. 5 illustrates a flowchart;

FIG. 6 schematically illustrates an architecture that facilitatesformation of one or more 3D objects;

FIG. 7 schematically illustrates an architecture that facilitatesformation of one or more 3D objects;

FIG. 8A schematically illustrates an optical setup; FIG. 8Bschematically illustrates an energy beam; and FIG. 8C schematicallyillustrates a control scheme;

FIG. 9 schematically illustrates a cross section in various layeringplanes;

FIG. 10A shows a cross sectional view of a 3D object with a supportmember; and

FIG. 10B schematically a horizontal view of a 3D object;

FIG. 11A schematically illustrates a cross section of a 3D object; FIG.11B schematically illustrates an example of a 3D plane; and FIG. 11Cschematically illustrates a cross section in portion of a 3D object;

FIG. 12 shows schematics of various vertical cross sectional views ofdifferent 3D objects, and a guiding circle;

FIG. 13 schematically illustrates a computer system; and

FIG. 14 schematically illustrates a computer system.

The figures and components therein may not be drawn to scale. Variouscomponents of the figures described herein may not be drawn to scale.

DETAILED DESCRIPTION

While various embodiments of the invention have been shown, anddescribed herein, it will be obvious to those skilled in the art thatsuch embodiments are provided by way of example only. Numerousvariations, changes, and substitutions may occur to those skilled in theart without departing from the invention. It should be understood thatvarious alternatives to the embodiments of the invention describedherein might be employed.

The present disclosure provides apparatuses, systems and methods forproviding security (such as, e.g., data security), certification,validation, integrity, and/or authentication in the formation of 3Dobjects. In some embodiments, the apparatuses, systems and methodsenable implementation of data assurance to (e.g., at least a portion of)instructions data for forming at least a portion of a 3D object (e.g., arequested 3D object). Data assurance may comprise (i) security, (ii)certification, (iii) validation, (iv) integrity, or (v) authentication.Data security (e.g., a security level) may comprise encryption and/orerror verification (e.g., detection). Data security may comprisecryptography. Implementation of such data assurance (e.g., measure) ofthe present disclosure may increase a complexity of a file (e.g.,electronic file) as compared to a file devoid of such implementation ofdata assurance. The file may be readable by a computer media. The filemay be an electronic file. The file may be related to the instructionsdata for forming a requested 3D object. Implementation of data assurance(e.g., measure) may increase a processing requirement (e.g., number ofcomputing cycles) for accessing and/or modifying a file, e.g., that isrelated to the instructions data for forming a requested 3D object. Theinstructions data may be generated in a pre-formation (e.g., virtual)environment. A pre-formation environment may comprise an application(e.g., in the form of a non-transitory computer readable media). Apre-formation environment may comprise one or more stages (e.g., one ormore phases, branches, or divisions). In some embodiments, at least one(e.g., any) of the stages (e.g., phases, branches, or divisions)comprises one or more modules (e.g., software modules). A module mayreceive, process, and/or generate data related to formation of therequested 3D object. The data assurance may be implemented by apre-formation environment and/or a manufacturing device. The dataassurance (e.g., security) may be implemented (e.g., provided) during atransfer from: at least one processor, stage, and/or module; to another.In some embodiments, at least one processor, stage, module, and/ormanufacturing device, is operable to read (e.g., and decrypt) at least aportion of a secured (e.g., encrypted) file that is related to theinstructions data for forming a requested 3D object.

In some embodiments, a file used in a module, a stage, and/or forforming the 3D object, may be part of a file architecture and/ornetwork. The file may be part of a blockchain. The file may comprise ablockchain. The blockchain may include one or more (e.g., software)blocks. The blockchain may include one or more forks. At least twoblocks in the blockchain may be linked. The linkage may utilizeencryption at least in part. The linkage may comprise cryptography(e.g., comprising a cryptographic hash). The file and/or block maycomprise a timestamp, cryptography, a transaction data, or anycombination thereof. The cryptography may comprise a cryptographic hashfunction. The cryptography may comprise a function, a character, or astring. The cryptography may comprise a password or a username. Thecryptographic string may be a hash value, message digest, digitalfingerprint, and/or checksum. The function may be a one-way function.The cryptography may comprise a cyclic redundancy check, anon-cryptographic hash function, a universal hash function, a keyedcryptographic hash function, or unkeyed cryptographic hash function.

Terms such as “a,” “an,” and “the” are not intended to refer to only asingular entity, but may include the general class of which a specificexample may be used for illustration. The terminology herein is used todescribe specific embodiments of the invention, but their usage does notdelimit the invention.

When ranges are mentioned, the ranges are meant to be inclusive, unlessotherwise specified. For example, a range between value 1 and value 2 ismeant to be inclusive and include value 1 and value 2. The inclusiverange will span any value from about value 1 to about value 2.

The term “between” as used herein is meant to be inclusive unlessotherwise specified. For example, between X and Y is understood hereinto mean from X to Y.

The term “adjacent” or “adjacent to,” as used herein, includes ‘nextto’, ‘adjoining’, ‘in contact with,’ and ‘in proximity to.’ In someinstances, adjacent to may be ‘above’ or ‘below.’

The term “operatively coupled” or “operatively connected” refers to afirst mechanism that is coupled (or connected) to a second mechanism toallow the intended operation of the second and/or first mechanism,including a first mechanism that is in signal communication with asecond mechanism. The term “configured to” refers to an object orapparatus that is (e.g., structurally) configured to bring about anintended result.

Fundamental length scale (abbreviated herein as “FLS”) can refer to anysuitable scale (e.g., dimension) of an object. For example, a FLS of anobject may comprise a length, a width, a height, a diameter, a sphericalequivalent diameter, or a diameter of a bounding sphere.

A “global vector” may be (a) a (e.g., local) gravitational field vector,(b) a vector in a direction opposite to the direction of a layerwise 3Dobject formation, and/or (c) a vector normal to a surface of a platformthat supports the 3D object, in a direction opposite to the 3D object.

The phrase “a three-dimensional object” as used herein may refer to “oneor more three-dimensional objects,” as applicable.

“Real time” as understood herein may be during at least a portion of theforming (e.g., printing) of a 3D object. Real time may be during a printoperation. Real time may be during a formation (e.g., print) cycle. Realtime may comprise during formation of: a 3D object, a layer of hardenedmaterial as a portion of the 3D object, a hatch line, a single-digitnumber of melt pools, or a melt pool.

The phrase “is/are structured,” or “is/are configured,” when modifyingan article, refers to a structure of the article that is able to bringabout the enumerated result.

The phrase “a target surface” may refer to (1) a surface of a buildplane (e.g., an exposed surface of a material bed), (2) an exposedsurface of a platform, (3) an exposed surface of a 3D object (or aportion thereof), (4) any exposed surface adjacent to an exposed surfaceof the material bed, platform, or 3D object, and/or (5) any targetedsurface. Targeted may be by at least one energy beam.

At times, conceptualization of a 3D object (e.g., design) begins with arendering. The rendering may comprise a drawing and/or a geometricmodel. The geometric model may be a corporeal (e.g., real-world) model,and/or a virtual (e.g., software) model. The model may comprise at leastone geometry and/or topology of the 3D object. The 3D object may beformed by one or more manufacturing processes. The one or moremanufacturing processes may be controlled (e.g., manually and/orautomatically). In some embodiments, a manufacturing process comprises aplurality of forming instructions that specify (e.g., a sequence of)operations to generate a (e.g., requested) 3D object. The forminginstructions may command at least one apparatus of a manufacturingdevice in the formation of the requested 3D object. The forminginstructions may be embodied in software and/or firmware. At times, apre-formation application (e.g., stored on a non-transitorycomputer-readable medium) generates forming instructions data forforming at least one requested 3D object. The forming instructions maybe generated while considering the requested 3D object (e.g., geometricmodel). The manufacturing device, when supplied with starting materialsand upon execution of the forming instructions, may generate (e.g., aphysical, real world manifestation of) the requested 3D object.

Three-dimensional printing (also “3D printing”) generally refers to aprocess for generating a 3D object. The apparatuses, methods,controllers, and/or software described herein pertaining to generating(e.g., forming, or printing) a 3D object, pertain also to generating oneor more 3D objects. For example, 3D printing may refer to sequentialaddition of material layers or joining of material layers (or parts ofmaterial layers) to form a 3D structure, in a controlled manner. Thecontrolled manner may comprise manual or automated control. In the 3Dprinting process, the deposited material can be transformed (e.g.,fused, sintered, melted, bound, or otherwise connected) to subsequentlyharden and/or form at least a portion of the 3D object. Fusing (e.g.,sintering or melting) binding, or otherwise connecting the material iscollectively referred to herein as transforming a pre-transformedmaterial (e.g., powder material) into a transformed material. Fusing thematerial may include melting or sintering the material. Binding cancomprise chemical bonding. Chemical bonding can comprise covalentbonding. Examples of 3D printing may include additive printing (e.g.,layer by layer printing, or additive manufacturing). 3D printing mayinclude layered manufacturing. 3D printing may include rapidprototyping. 3D printing may include solid freeform fabrication. The 3Dprinting may further comprise subtractive printing.

3D printing methodologies can comprise extrusion, wire, granular,laminated, light polymerization, or powder bed and inkjet head 3Dprinting. Extrusion 3D printing can comprise robo-casting, fuseddeposition modeling (FDM) or fused filament fabrication (FFF). Wire 3Dprinting can comprise electron beam freeform fabrication (EBF3).Granular 3D printing can comprise direct metal laser sintering (DMLS),electron beam melting (EBM), selective laser melting (SLM), selectiveheat sintering (SHS), or selective laser sintering (SLS). Powder bed andinkjet head 3D printing can comprise plaster-based 3D printing (PP).Laminated 3D printing can comprise laminated object manufacturing (LOM).Light polymerized 3D printing can comprise stereo-lithography (SLA),digital light processing (DLP), or laminated object manufacturing (LOM).3D printing methodologies can comprise Direct Material Deposition (DMD).The Direct Material Deposition may comprise, Laser Metal Deposition(LMD, also known as, Laser deposition welding). 3D printingmethodologies can comprise powder feed, or wire deposition. 3D printingmethodologies may comprise a binder that binds pre-transformed material(e.g., binding a powder). The binder may remain in the 3D object, or maybe (e.g., substantially) absent from the 3D printing (e.g., due toheating, extracting, evaporating, and/or burning). 3D printingmethodologies may differ from methods traditionally used insemiconductor device fabrication (e.g., vapor deposition, etching,annealing, masking, or molecular beam epitaxy). In some instances, 3Dprinting may further comprise one or more printing methodologies thatare traditionally used in semiconductor device fabrication. 3D printingmethodologies can differ from vapor deposition methods such as chemicalvapor deposition, physical vapor deposition, or electrochemicaldeposition. In some instances, 3D printing may further include vapordeposition methods.

“Pre-transformed material,” as understood herein, is a material beforeit has been first transformed (e.g., once transformed) by an energy beamduring the 3D printing process. The pre-transformed material may be amaterial that was, or was not, transformed prior to its use in the 3Dprinting process. The pre-transformed material may be a material thatwas partially transformed prior to its use in the 3D printing process.The pre-transformed material may be a starting material for the 3Dprinting process. The pre-transformed material may be liquid, solid, orsemi-solid (e.g., gel). The pre-transformed material may be aparticulate material. The particulate material may be a powder material.The powder material may comprise solid particles of material. Theparticulate material may comprise vesicles (e.g., containing liquid orsemi-solid material). The particulate material may comprise solid orsemi-solid material particles.

The FLS of the formed (e.g., printed) 3D object can be at least about 50micrometers (μm), 80 μm, 100 μm, 120 μm, 150 μm, 170 μm, 200 μm, 230 μm,250 μm, 270 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 1millimeter (mm), 1.5 mm, 2 mm, 5 mm, 1 centimeter (cm), 1.5 cm, 2 cm, 10cm, 20 cm, 30 cm, 40 cm, 50 cm, 60 cm, 70 cm, 80 cm, 90 cm, 1 m, 2 m, 3m, 4 m, 5 m, 50 m, 80 m, 100 m or 1000 m. In some cases, the FLS of theprinted 3D object may be between any of the afore-mentioned FLSs (e.g.,from about 50 μm to about 1000 m, from about 120 μm to about 1000 m,from about 120 μm to about 10 m, from about 200 μm to about 1 m, or fromabout 150 μm to about 10 m).

In some instances, it is desired to control the manner in which at leasta portion of a layer of hardened material is formed. The layer ofhardened material may comprise a plurality of melt pools. In someinstances, it may be desired to control one or more characteristics ofthe melt pools that form the layer of hardened material. Thecharacteristics may comprise a depth of a melt pool, a microstructure,or the repertoire of microstructures of the melt pool. Themicrostructure of the melt pool may comprise the grain (e.g.,crystalline and/or metallurgical) structure, or grain structurerepertoire that makes up the melt pool. The grain structure may bereferred to herein as microstructure.

In some embodiments, transforming comprises heating at least a portionof a target surface (e.g., exposed surface of a material bed), and/or apreviously formed area of hardened material using at least one energybeam. An energy source may generate the energy beam. The energy sourcemay be a radiative energy source. The energy source may be a dispersiveenergy source (e.g., a fiber laser). The energy source may generate asubstantially uniform (e.g., homogenous) energy stream. The energysource may comprise a cross section (e.g., or a footprint) having a(e.g., substantially) homogenous fluence. The energy beam may have aspot size (e.g., footprint or cross-section) on a target surface. Thespot size may have a FLS. The energy generated for transforming aportion of material (e.g., pre-transformed or transformed) by the energysource will be referred herein as the “energy beam.” The energy beam mayheat a portion of a 3D object (e.g., an exposed surface of the 3Dobject). The energy beam may heat a portion of the target surface (e.g.,an exposed surface of the material bed, and/or a deeper portion of thematerial bed that is not exposed). A pre-transformed material may bedirected to the target surface. The energy beam may heat apre-transformed material on its way to the target surface. The targetsurface may comprise a pre-transformed material, a partially transformedmaterial and/or a transformed material. The target surface may comprisea portion of the build platform, for example, a base (e.g., FIG. 1, 102). The target surface may comprise a (surface) portion of a 3D object.Heating by the energy beam may be substantially uniform across itsfootprint, e.g., on the target surface. In some embodiments, the energybeam takes the form of an energy stream emitted toward the targetsurface, e.g., in a step and repeat sequence (e.g., tiling sequence). Inat least a portion of its trajectory with respect to the target surface,the energy beam may advance: continuously, in a pulsing sequence, or ina step-and repeat sequence. The energy source may comprise an array ofenergy sources, e.g., a light emitting diode (LED) array.

In some embodiments, the methods, systems, apparatuses, and/or softwaredisclosed herein comprises controlling at least one characteristic ofthe layer of hardened material (or a portion thereof) that is at least aportion of the 3D object. The methods, systems, apparatuses, and/orsoftware disclosed herein may comprise controlling the degree and/ormanner of 3D object deformation. Control of 3D object deformation maycomprise control of a direction and/or a magnitude of deformation. Thecontrol may be for at least a portion (e.g., all) of the 3D object. Thecontrol may be an in-situ and/or real-time control. The control maytranspire during formation of the at least a portion of the 3D object.The control may comprise a closed loop or an open loop control scheme.The portion may be a surface, a melt pool, a plurality of melt pools, alayer, plurality (e.g., multiplicity) of layers, portion of a layer,and/or portion of a multiplicity of layers. The plurality of melt poolsand/or layers may be of single digit or double digit. The layer ofhardened material of the 3D object may comprise a plurality of meltpools. The layers' characteristics may comprise planarity, curvature, orradius of curvature of the layer (or a portion thereof). Thecharacteristics may comprise the thickness of the layer (or a portionthereof). The characteristics may comprise the smoothness (e.g.,planarity) of the layer (or a portion thereof).

In some embodiments, a 3D forming (e.g., printing, or print) cyclerefers to printing one or more 3D objects in a 3D printer, e.g., usingone printing instruction batch. A 3D printing cycle may include printingone or more 3D objects above a (single) platform and/or in a materialbed. A 3D printing cycle may include printing all layers of one or more3D objects in a 3D printer. On the completion of a 3D printing cycle,the one or more objects may be removed from the 3D printer (e.g., bysealing and/or removing the build module from the printer) in a removaloperation (e.g., simultaneously). During a printing cycle, the one ormore objects may be printed in the same material bed, above the sameplatform, with the same printing system, at the same time span, usingthe same forming (e.g., printing) instructions, or any combinationthereof. A print cycle may comprise printing the one or more objectslayer-wise (e.g., layer-by-layer). A layer may have a layer height. Alayer height may correspond to a height of (e.g., distance between) anexposed surface of a (e.g., newly) formed layer with respect to a (e.g.,top) surface of a prior-formed layer. In some embodiments, the layerheight is (e.g., substantially) the same for each layer of a print cycle(e.g., within a material bed). In some embodiments, at least two layersof a print cycle within a material bed have different layer heights. Aprinting cycle may comprise a collection (e.g., sum) of printoperations. A print operation may comprise a print increment (e.g.,deposition of a layer of pre-transformed material, and transformation ofa portion thereof to form at least a portion of the 3D object). Aforming (e.g., printing) cycle (also referred to herein as “buildcycle”) may comprise one or more forming (e.g., formation) laps. Aforming lap may comprise the process of forming a formed (e.g., printed)layer in a layerwise deposition to form the 3D object. The printing-lapmay be referred to herein as “build-lap” or “print-increment”. In someembodiments, a printing cycle comprises one or more printing laps. The3D printing lap may correspond with (i) depositing a (planar) layer ofpre-transformed material (e.g., as a portion of a material bed) above aplatform, and (ii) transforming at least a portion of thepre-transformed material (e.g., by a transforming agent such as at leastone energy beam) to form a layer of a 3D objects above the platform(e.g., in the material bed). The printing cycle may comprise a pluralityof laps to layerwise form the 3D object. The 3D printing cycle maycorrespond with (I) depositing a pre-transformed material toward aplatform, and (II) transforming at least a portion of thepre-transformed material (e.g., by a transforming agent such as at leastone energy beam) at or adjacent to the platform to form one or more 3Dobjects above the platform at the same time-window. An additionalsequential layer (or portion thereof) can be added to a previous layerof a 3D object by transforming (e.g., fusing and/or melting) a fractionof pre-transformed material that is introduced (e.g., as apre-transformed material stream) to the prior-formed layer oftransformed material. At times, the platform supports a plurality ofmaterial beds and/or a plurality of 3D objects. One or more 3D objectsmay be formed in a single material bed during a printing cycle (e.g.,having one or more print jobs). The transformation may connecttransformed material of a given layer (e.g., formed during a printinglap) to a previously formed 3D object portion (e.g., of a previousprinting lap). The transforming operation may comprise utilizing atransforming agent (e.g., an energy beam or a binder) to transform thepre-transformed (or re-transform the transformed) material. In someinstances, the transforming agent is utilized to transform at least aportion of the material bed (e.g., utilizing any of the methodsdescribed herein).

In some embodiments, at least one (e.g., each) energy source of the 3Dforming (e.g., printing) system is able to transform (e.g., print) at athroughput of at least about 6 cubic centimeters of material per hour(cc/hr), 12 cc/hr, 35 cc/hr, 50 cc/hr, 120 cc/hr, 480 cc/hr, 600 cc/hr,1000 cc/hr, or 2000 cc/hr. The at least one energy source may print atany rate within a range of the aforementioned values (e.g., from about 6cc/hr to about 2000 cc/hr, from about 6 cc/hr to about 120 cc/hr, orfrom about 120 cc/hr to about 2000 cc/hr).

In some embodiments, the transforming agent is dispensed through amaterial dispenser (e.g., binding dispenser). The dispenser may be anydispenser disclosed herein. The dispenser can be controlled (e.g.,manually and/or automatically). The automatic control may be using oneor more controllers that are operatively coupled to at least onecomponent of the dispenser. The control may be before, during, and/orafter the forming operation (e.g., printing). The dispenser may betranslated using an actuator. The translation of the dispenser canutilize a scanner (e.g., an XY-stage). In some embodiments, the at leastone 3D object is printed using a plurality of dispensers. In someembodiments, at least two dispensers dispense the same type of binder(e.g., comprising a binding agent). In some embodiments, at least twodispensers each dispense a different type of binder. In someembodiments, a binding agent is a polymer or resin. The binding agentcan be organic or inorganic. The binding agent can be carbon based orsilicon based.

In some embodiments, the energy source is movable such that it cantranslate across (e.g., laterally) the top surface of the material bed,e.g., during the printing. The energy beam(s) and/or energy source(s)can be moved via at least one guidance system. The guidance system maycomprise a scanner. The scanner may comprise a galvanometer scanner, amoving (e.g., rotating) polygon, a mechanical-stage (e.g., X-Y-stage), apiezoelectric device, a gimbal, or any combination of thereof. Thescanner may comprise a mirror. The scanner may comprise a modulator. Thescanner may comprise a polygonal mirror. The scanner can be the samescanner for two or more transforming agents or transforming agentgenerators (e.g., energy source or binder dispenser). At least two(e.g., each) transforming agents or transforming agent generators mayhave a separate scanner. At least two scanners may be operably coupledwith a single transforming agents or transforming agent generators. Thesystems and/or apparatuses disclosed herein may comprise one or moreshutters (e.g., safety shutters). The energy source(s) may projectenergy using a DLP modulator, a one-dimensional scanner, atwo-dimensional scanner, or any combination thereof. The transformingagent generator(s) can be stationary or translatable. The transformingagent generator(s) can translate vertically, horizontally, or in anangle (e.g., planar or compound angle).

A guidance system and/or an energy source may be controlled manuallyand/or by at least one controller. For example, at least two guidancesystems may be directed by the same controller. For example, at leastone guidance system may be directed by its own (e.g., unique)controller. A plurality of controllers may be operatively coupled toeach other, to the guidance system(s) (e.g., scanner(s)), and/or to theenergy source(s). At least two of a plurality of energy beams may bedirected towards the same position at the target surface, or todifferent positions at the target surface. The one or more guidancesystems may be positioned at an angle (e.g., tilted) with respect to thetarget surface. The one or more guidance systems may be positionedparallel to the target surface. One or more sensors may be disposedadjacent to the target surface. The one or more sensors may detect (i) aposition and/or (ii) an effect, of a transforming agent (e.g., at atarget surface). The at least one guidance system may direct a positionand/or a path of a transforming agent, considering a feedback from theone or more sensors. At least one of the one or more sensors may bedisposed in an indirect view of the target surface. At least one of theone or more sensors may be disposed in a direct view of the targetsurface (e.g., a camera viewing the target surface). The one or moresensors may be configured to have a field of view of at least a portionof the target surface (e.g., an exposed surface of the material bed).

At times, the energy source(s) are modulated. The energy (e.g., beam)emitted by the energy source can be modulated. The modulator cancomprise an amplitude modulator, a phase-modulator, or polarizationmodulator. The modulation may alter the intensity of the energy beam.The modulation may alter the current supplied to the energy source(e.g., direct modulation). The modulation may affect (e.g., alter) theenergy beam (e.g., external modulation such as external lightmodulator). The modulator can comprise an aucusto-optic modulator or anelectro-optic modulator. The modulator can comprise an absorptivemodulator or a refractive modulator. The modulation may alter theabsorption coefficient of the material that is used to modulate theenergy beam. The modulator may alter the refractive index of thematerial that is used to modulate the energy beam.

The scanner can be included in an optical system that is configured todirect energy from the energy source to a predetermined position on the(target) surface (e.g., exposed surface of the material bed). At leastone controller can be programmed to control a trajectory of the energysource(s) with the aid of the optical system. The controller canregulate a supply of energy from the energy source to thepre-transformed material (e.g., at the target surface) to form atransformed material. The optical system may be enclosed in an opticalenclosure. Examples of an optical enclosure and/or system can be foundin Patent Application serial number PCT/US17/64474, titled “OPTICS,DETECTORS, AND THREE-DIMENSIONAL PRINTING” that was filed Dec. 4, 2017,or in Patent Application serial number PCT/US18/12250, titled “OPTICS INTHREE-DIMENSIONAL PRINTING” that was filed Jan. 3, 2018, each of whichis incorporated herein by reference in its entirety.

The energy beam (e.g., transforming energy beam) may comprise a Gaussianenergy beam. The energy beam may have any cross-sectional shapecomprising an ellipse (e.g., circle), or a polygon. The energy beam mayhave a cross section (e.g., at an intersection of the energy beam on atarget surface) with a FLS of at least about 20 μm, 50 μm, 75 μm, 100μm, 150 μm, 200 μm or 250 μm, 0.3 millimeters (mm), 0.4 mm, 0.5 mm, 0.8mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm. Thecross section of the energy beam may be any value of the afore-mentionedvalues (e.g., from about 50 μm to about 250 μm, from about 50 μm toabout 150 μm, from about 150 μm to about 250 μm, from about 0.2 mm toabout 5 mm, from about 0.2 mm to about 2.5 mm, or from about 2.5 mm toabout 5 mm). The FLS may be measured at full width half maximumintensity of the energy beam. The FLS may be measured at 1/e² intensityof the energy beam. In some embodiments, the energy beam is a focusedenergy beam at the target surface. In some embodiments, the energy beamis a defocused energy beam at the target surface. The energy profile ofthe energy beam may be (e.g., substantially) uniform (e.g., in theenergy beam's cross-sectional area that impinges on the target surface).The energy profile of the energy beam may be (e.g., substantially)uniform during an exposure time (e.g., also referred to herein as adwell time). The exposure time (e.g., at the target surface) of theenergy beam may be at least about 0.1 milliseconds (ms), 0.5 ms, 1 ms,10 ms, 50 ms, 100 ms, 200 ms, 500 ms, 1000 ms, 2500 ms, or 5000 ms. Theexposure time may be between any of the above-mentioned exposure times(e.g., from about 0.1 ms to about 5000 ms, from about 0.1 ms to about1000 ms, or from about 1000 ms to about 5000 ms). In some embodiments,the energy beam is configured to be continuous or non-continuous (e.g.,pulsing). In some embodiments, at least one energy source can provide anenergy beam having an energy density of at least about 50 joules/cm²(J/cm²), 100 J/cm², 200 J/cm², 300 J/cm², 400 J/cm², 500 J/cm², 600J/cm², 700 J/cm², 800 J/cm², 1000 J/cm², 1500 J/cm², 2000 J/cm², 2500J/cm², 3000 J/cm², 3500 J/cm², 4000 J/cm², 4500 J/cm², or 5000 J/cm².The at least one energy source can provide an energy beam having anenergy density of at most about 50 J/cm², 100 J/cm², 200 J/cm², 300J/cm², 400 J/cm², 500 J/cm², 600 J/cm², 700 J/cm², 800 J/cm², 1000J/cm², 500 J/cm², 1000 J/cm², 1500 J/cm², 2000 J/cm², 2500 J/cm², 3000J/cm², 3500 J/cm², 4000 J/cm², 4500 J/cm², or 5000 J/cm². The at leastone energy source can provide an energy beam having an energy density ofa value between the afore-mentioned values (e.g., from about 50 J/cm² toabout 5000 J/cm², from about 50 J/cm² to about 2500 J/cm², or from about2500 J/cm² to about 5000 J/cm²). In some embodiments, the power density(e.g., power per unit area) of the energy beam is at least about 100Watts per millimeter square (W/mm²), 200 W/mm², 300 W/mm², 400 W/mm²,500 W/mm², 600 W/mm², 700 W/mm², 800 W/mm², 900 W/mm², 1000 W/mm², 2000W/mm², 3000 W/mm², 5000 W/mm², 7000 W/mm², 8000 W/mm², 9000 W/mm², 10000W/mm², 20000 W/mm², 30000 W/mm², 50000 W/mm², 60000 W/mm², 70000 W/mm²,80000 W/mm², 90000 W/mm², or 100000 W/mm². The power density of theenergy beam may be any value between the aforementioned values (e.g.,from about 100 W/mm² to about 100000W/mm², about 100 W/mm² to about 1000W/mm², or about 1000 W/mm² to about 10000 W/mm², from about 10000 W/mm²to about 100000 W/mm², from about 10000 W/mm² to about 50000 W/mm², orfrom about 50000 W/mm² to about 100000 W/mm²). The energy beam may emitenergy stream towards the target surface in a step and repeat sequence.The target surface may comprise an exposed surface of an energy beam, apreviously formed 3D object portion, or a platform.

At times, an energy source provides power at a peak wavelength. Forexample, an energy source can provide electromagnetic energy at a peakwavelength of at least about 100 nanometer (nm), 400 nm, 500 nm, 750 nm,1000 nm, 1010 nm, 1020 nm, 1030 nm, 1040 nm, 1050 nm, 1060 nm, 1070 nm,1080 nm, 1090 nm, 1100 nm, 1200 nm, 1500 nm, 1600 nm, 1700 nm, 1800 nm,1900 nm, or 2000 nm. An energy beam can provide energy at a peakwavelength between any value of the afore-mentioned peak wavelengthvalues (e.g., from about 100 nm to about 2000 nm, from about 100 nm toabout 1000 nm, or from about 1000 nm to about 2000 nm). The energysource (e.g., laser) may have a power of at least about 0.5 Watt (W), 1W, 5 W, 10 W, 50 W, 100 W, 250 W, 500 W, 1000 W, 2000 W, 3000 W, or 4000W. The energy source may have a power between any value of theafore-mentioned laser power values (e.g., from about 0.5 W to about 4000W, from about 0.5 W to about 1000 W, or from about 1000 W to about 4000W).

At times, an energy beam is translated relative to a surface (e.g.,target surface) at a given rate (e.g., a scanning speed), e.g., in atrajectory. The scanning speed of the energy beam may be at least about50 millimeters per second (mm/sec), 100 mm/sec, 500 mm/sec, 1000 mm/sec,2000 mm/sec, 3000 mm/sec, 4000 mm/sec, or 50000 mm/sec. The scanningspeed of the energy beam may be any value between the aforementionedvalues (e.g., from about 50 mm/sec to about 50000 mm/sec, from about 50mm/sec to about 3000 mm/sec, or from about 3000 mm/sec to about 50000mm/sec). The energy beam may be continuous or non-continuous (e.g.,pulsing). The energy profile of the energy beam may be (e.g.,substantially) uniform during the exposure time (e.g., also referred toherein as dwell time). The exposure time (e.g., at the target surface)of the energy beam may be at least about 0.1 milliseconds (ms), 0.5 ms,1 ms, 10 ms, 50 ms, 100 ms, 500 ms, 1000 ms, 2500 ms, or 5000 ms. Theexposure time may be any value between the above-mentioned exposuretimes (e.g., from about 0.1 ms to about 5000 ms, from about 0.1 ms toabout 1000 ms, or from about 1000 ms to about 5000 ms). The exposuretime (e.g., irradiation time) may be the dwell time. The dwell time maybe at least 1 minute, or 1 hour.

In some embodiments, the at least one 3D object is formed (e.g.,printed) using a plurality of energy beams and/or energy sources. Attimes, at least two transforming agents (e.g., energy sources (e.g.,producing at least two energy beams)) may have at least onecharacteristic value in common with each other. At times, the at leasttwo energy sources may have at least one characteristic value that isdifferent from each other. Characteristics of the transforming agent maycomprise transformation density (or transformation strength),trajectory, FLS of footprint on the target surface, hatch spacing, scanspeed, or scanning scheme. The transformation density may refer to thevolume or weight of material transformed in a given time by thetransforming agent. The FLS of footprint on the target surface may referto the FLS of the energy beam on the target surface, of a binder streamdispensed on the target surface. Characteristics of the energy beam maycomprise wavelength, power density, amplitude, trajectory, FLS offootprint on the target surface, intensity, energy, energy density,fluence, Andrew Number, hatch spacing, scan speed, scanning scheme, orcharge. The scanning scheme may comprise continuous, pulsed or tiledscanning scheme. The charge can be electrical and/or magnetic charge.Andrew number is proportional to the power of the irradiating energyover the multiplication product of its velocity (e.g., scan speed) by ahatch spacing. The Andrew number is at times referred to as the areafilling power of the irradiating energy. In some embodiments, at leasttwo of the energy source(s) and/or beam(s) can be translated atdifferent rates (e.g., velocities).

FIG. 1 shows an example of a 3D forming (e.g., 3D printing) system 100and apparatuses, including a (e.g., first) energy source 121 that emitsa (e.g., first) energy beam 101 and a (e.g., second) energy source 122that emits a (e.g., second overlapping) energy beam 111. The 3D printingsystem may also be referred to herein as “3D printer.” In the example ofFIG. 1 the energy from energy source 121 travels through an (e.g.,first) optical system 120 (e.g., comprising a scanner) and an opticalwindow 115 to be incident upon a target surface 140 within an enclosure126 (e.g., comprising an atmosphere). The enclosure can comprise one ormore walls that enclose the atmosphere. The target surface may compriseat least one layer of pre-transformed material (e.g., FIG. 1, 108 ) thatis disposed adjacent to a platform (e.g., FIG. 1, 109 ). Adjacent can beabove. In some embodiments, an elevator shaft (e.g., FIG. 1, 105 ) isconfigured to move the platform (e.g., vertically; FIG. 1, 112 ). Theenclosure (e.g., 132) may including sub-enclosures comprising an opticalchamber (e.g., 131), a processing chamber (e.g., 107), and a buildmodule (e.g., 130). The platform may be separated from one or more walls(e.g., side walls) of the build module by a seal (e.g., FIG. 1, 103 ).The guidance system of the energy beam may comprise an optical system.FIG. 1 shows the energy from the energy source 122 travels through anoptical system 114 (e.g., comprising a scanner) and an optical window135 to impinge (e.g., be incident) upon the target surface 140. Theenergy from the (e.g., plurality of) energy source(s) may be directedthrough the same optical system and/or the same optical window. Attimes, energy (e.g., beam) from the same energy source is directed toform a plurality of energy beams by one or more optical systems. Thetarget surface may comprise a (e.g., portion of) hardened material(e.g., FIG. 1, 106 ) formed via transformation of material within amaterial bed (e.g., FIG. 1, 104 ). In the example of FIG. 1 , a layerforming device 113 includes a (e.g., powder) dispenser 116, a leveler117, and material removal mechanism 118. During printing, the 3D object(e.g., and the material bed) may be supported by a (e.g., movable)platform, which platform may comprise a base (e.g., FIG. 1, 102 ). Thebase may be detachable (e.g., after the printing). A hardened materialmay be anchored to the base (e.g., via supports and/or directly), ornon-anchored to the base (e.g., floating anchorlessly in the materialbed, e.g., suspended in the material bed). An optional thermal controlunit (e.g., FIG. 1, 119 ) can be configured to maintain a localtemperature (e.g., of the material bed and/or atmosphere). In somecases, the thermal control unit comprises a (e.g., passive or active)heating member. In some cases, the thermal control unit comprises a(e.g., passive or active) cooling member. The thermal control unit maycomprise or be operatively coupled to a thermostat. The thermal controlunit can be provided inside of a region where the 3D object is formed oradjacent to (e.g., above) a region (e.g., within the processing chamberatmosphere) where the 3D object is formed. The thermal control unit canbe provided outside of a region (e.g., within the processing chamberatmosphere) where the 3D object is formed (e.g., at a predetermineddistance).

In some embodiments, the target surface is detected by a detectionsystem. The detection system may comprise at least one sensor. Thedetection system may comprise a light source operable to illuminate aportion of the 3D forming (e.g., printing) system enclosure (e.g., thetarget surface). The light source may be configured to illuminate onto atarget surface. The illumination may be such that objects in the fieldof view of the detector are illuminated with (e.g., substantial)uniformity. For example, sufficient uniformity may be uniformity suchthat at most a threshold level (e.g., 25 levels) of variation ingrayscale intensity exists (for objects), across the build plane. Theillumination may comprise illuminating a map of varied light intensity(e.g., a picture made of varied light intensities). Examples ofillumination apparatuses include a lamp (e.g., a flash lamp), a LED, ahalogen light, an incandescent light, a laser, or a fluorescent light.The detection system may comprise a camera system, CCD, CMOS, detectorarray, a photodiode, or line-scan CCD (or CMOS). Examples of a controlsystem, detection system and/or illumination can be found in U.S. patentapplication Ser. No. 15/435,090, titled “ACCURATE THREE-DIMENSIONALPRINTING” that was filed Feb. 16, 2017, which is incorporated herein byreference in its entirety.

The 3D printer may include an enclosure (e.g., FIG. 1, 132 ). Theenclosure can include sub-enclosures. For example, the enclosure caninclude a processing chamber (e.g., FIG. 1, 107 ) and a build module(e.g., FIG. 1, 130 ). The sub-enclosures may be configured to be coupledand decoupled from one another. In some embodiments, the build moduleand the processing chamber are separate and/or inseparable. In someembodiments, the optical chamber and the processing chamber are separateand/or inseparable. The build module and processing chamber may (e.g.,controllably) engage and disengage. The separate build module, opticalchamber, and processing chamber may each comprise a separate atmosphere.Any of these atmospheres may be different than the ambient atmosphereoutside of the build module, optical chamber, and/or processing chamber.For example, any of these atmospheres may be inert (e.g., compriseargon, or nitrogen). Any of these atmospheres may comprise a speciesthat is reactive with the transformed and/or pre-transformed materialduring the printing, in an amount below a (e.g., reactive) threshold.The species may comprise water or oxygen. The build module, opticalchamber, and/or processing chamber may engage to form a gas tight seal(e.g., hermetic seal). The separate build module, optical chamber,and/or processing chamber may (e.g., controllably) merge. For example,the atmospheres of the build module and processing chamber may merge. Inthe example of FIG. 1 , the 3D printing system comprises a processingchamber which comprises the energy beam and the target surface (e.g.,comprising the atmosphere in the interior volume of the processingchamber, e.g., 126). At times, at least one build module may be disposedin the enclosure that comprises the processing chamber (having aninterior volume 126 comprising an atmosphere). At times, at least onebuild module may engage with the processing chamber (e.g., FIG. 1 )(e.g., 107). At times, a plurality of build modules may be coupled tothe enclosure. The build module and/or optical chamber may reversiblyengage with (e.g., couple to) the processing chamber. The engagement ofthe build module and/or optical chamber may be before or after the 3Dprinting. The engagement of the build module and/or optical chamber withthe processing chamber may be controlled (e.g., by a controller, such asa microcontroller). Examples of a controller and any of its componentscan be found in: patent application serial number PCT/US17/18191, titled“ACCURATE THREE-DIMENSIONAL PRINTING” that was filed on Feb. 16, 2017;U.S. patent application Ser. No. 15/435,065, titled “ACCURATETHREE-DIMENSIONAL PRINTING” that was filed on Feb. 16 2017; and/orpatent application serial number EP17156707, titled “ACCURATETHREE-DIMENSIONAL PRINTING” that was filed on Feb. 17, 2017; each ofwhich is incorporated herein by reference in its entirety. Thecontroller may direct the engagement and/or dis-engagement of the buildmodule and/or of the optical chamber. The control may comprise automaticand/or manual control. The engagement of the build module with theprocessing chamber may be reversible. In some embodiments, theengagement of the build module with the processing chamber may benon-reversible (e.g., stable, or static). The FLS (e.g., width, depth,and/or height) of the processing chamber can be at least about 50millimeters (mm), 60 mm, 70 mm, 80 mm, 90 mm, 100 mm, 200 mm, 250 mm,280 mm, 400 mm, 500 mm, 800 mm, 900 mm, 1 meter (m), 2 m, or 5 m. TheFLS of the processing chamber can be at most about 50 millimeters (mm),60 mm, 70 mm, 80 mm, 90 mm, 100 mm, 200 mm, 250 mm, 400 mm, 500 mm, 800mm, 900 mm, 1 meter (m), 2 m, or 5 m. The FLS of the processing chambercan be between any of the afore-mentioned values (e.g., 50 mm to about 5m, from about 250 mm to about 500 mm, or from about 500 mm to about 5m). The build module, optical chamber, and/or processing chamber maycomprise any (e.g., be formed of a) material comprising an organic(e.g., polymer or resin) or inorganic material (e.g., a salt, mineral,acid, base, or silicon-based compound). The build module and/orprocessing chamber may comprise any material disclosed herein (e.g.,elemental metal, metal alloy, an allotrope of elemental carbon, ceramic,or glass).

At times, a pre-formation application (e.g., stored on a non-transitorycomputer-readable medium) generates instructions data for forming atleast one requested 3D object (e.g., by a suitable manufacturingdevice). The instructions data may comprise instructions for control ofat least one characteristic of a transforming agent. Control of at leastone characteristic of a transforming agent may be for effecting at leastone (e.g., specified) process parameter. Characteristics of thetransforming agent may comprise: (I) a transforming agent flux (e.g.,energy beam fluence), (II) transforming agent motion (e.g., energy beamposition, velocity and/or acceleration), (III) a transforming agentintensity (e.g., energy beam power density), (IV) transforming agentpersistence (e.g., dwell) time, (V) transforming agent area of effect(e.g., energy beam footprint) (e.g., on an exposed surface of a materialbed), (VI) transforming agent focus, or (VII) a fundamental length scaleof a transforming agent footprint (e.g., on a target surface, e.g., anexposed surface of a material bed). The instructions data may compriseinstructions for control of a movement of a transforming agent across atarget surface (e.g., on an exposed surface of a material bed). Themovement of the transforming agent may comprise with a specifiedtransforming agent intensity considering (e.g., as a function of) itsposition on the target surface. The instructions data may comprise (i)forming instructions data, or (ii) layout instructions data. The forminginstructions may comprise commands for a given manufacturing device toform a requested 3D object. The commands may be for control of at leastone apparatus of the manufacturing device. The forming instructions maycause a given manufacturing device to control and/or to select an effectwith respect to at least a portion of a generated (e.g., requested) 3Dobject. For example, a selected effect for a requested 3D object maycomprise (i) a material type, (ii) a microstructure (iii) a density,(iv) a surface roughness, (v) a material porosity, (vi) an auxiliarysupport structure (or absence thereof), (vii) a dimensional requirementand/or tolerance, or (viii) a rate of formation, with which (e.g., aportion of) the requested 3D object is formed. The auxiliary supportstructure may comprise a distance between any immediately adjacentauxiliary support, or location of any auxiliary supports with respect tothe requested 3D object. The layout instructions may comprise commandsfor a given manufacturing device to form at least one requested 3Dobject (i) according to a requested arrangement, (ii) according to aspecified sequence with which one or more transforming agents (e.g.,and/or generators thereof) are operated, and/or (iii) to have arequested marking (e.g., label). The requested arrangement may comprisea location of the at least one requested 3D object within a build volumeof the manufacturing device. The requested arrangement may be anoptimized arrangement. The requested arrangement may be suggested by asoftware module, operator, and/or client. The pre-formation applicationmay comprise at least two formation stages for preparing theinstructions data for generating the 3D object. A (e.g., first) stagemay include generation of the forming instructions for generating therequested 3D object. The (e.g., first) stage may comprise at least oneapplication for interaction with a virtual model of a (e.g., discrete)requested 3D object (e.g., an “Object Environment” application). A(e.g., second) stage may include generation of the layout instructionsfor a given formation cycle. The instruction data may be of therequested 3D object(s) within the build volume. The second (e.g.,formation environment) stage may comprise at least one application forinteraction with at least one requested 3D object within a build volumeof the manufacturing device (e.g., a “Formation Environment”application), e.g., above a platform.

In some embodiments, at least one (e.g., any) of the stages comprisesone or more modules (e.g., software modules). A module may enable and/orenact a specific functionality within a given stage. For example, amodule may receive, process, and/or generate data related to formationof the requested 3D object. Data related to a requested 3D object may beprocessed (e.g., in an object stage) to generate forming instructionsfor the requested 3D object. The processing may include generation,alteration, and/or supplementation to at least one file relating to theforming instructions. A file relating to the forming instructions may bereferred to herein as a “forming instruction related file”. Theprocessing of the data in the object stage may include (in any order)one or more of the following modules: (i) requested object model; (ii)region of interest designation (abbreviated herein as “ROI”); (iii) anestimation of a likelihood of formation failure; (iv) object simulation;and/or (v) processing instructions for a forming apparatus.

In some embodiments, a module for processing a requested 3D object modelgenerates a virtual model of a (e.g., requested) 3D object. In someembodiments, an object stage enables an opening and/or importing of avirtual model of a requested 3D object that is in a native (e.g.,boundary representation) computer-aided design (abbreviated herein as“CAD”) file format. In some embodiments, the module for processing therequested 3D object model may be compatible with (e.g., import and/oropen) file formats comprising IGES, JT, Parasolid, PRC, STEP, STL, 3mf,or LTCX. In some embodiments, the module for processing the requested 3Dobject model comprises a file conversion functionality. For example, afile conversion may comprise converting a received file of the requested3D object from a first format (e.g., STL) to a second format (STEP). Insome embodiments, the requested 3D object may comprise a 3D object that(a) is generatively designed, (b) is topologically optimized, or (c)comprises a networked (e.g., lightweight, sponge, and/or lattice)structure. In some embodiments, the object stage provides a one or moreinteractions with one or more modes of a requested 3D object (e.g., avirtual model of the requested 3D object). The interactions with thevirtual model of the requested 3D object may comprise (I) selection ofone or more similar portions thereof, (II) generation of any ROI, (III)manipulation and/or modifications to any (e.g., predefined) ROI, or (IV)specification of at least one formation variable category option (e.g.,forming process or forming feature) for any selected portions. In someembodiments, the forming process comprises hatching, tiling, forming(e.g., substantially) globular melt pools, forming high aspect ratiomelt pools, re-transforming, annealing, machining, or pre-heating. Insome embodiments, selecting the forming process considers a formingparameter that comprises (a) an angle, (b) a surface roughness, (c) arate of formation, (d) a material composition, or (e) a dimensionalfidelity, of the at least one (e.g., surface) portion of the 3D object.The angle may be with respect to a global vector, gravity, a directionof layerwise object formation, and/or a platform that supports the 3Dobject. The dimensional fidelity may be of a formed three-dimensionalobject with respect to the geometric model. In some embodiments, theforming feature comprises generation of: (a) one or more auxiliarysupports or (b) a label.

In some embodiments, a module for processing a requested 3D object modelaids in generation, modification, analysis, and/or optimization, of a(e.g., design of) a requested 3D object. The requested 3D object maycomprise a CAD model or a mechanical design automation (abbreviatedherein as “MDA”) model. In some embodiments, a module for processing arequested 3D object model comprises a meshing scheme that is used togenerate (e.g., at least a portion of) a geometric model (e.g., FIG. 2,205 ). A mesh may comprise a discrete representation of a (e.g., 3D)object. In some embodiments, a meshing scheme comprises isotropic oranisotropic meshing. In some embodiments, a mesh (e.g., scheme) maycomprise a surface mesh or a volumetric mesh. In some embodiments, asurface mesh may be used: (a) to generate a display of the geometricmodel, (b) for (e.g., interactive) placement of one or more (e.g.,auxiliary) support structures on the geometric model, and/or (c) toslice a volume of the geometric model. In some embodiments, a volumetricmesh may be used for simulating at least one behavior of the 3D object(e.g., according to a numerical simulation), which behavior may beduring and/or after the formation of the 3D object. The behavior mayrefer to thermal and/or mechanical behavior of at least a portion of the3D object during printing of the 3D object and/or subsequent to theprinting of the 3D object (e.g., as it relaxes to its final, e.g.,equilibrium state). In some embodiments, a relationship may existbetween a surface mesh and a volumetric mesh (e.g., for a givengeometric model). For example, a volumetric mesh may be formedconsidering a (e.g., surface) boundary described by a surface mesh. Insome embodiments, formation of a volumetric mesh does not consider asurface mesh (e.g., boundary).

At times, a fidelity of a surface (or volume) mesh with respect to a(e.g., requested) 3D object may be related to a coarseness (e.g., ofdata points) of the mesh. For example, a relatively coarse mesh may havea lower fidelity to a surface (or volume) of a 3D object, as compared toa fine(r) mesh. In some embodiments, a relatively coarse mesh may have areduced number of data points (e.g., and/or a lower computational cost)as compared to a fine(r) mesh. In some embodiments, geometriccharacteristics of the geometric model are associated with (e.g., datapoints) of a mesh. In some embodiments, geometric characteristic dataare stored at nodes and/or edges of fundamental components (e.g., cells)of a mesh. A cell of a mesh may be a geometric structure such as apolygon (e.g., 2D or 3D polygon). The polygon may be a space fillingpolygon. The geometric structure may be a tessellation. In someembodiments, the cell comprises a symmetric polygon. In someembodiments, the cell comprises an equilateral polygon. In someembodiments, the cell comprises a triangle, a tetragon, or a hexagon. Insome embodiments, the tetragon comprises a concave or a convex polygon(e.g., tetragon).

In some embodiments, an object stage comprises an application providingcontrol of an interaction with a virtual model of a requested 3D object.For example, an object stage may comprise an Object Environmentapplication. For example, control of an interaction may comprise controlof a view and/or a selection tool for interacting with (e.g., modifying)at least a portion of a virtual model of a requested 3D object. Therequested 3D object may comprise template data. Template data maycomprise default settings (e.g., presets) for at least a portion of therequested 3D object. The default settings may comprise (I) a selectedeffect, (II) a (e.g., predefined) ROI, (III) a forming process, (IV) aforming feature, for at least a portion of the requested 3D object, (V)an orientation at which the requested 3D object is formed (e.g.,relative to a platform), (VI) a manufacturing speed, and/or (VII) atleast one setting of a manufacturing device (e.g., forming device). Anorientation of an object may be with respect to a manufacturing deviceenvironment (e.g., with respect to a platform above which the 3D objectis formed in the manufacturing device), with respect to a global vector,or with respect to a coordinate system (e.g., Cartesian, spherical,cylindrical, polar, or homogenous). In some embodiments, a setting of amanufacturing device may comprise (A) an atmospheric composition withinwhich the requested 3D object is formed, (B) a throughput of formationof the requested 3D object, (C) a layer height, (D) gas flow, (E)manufacturing device (e.g., type and/or unit number), (F)pre-transformed material size and/or type, or (G) transforming agenttype. A transforming agent type may comprise an energy beamcharacteristic, or binder characteristic such as flow rate,polymerization rate, or hardening rate. A modification (e.g., from anobject template) may comprise a change to, an addition, or a removal of,at least one preset of the template. For example, modifications from atemplate may include modification to at least one formation variablecategory option. In some embodiments, a catalog stores data associatedwith an object template (e.g., and any modification thereto) of a (e.g.,plurality of) virtual model(s). In some embodiments, an ObjectEnvironment application enables a modification to a virtual model of arequested 3D object. For example, a modification to a virtual model maycomprise a simplification of the model. An alteration (e.g.,simplification) of a virtual model may result in a greater ease ofmanufacturing, increased manufacturing speed, an increased performanceof a manufacturing device for forming, increased dimensional fidelity(with respect to the requested 3D object), and/or a reduction in weightof, a requested 3D object. The alteration may be an alteration ascompared to the original, non-altered, 3D object. An object stageapplication may be any pre-formation application as described in U.S.patent application Ser. No. 16/125,644, titled “MANIPULATING ONE OR MOREFORMATION VARIABLES TO FORM THREE-DIMENSIONAL OBJECTS”, that was filedSep. 7, 2018, which is incorporated by reference herein in its entirety.

FIG. 2A depicts an example of an Object Environment application 200. Inthe example of FIG. 2A, an Object Environment application includes avirtual model 205 of a requested 3D object, displayed atop a referenceplane 210. The reference plane may imitate a platform above which the 3Dobject is disposed during manufacturing. In some embodiments, a virtualmodel of a requested 3D object may be displayed floating freely in space(e.g., devoid of any reference plane). In the example of FIG. 2A, atoolbar 215 includes icons corresponding to various manner ofcontrolling a view of the virtual model of the 3D object, and/or variousselection tools. For example, control of a view of the virtual model maycomprise control of a (e.g., camera) view of the virtual model (e.g.,216), a view modality (e.g., 217), or a section view (e.g., 219). Insome embodiments, control of a selection tool (e.g., 218) includesuser-guided selection. A user-guided selection may comprise a lassoselection, a (e.g., closed) shape selection (e.g., rectangle), or acircular selection. A selection may comprise a geometry-based selectionbased on the geometry of the virtual model of the 3D object (e.g., asurface patch and/or edge), and/or selection of the entire virtual modelof the 3D object. FIG. 2A depicts an example of a (e.g., patch) surfaceselection 228, and an interaction window 229 that provides an interfacefor specifying any modifications to the selected portion of the model.In the example of FIG. 2A, a window 220 includes template information222 associated with the displayed model, and any specifiedmodification(s) 224 applied (e.g., from the template) to the currentmodel.

In some embodiments, a module enables specification and/or designationof a region of interest (ROI) for at least a portion of a requested 3Dobject (a “ROI module”). A ROI module may enable specification of (i) atleast one formation variable category option, and/or (ii) a selectedeffect, to at least a portion of a requested 3D object. The at least theportion may comprise at least one (a) surface portion, or (b) volumetricportion. In some embodiments, an ROI module may enable assigning arequested forming process, surface finish, any auxiliary support,formation rate (e.g., object generation speed) preferences. At times, itis requested to select (e.g., to designate and/or to define) a region ofinterest for at least a portion of a 3D object. An ROI designation mayenable a modification to (e.g., override) a forming procedure (e.g., adefault forming procedure). A forming procedure may comprise a formingfeature (e.g., an auxiliary support) or a forming process (e.g., of aplurality of forming processes). In some embodiments, an ROI modulecomprises at least one sub-module for designation and/or modification toa forming procedure (e.g., to a file thereof). For example, a (e.g.,first) sub-module for specification of a forming feature, and a (e.g.,second) sub-module for specification of a forming process. At times, a(e.g., forming procedure) category is associated with an ROIdesignation. For example, a category may comprise (I) a forming featureand/or (II) a given forming (e.g., printing) process of a plurality offorming processes. A forming feature may comprise an auxiliary supportor a label. In some embodiments, a label is associated with a portion ofthe 3D object (e.g., the ROI portion), and/or the (e.g., entire) 3Dobject. A label may comprise a (e.g., named) reference to a given ROI ofthe 3D object. A label may comprise a detectable marking within and/oron a surface of the 3D object. A label may be generated manually and/orautomatically. In some embodiments, a data store (e.g., a database)comprises data relating a given serial number to a given (e.g., instanceof) a formed 3D object (e.g., in a table). For example, an automaticallygenerated label may comprise operations of (a) querying a database todetermine (e.g., fetch) a current value of a sequence (e.g., a serialnumber), (b) generating a label ROI according to the sequence, and (c)incrementing the sequence (e.g., a serial number).

In some embodiments, an object stage module provides an analysis (e.g.,estimation, calculation and/or assessment) of a likelihood of failure inthe forming of a (e.g., requested) 3D object. The requested 3D objectmay comprise a topology having overhangs (e.g., ledges) and/or cavities.The analysis may be performed before, during, and/or after generatingforming instructions by which a forming device forms the 3D object. Afailure can comprise a defect in at least a portion of the 3D objectand/or a malfunction in a device operating to form the 3D object. Adefect may comprise a rupture, a collapse, a failure of the 3D object tomeet at least one (e.g., design) requirement, or a failure of the 3Dobject to operate (e.g., perform) for its intended purpose. For example,an analysis may comprise (i) any estimated failure mode(s) of the 3Dobject formation, or (ii) a response to the (e.g., any) estimatedfailure mode(s). In some embodiments, an estimated failure modecomprises a failure of: (i) object support; (ii) residual stress; (iii)material property; (iv) excessive material addition; (v) adjustivedeformation; or (vi) destructive deformation; of the (e.g., forming) 3Dobject. Excessive material addition may manifest as material balling.Adjustive deformation may comprise bending, curling, warping, twisting,rolling, plastically yielding, or balling. Destructive deformation maycomprise cracking or tearing. At times, an analysis may consider ageometry and/or orientation of the 3D object. At times, an analysis mayconsider historical data. Historical data may be of a same (e.g.,requested) prior-formed 3D object, and/or of a similar 3D object.Historical data may comprise previously formed (e.g., printed) layers ofa requested 3D object. At times, the analysis may consider a (e.g.,physics model) simulation of a process of forming at least a portion ofthe 3D object and/or the reaction of the 3D object to its formation. Thesimulation may be a full simulation, e.g., of an entire requested 3Dobject. The simulation may be a partial simulation, e.g., of a portionof a requested 3D object. The simulation may be of a currently formedlayer of the 3D object. The simulation may take into account one or morepreviously formed portions (e.g., layers) of the 3D object. Theplurality of previously formed layers may be within the last 10, 100,1000, 10000, or 100000 formed layers. The reaction of the 3D object maycomprise a post formation relaxation process within the formed 3Dobject. At times, the analysis may be a simplification of: variousaspects of a geometric model and/or simulation of forming the requested3D object. In some embodiments, a malfunction may comprise damage to thedevice that is operating to form the 3D object. In some embodiments, aresponse to an estimated failure mode may comprise: (i) an objectformation modification; (ii) a notification; or (iii) a refinement of afailure estimate.

In some embodiments, an object simulation module comprises an analysis(e.g., simulation) of an outcome of manufacturing instructions to resultin an analyzed virtual example of manufacturing 3D object. A simulationmay consider the forming process of the 3D object, its physical behaviorduring and/or after the printing, and any structural correction.Structural correction (“object pre-print correction”) may comprisecorrective deformation of a 3D model of the requested 3D object. In acorrective deformation procedure, a virtual model (e.g., representation)of the requested 3D object is modified to account for any foreseendeformation during and/or after (e.g., upon relaxation) its formation,such that when the modified virtual model is utilized for generation ofthe printing instructions, the 3D object will be formed according to itsoriginally requested dimensionality (e.g., within an acceptabletolerance). The corrective deformation may be referred to herein as“object pre-print correction” (abbreviated as “OPC”) or “pre-printcorrection.” The corrective deformation may take into account featurescomprising (i) stress within a forming object (e.g., structure) such asaccumulating stress or latent stress, (ii) deformation of transformedmaterial as it hardens to form at least a portion of the requested 3Dobject, (iii) the manner of temperature depletion during the printingprocess, (iv) the manner of deformation of the transformed material as afunction of the density of the pre-transformed material within thematerial bed (e.g., powder material within a powder bed) in which the 3Dobject was formed (when applicable), or (v) stress relaxation duringand/or after formation of the 3D object. The corrective deformation mayintroduce a deformation to at least a portion of the model of the 3Dobject. The generation of forming instructions for a given requested 3Dobject may consider (e.g., be based at least in part on) the correctivedeformation. The introduced deformation may be such that, upontransformation and hardening, the at least the portion of the 3D objectassumes a requested (e.g., intended) shape (e.g., geometry). Thesimulation may comprise a computational model. The computational modelmay comprise the use of mathematics, statistics, physics and/or computerscience. The computational model may consider historical data. Thecomputational model may utilize machine learning. Examples of machinelearning can be found in patent application serial numberPCT/US17/54043, titled “THREE-DIMENSIONAL OBJECTS AND THEIR FORMATION”that was filed on Sep. 28, 2017, that is incorporated herein byreference in its entirety. The computational model may consider aphysics model. The structural correction may comprise any pre-printcorrection to the model of the requested 3D object that may result inreduced deformation of the formed 3D object and adherence to therequested dimensionality constraints of the 3D object that is formed.The structural correction may comprise a geometric correction to thegeometric model of the requested 3D object. Examples of structuralcorrection can be found in patent application serial numberPCT/US16/34857, titled “THREE-DIMENSIONAL PRINTING AND THREE-DIMENSIONALOBJECTS FORMED USING THE SAME” that was filed on May 27, 2016; patentapplication serial number PCT/US17/18191, titled “ACCURATETHREE-DIMENSIONAL PRINTING” that was filed on Feb. 16, 2017; U.S. patentapplication Ser. No. 15/435,065, titled “ACCURATE THREE-DIMENSIONALPRINTING” that was filed on Feb. 16 2017; patent application serialnumber EP17156707, titled “ACCURATE THREE-DIMENSIONAL PRINTING” that wasfiled on Feb. 17, 2017; and/or patent application serial numberPCT/US17/54043, titled “THREE-DIMENSIONAL OBJECTS AND THEIR FORMATION”that was filed on Sep. 28, 2017; each of which is incorporated herein byreference in its entirety. The physical simulation may comprise thermaland/or mechanical simulation of the 3D object during its formation.Examples of physical simulation can be found in patent applicationserial number PCT/US16/59781, titled “ADEPT THREE-DIMENSIONAL PRINTING”that was filed on Oct. 31, 2016; patent application serial numberPCT/US17/18191; U.S. patent application Ser. No. 15/435,065; patentapplication serial number EP17156707; and/or patent application serialnumber PCT/US17/54043; each of which is incorporated herein by referencein its entirety. The simulation may comprise a physics model regardingthe forming process. The physics model may comprise a thermo mechanical(e.g., thermo plastic) model of the forming process to form the 3Dobject.

In some embodiments, an expected thermo-plastic (e.g., thermal componentof a thermo-mechanical model) is calculated by computing a thermalbalance in the material using the following Equation 1:

${{{\rho c_{\rho}\frac{\partial T}{\partial t}} + {{\nabla_{x} \bullet}q}} = {\rho r}};$

Where t is time, T=T(t, x) is the temperature field, x is a deformationpoint; c_(p)=c_(p)(T) is the heat capacity of the material as a functionof temperature; ρ=ρ(t,x) is the density; r=r (t, x) is the energy sourcefield per unit mass; q=−∇_(x)T; and ∇_(x)T is the temperature gradient.The heat capacity can include a latent heat of melting for the materialand the material properties can be assumed to be temperature dependent.An expected mechanical deformation (e.g., mechanical component of athermo-mechanical model) can be calculated by finding the functionx=Φ(t, X) using the following Equation 2, such that:

∇_(x) ·P(t,X)=0;

Where P=P(t,X) is a stress tensor. The stress tensor can be the firstPiola-Kirchhoff stress tensor. Equivalent forms of the above equationcan comprise a different stress tensor. The different stress tensor maybe a Cauchy, Nominal, Piola, second Piola-Kirchhoff, or Biot stresstensor. Equation 2 can assume inertial terms are negligible (e.g.,quasistatic approximation of the momentum equation). The constitutivemodel for the material can be calculated and using the followingEquation 3:

S=C:ε_(el);

where S=F−1 P is the same or another stress tensor, e.g., the secondPiola-Kirchhoff stress tensor; C is the elastic 4-tensor of thematerial, and ε_(el) is the elastic strain tensor.

In some embodiments, a physics model comprises calculations thatconsider a type of material (e.g., type of alloy) and an expectedthermo-mechanical reaction of that material to the forming process,e.g., that causes deformation. In some embodiments, the physics modelrelies on one or more assumptions. In one example, the physics modelrelies on the following assumptions: (i) an optimal transforming agentprocess (e.g., is applied to maintain a constant peak temperature over adwell time); and (ii) a closed loop control is employed to adjustprocess parameters in real time. In some embodiments, a reduced setphysics model (e.g., also) assumes: (iii) strain/stress related effects.The strain/stress related effects may be applied to a layer. Thestress/strain related effects may be independent of or dependent on astress field of any underlying structure. In some embodiments, thephysics model can be used to calculate a predicted deformationsubstantially in real time (e.g., before, during and/or followingformation of at least a portion of the 3D object). The real timecalculations can be used in a feed forward and/or feedback (closed loop)control system(s) that controls the forming process.

In some embodiments, an object stage comprises a module for generatingprocessing instructions for a forming apparatus. At times, 3D forming(e.g., printing) comprises one or more forming (e.g., printing)instructions (e.g., embodied in a computer-readable medium). The forminginstructions, when executed, may cause a (e.g., suitable) manufacturing(e.g., 3D printing) device to perform a series of operations. The seriesof operations may cause (e.g., additive) formation of the 3D object. Forexample, the forming instructions may divide the formation of a physical3D object into a series of physical layers (e.g., layers of transformedmaterial). In some embodiments, a model of a 3D object is arranged(e.g., divided) into a number of constituent portions (e.g., virtualslices). A slice of a 3D model may correspond to a (e.g., planar)section of the 3D model (e.g., a layer). In some embodiments, a seriesof physical layers correspond to a series of virtual slices of ageometric model. The (e.g., planar) slice may be defined by a topsurface, a bottom surface, and a thickness. Top and bottom may be withrespect to a global vector and/or platform above which the 3D object isformed. A thickness of a slice may correspond with a layer height (e.g.,thickness) of the formed 3D object. The 3D model may be organized into aplurality of (e.g., neighboring) slices. For example, a plurality ofslices may be arranged such that a top surface of a first slice isadjacent to (e.g., juxtaposed with) a bottom surface of a neighboringslice that is above the first slice (e.g., above with respect to aglobal vector). The first slice may be directly adjacent to the secondslice. For example, the first slice may contact the second slice. Insome embodiments, a (e.g., corresponding) virtual slice exists for eachlayer of the physically formed 3D object, e.g., that is formedadditively in a layer-wise manner.

In some embodiments, a module for generating processing instructionsspecifies for a (e.g., each) slice of a geometric model an associated(e.g., set of) forming (e.g., printing) instruction of a printing lap.The forming process may comprise layerwise printing, extruding (e.g.,layerwise extruding), molding, or any other forming process disclosedherein for forming a 3D object. In some embodiments, the printingoperations comprise (i) depositing a first (e.g., planar) layer ofpre-transformed material as a portion of a material bed, and (ii)directing a transforming agent (e.g., an energy beam or a binding agent)towards a first portion of the first layer of pre-transformed materialto form a first transformed material. For example, the printingoperations can comprise (i) depositing a first (e.g., planar) layer ofpre-transformed material as a portion of a material bed, and (ii)directing an energy beam towards a first portion of the first layer ofpre-transformed material to form a first transformed material. Thetransformed material may be a portion of the 3D object. The transformedmaterial may be hardened into a hardened (e.g., solid) material as aportion of the 3D object. The transformed material may comprisepre-transformed material that are connected. Connected may be by using abinding agent, through chemical bonding such as utilizing covalentbonds, and/or by sintering. The transformed material may be embedded ina matrix. The matrix may be formed by a binding agent such as polymer,resin, and/or other glue. Optionally, this process may be repeated layerby layer deposition, or layerwise deposition. Another layer may beformed, for example, by adding a second (e.g., planar) layer ofpre-transformed material, directing a transforming agent (e.g., anenergy beam, a chemically reactive species, or a binding agent) toward asecond portion of the second layer of pre-transformed material to form asecond transformed material according to forming instructions of asecond slice in the (e.g., geometric) computer model of the 3D object.

In some embodiments, a formation environment stage comprises processingdata related to formation of at least one requested 3D object in a givenformation cycle of a manufacturing device. The formation environmentstage may receive data from a (e.g., prior) stage. For example, theformation environment stage may receive forming instructions data froman object stage. Forming instructions data may be received for (e.g.,each of) a plurality of requested 3D objects to be formed in the givenformation cycle. The processing of the (e.g., forming instructions) datain the formation environment stage may result in a data output. The dataoutput may comprise layout instructions data. The formation environmentstage may comprise one or more modules operable for receiving,processing, and/or generating data related to formation of at least one3D object within a manufacturing device. The formation environment stagemay relate to the at least one 3D object (e.g., a plurality of 3Dobjects) arranged on a platform and/or in a build volume. The processingmay involve and/or utilize the forming instruction related filesgenerated in the first stage (e.g., first phase, first branch, or firstdivision). The processing of the data in the formation environment stagemay include (in any order) one or more of the following modules: (i) anarrangement of a build volume; (ii) a sequencer (e.g., of at least twomanufacturing device apparatuses); (iii) object labelling; and/or (iv) abuild volume simulation.

In some embodiments, a module for arranging a build volume enablesplacement of at least one requested 3D object within a build volumeand/or above a platform, of a manufacturing device. The manufacturingdevice may comprise a platform. The platform may be configured tosupport at least one forming 3D object (e.g., directly and/orindirectly) during formation. The module may comprise a (e.g., virtual)model of (a) at least one requested 3D object, or (b) a manufacturingdevice (e.g., build volume). The module may enable a placement of a(e.g., at least one) requested 3D object above (e.g., resting upon) aplatform of the manufacturing device. The placement may be made withrespect to a (e.g., Cartesian, polar, and/or spherical) coordinatesystem.

In some embodiments, a module for arranging a build volume comprises anapplication configured for interaction with one or more virtual modelsof 3D objects (e.g., of a corresponding one or more requested 3Dobjects). For example, the module may comprise a Formation Environmentapplication. In some embodiments, a Formation Environment applicationmay comprise interaction with (i) a single virtual model of the 3Dobject, (ii) a plurality of virtual models (e.g., corresponding to asame or to similar requested 3D object), or (iii) at least two differentvirtual models (e.g., corresponding to at least two different requested3D objects). In some embodiments, a Formation Environment applicationmay interact with (e.g., load) at least one virtual model of a requested3D object that was prepared in an object stage (e.g., by an ObjectEnvironment application). In some embodiments, a Formation Environmentapplication may load at least one virtual model of a requested 3D objectthat was prepared in an application other than an Object Environmentapplication. A Formation Environment application may be configured toorganize a distribution (e.g., a layout) of one or more virtual modelscorresponding to one or more requested 3D objects that are formed in aforming cycle. The organization may be relative to a platform abovewhich the 3D objects are to be manufactured. The organization of the 3Dobject(s) may be in a horizontal direction and/or vertical direction.The organization may comprise a rotation of (e.g., at least one) 3Dobject. The rotation may be with respect to the build volume, platform,and/or at least one transforming agent (e.g., generator), of themanufacturing device. The rotation may be with respect to the globalvector. A Formation Environment application may correspond to at leastone manufacturing device environment. For example, a FormationEnvironment application may comprise a virtual environment thatcorresponds to a physical environment of at least one manufacturingdevice (e.g., from a plurality of manufacturing devices). A physicalenvironment of a manufacturing device may comprise at least onemanufacturing device parameter. For example, a manufacturing deviceparameter may comprise a processing volume within which at least one 3Dobject may be formed (e.g., during a forming cycle). A processing volumemay comprise an area (e.g., of a platform) that is addressable by atleast one transforming agent. A processing volume may comprise a heightover which at least one 3D object may be formed. A processing volume maycomprise a height over which a platform that supports a forming objectmay translate, e.g., in layerwise deposition. A processing volume maycomprise a width and depth corresponding to the platform. A processingvolume may comprise a horizontal cross-section corresponding to theplatform. In some embodiments, a Formation Environment applicationcomprises a configuration of a virtual environment. A configuration of agiven virtual environment may correspond to at least one parameter of aphysical environment of a corresponding manufacturing device.

FIG. 2B depicts an example of a Formation Environment application 250.In the example of FIG. 2B, a forming area (e.g., a platform) 260 isdisposed below an arrangement of a plurality of 3D object models (e.g.,255, 257, and 270) that correspond to a plurality of requested 3Dobjects. An arrangement of virtual models may comprise a layout. In theexample shown in FIG. 2B, a toolbar 265 includes icons corresponding tocontrol of a view of the model(s) (e.g., of a layout), and a selectiontool. For example, control of a view of the virtual model(s) maycomprise control of a camera view (e.g., angle, zoom, pan, focus and/orperspective) of the model(s) (e.g., 266), a view modality (e.g., shaded,wireframe, shaded with edges, semi-transparent, and/or angle filter)(e.g., 267), or a section view (e.g., 269). In some embodiments, controlof a selection tool (e.g., 268) comprises user-guided selection (e.g.,lasso selection, or a shape selection), geometry-based selection, orselection of an entire virtual model (e.g., within a layout). In someembodiments, a Formation Environment application provides a capabilityto modify (e.g., a selected portion of) a virtual model of a requested3D object. The modification may comprise adjusting one 3D object withrespect to another 3D object above the forming area and/or in theforming volume. The adjustment may be with respect to one or moredirectly adjacent 3D object models. In some embodiments, a modificationto at least one 3D object may be made (e.g., directly) from within aFormation Environment application. The optimization may be regardingformation speed, space utilization, fidelity of the object(s) (e.g.,considering heat dissipation), or any combination thereof. Theadjustment may comprise placement optimization. In some embodiments, amodification may comprise an adjustment to forming instructions data. Insome embodiments, a modification (e.g., to forming instructions data)may be made (e.g., indirectly) by opening an Object Environmentapplication (e.g., 280).

In some embodiments, a manufacturing device comprises at least twoapparatuses that are operable for forming at least a portion of at leastone requested 3D object. For example, at least two transforming agentgenerators may be disposed to transform at least one requested 3Dobject. In some embodiments, at least two requested 3D objects arearranged (e.g., in a layout) for transformation by at least onetransforming agent (e.g., generator). In some embodiments, a sequencermodule (e.g., in a formation environment stage) comprises a capabilityof specifying a sequence of operation(s) for at least two manufacturingdevice apparatuses. The sequence of operations may consider anarrangement of at least one requested 3D object (e.g., within a buildvolume). The sequence of operations may consider a (e.g., spatial)relationship between at least one requested 3D object and at least onemanufacturing device apparatus. The sequence of operations may comprisea pattern (e.g., of activation and/or deactivation). The sequence ofoperations may comprise a cadence (e.g., a timing of operations).

In some embodiments, a requested 3D object comprises a marking (e.g., alabel). In some embodiments, a formation environment stage comprises anobject labelling module. The object labelling module may generate one ormore markings for at least one requested 3D object. The object labellingmodule may generate markings considering at least one forminginstructions-related file. For example, a forming instructions-relatedfile may comprise data (e.g., generated by an ROI module) indicating aportion of a requested 3D object designated for a marking (e.g., alabel). In some embodiments, an object labelling module comprises acoupling with a (e.g., at least one) product lifecycle management(“PLM”) application. A coupling may comprise an application programminginterface (API) connection. A PLM application may comprise (e.g.maintain) data corresponding to a (e.g., current) value of a marking fora requested 3D object. For example, a current value may correspond to a(e.g., given) serial number of a requested 3D object (e.g., in amanufacturing line).

In some embodiments, a formation environment stage comprises asimulation of a manufacturing device environment. The simulation may beperformed within (e.g., by) a module that enables a build volumesimulation. The simulation may comprise any simulation method asdescribed herein. A build volume simulation may enable an optimizationof at least one aspect of forming a requested 3D object in themanufacturing device. For example, a build volume simulation mayoptimize at least an aspect of the formation process while consideringthe arrangement of at least one 3D object in the build volume and/orabove the platform. An optimization may comprise consideration of (i)the platform, (ii) build starting material (e.g., pre-transformedmaterial), and/or (iii) (e.g., any) adjacent 3D object(s) that areformed within the build volume and/or above the platform. In someembodiments, optimization may comprise: (i) a formation rate (e.g.,manufacturing speed) of one or more requested 3D objects; (ii) afidelity of a geometry of one or more formed 3D objects with respect tothat of one or more requested 3D objects; (iii) fill scheduling for oneor more formed 3D objects, or (iv) a requested 3D object arrangement.The optimization of fill scheduling may comprise optimization of forminginstructions for the one or more formed 3D objects. For example,optimization of the forming instructions may comprise determining anorder of transformation for a plurality of (e.g., fill) portions thatform a given layer of a requested 3D object. The optimization of thefill scheduling may comprise ordering a sequence of forming processes(e.g., melt pool formation sequence). The forming process sequence mayinclude tiling, and/or hatching operations. The optimization of the fillscheduling may comprise determining an ordering of formation for aplurality of (e.g., interior and/or perimeter) portions of a requested3D object during a given formation lap. The (e.g., totality of the)plurality of portions may correspond to a (e.g., complete) slice of therequested 3D object. An interior portion may be interior with respect toa (e.g., slice) perimeter of the requested 3D object (e.g., at a givenlayer). A requested 3D object arrangement may be with respect to (a) aplatform, (b) one or more transforming agent generators, and/or (c) aplurality of (e.g., all) requested 3D objects. Optimization may comprisea determination of a placement of at least one requested 3D object on(e.g., or above) the platform. Optimization may comprise a determinationof an angle of impingement and/or distance of at least one requested 3Dobject with respect to one or more transforming agent generators.Optimization may comprise determination of a placement of and/ordistance between a plurality of requested 3D objects, e.g., in a buildvolume. Optimization may comprise simulation of (I) one or morerequested 3D objects, or (II) at least a portion of a manufacturingdevice. A simulation may comprise a thermo-mechanical model. Forexample, optimization may comprise a simulation of the one or moreobjects above a supportive platform, e.g., within a given build volume.The simulation may consider (e.g., determine) a deformation of theplatform during formation of at least a portion of a requested 3Dobject. A corrective deformation may be generated, e.g., considering anestimated deformation of the platform. The corrective deformation may befor at least a portion of one or more requested 3D objects, and/or to aforming feature (e.g., auxiliary support(s)).

In some embodiments, a 3D object includes one or more auxiliaryfeatures. The auxiliary feature(s) can be supported by the material(e.g., powder) bed. The term “auxiliary feature” or “support structure”as used herein, generally refers to a feature that is part of a printed3D object, but is not part of the requested, intended, designed,ordered, modeled, or final 3D object. Auxiliary feature(s) (e.g.,auxiliary support(s)) may provide structural support during and/orsubsequent to the formation of the 3D object. The 3D object may have anynumber of supports. The supports may have any shape and size. In someexamples, the supports comprise a rod, plate, wing, tube, shaft, pillar,or any combination thereof. In some cases, the auxiliary supportssupport certain portions of the 3D object and do not support otherportions of the 3D object. In some cases, the supports are (e.g.,directly) coupled to a bottom surface the 3D object (e.g., relative tothe platform). In some embodiments, the supports are anchored to theplatform during formation of the 3D object. In some examples, thesupports are used to support portions of the 3D object having a certain(e.g., complex or simple) geometry. The 3D object can have auxiliaryfeature(s) that can be supported by the material bed (e.g., powder bed)and not contact and/or anchor to the platform, container accommodatingthe material bed, or the bottom of the enclosure. The 3D part (3Dobject) in a complete or partially formed state can be completelysupported by the material bed (e.g., without contacting the platform,container accommodating the powder bed, or enclosure). The 3D object ina complete or partially formed state can be completely supported by thepowder bed (e.g., without touching anything except the powder bed). The3D object in a complete or partially formed state can be suspendedanchorlessly in the powder bed, without resting on and/or being anchoredto any additional support structures. In some cases, the 3D object in acomplete or partially formed (e.g., nascent) state can freely float(e.g., anchorlessly) in the material bed. Auxiliary feature(s) mayenable the removal of energy from the 3D object that is being formed. Insome instances, the auxiliary support is a scaffold that encloses the 3Dobject or part thereof. The scaffold may comprise lightly sintered orlightly fused powder material. In some examples, the 3D object may notbe anchored (e.g., connected) to the platform and/or walls that definethe material bed (e.g., during formation). At times, the 3D object maynot touch (e.g., contact) to the platform and/or walls of the containerthat define and/or encloses the material bed (e.g., during formation).The 3D object be suspended (e.g., float) in the material bed. Thescaffold may comprise a continuously sintered (e.g., lightly sintered)structure that is at most 1 millimeter (mm), 2 mm, 5 mm or 10 mm. Thescaffold may comprise a continuously sintered structure havingdimensions between any of the aforementioned dimensions (e.g., fromabout 1 mm to about 10 mm, from about 5 mm to about 10 mm, or from about1 mm to about 5 mm). In some examples, the 3D object may be printedwithout a supporting scaffold. The supporting scaffold may engulf the 3Dobject. The supporting scaffold may float in the material bed. Theprinted 3D object may be printed without the use of auxiliary features,may be printed using a reduced number of auxiliary features, or printedusing spaced apart auxiliary features. Examples of an auxiliary supportstructure can be found in Patent Application Serial No. PCT/US15/36802filed on Jun. 19, 2015, titled “APPARATUSES, SYSTEMS AND METHODS FORTHREE-DIMENSIONAL PRINTING,” which is entirely incorporated herein byreference in its entirety. The printed 3D object may comprise a singleauxiliary support mark reminiscent of a single auxiliary supportfeature. The single auxiliary feature (e.g., auxiliary support orauxiliary structure) may be a platform (e.g., a building platform suchas a base or substrate), or a mold. The auxiliary support may be adheredto the platform or mold. In some embodiments, the 3D object comprises alayered structure indicative of 3D forming procedure that is devoid ofone or more auxiliary support features or one or more auxiliary supportfeature marks that are indicative of a presence or removal of the one ormore auxiliary support features. Examples of auxiliary features compriseheat fins, wires, anchors, handles, supports, pillars, columns, frame,footing, scaffold, flange, projection, protrusion, mold (a.k.a. mould),or other stabilization features.

In some embodiments, the instructions (e.g., the forming instructionsand/or the layout instructions) data may be generated by processing datathrough (e.g., at least one of) the above-mentioned stages. One or moreof the modules (e.g., within a stage) may be separate from another. Datamay transition (e.g., be transferred) between at least two separatemodules. At least two of the modules may be executed by differentprocessors. At least two of the modules may be executed by the sameprocessor. At least two of the modules may be in a software (e.g.,application). At least two of the modules may be in different software(e.g., applications).

In some embodiments, instructions data for generating a requested 3Dobject may be received by at least one manufacturing device. Theinstructions data may comprise specification of at least one processparameter. The instructions data may comprise specification of at leastone characteristic of a transforming agent. The at least onemanufacturing device may comprise at least one processor operable toread the instructions (e.g., data). For example, the at least onemanufacturing device may comprise at least one controller. The at leastone controller may control one or more process parameters (e.g., of theat least one manufacturing device). For example, the at least onecontroller may control at least one apparatus of the manufacturingdevice.

In some embodiments, the methods, systems, apparatuses, and/or softwaredisclosed herein comprise providing a security (e.g., level) to (e.g.,at least a portion of) the instruction data for forming the 3D object.The security may promote an (i) integrity, (ii) authentication, and/or(iii) confidentiality, of data used to form at least a portion of atleast one three-dimensional (3D) object. The security may promote (e.g.,confirm) that a closed system is formed (e.g., maintained). The closedsystem may comprise a pre-formation environment and a manufacturingdevice that are for forming a 3D object (e.g., a requested 3D object).The security may be implemented for (e.g., during) generation ofinstructions data. The security may be implemented for (e.g., during)the process (e.g., virtual and/or physical) formation of the 3D object.The security may deter (e.g., restrain and/or prevent) unauthorizedaccess to at least a portion of the instructions data. The security maycomprise encryption of at least one forming instructions related file.The security may be implemented (e.g., provided) during a transfer fromat least one stage and/or module to another. The encryption may compriseat least one level of encryption. A (e.g., given) level of encryptionmay be implemented within (e.g., by) a module and/or a stage. Forexample, a given module may implement an encryption level by encryptionto any (i) received, (ii) generated, and/or (iii) transmitted, data.Received and/or transmitted data may be between at least two stages,and/or between at least two modules. The encryption may be implementedby a module dedicated to encryption implementation. The encryption maycomprise a symmetric encryption scheme, an asymmetric encryption scheme,or a combination thereof. The encryption may comprise a (I) DataEncryption Standard (DES) (e.g., Triple DES), (II) Rivest-Shamir-Adleman(RSA), (III) Advanced Encryption Standard (AES), (IV) Blowfish, or (V)Twofish, encryption scheme. The encryption may comprise one or moreencryption keys. The encryption may comprise an encryption key and adecryption key. In some embodiments, an encryption key and a decryptionkey are the same (e.g., the same key). In some embodiments, anencryption key and a decryption key are different (e.g., differentkeys). In some embodiments, an encryption scheme may comprise a publicencryption key, or a private encryption key. Security may comprisegeneration of at least two encryption levels. Implementation of at leasttwo encryption levels may comprise an encryption level (e.g., a secondencryption level) that is added to a previous encryption level (e.g., afirst encryption level). The first encryption level and the secondencryption level may comprise different encryptions, such as, e.g.,different types of encryption. The encryption of the first encryptionlevel and the second encryption level may be the same (e.g., the sametype). The encryption may comprise a first encryption level to a firstsection of a file (e.g., related to the forming instructions), and asecond encryption level to a second section of the file. For example,the first section may be a body (e.g., payload) of the file, and thesecond section may be metadata of the file. For example, the firstsection and the second section may be different sections of the body(e.g., payload) of the file. For example, the first section and thesecond section may be different sections of the metadata of the file.Encryption may be added to a file to form an encrypted file. Suchencrypted file may not be accessible by a user that does not have anencryption and/or decryption key, for example. The encrypted file mayhave a higher level of complexity as compared to the non-encrypted file.For example, the encrypted file has a greater level of complexity than anon-encrypted (or unencrypted) file. The encryption may increase thesize and/or processing time of the encrypted file as compared to anon-encrypted file. For example, as compared to an unencrypted filecomprising forming instructions: (i) an encrypted file comprisingforming instructions may have a larger size; (ii) it may take a longertime to transmit such encrypted file to a forming device; and (iii) itmay take a longer time for a computer of the forming device to decryptsuch encrypted file to yield forming instructions for forming a 3Dobject. The first encryption level may be generated in a prior moduleand/or stage. The second encryption level may be generated in asubsequent module and/or stage. A plurality of encryption levels (e.g.,at least two encryption levels) may be implemented by a plurality ofstages and/or modules (e.g., at least two stages and/or modules). Aplurality of encryption levels may be implemented by the same stageand/or module (e.g., the same stage and/or module may implement at leasttwo encryption levels). An encryption level may be used to validatecompletion of a module and/or stage.

In some embodiments, security (e.g., encryption) is provided for atleast a portion of the instructions data during its generation and/ortransmission. In some embodiments, security is provided for at least aportion of the instructions data following its generation (e.g., priorto a transmission). The security may be implemented for at least aportion of a file related to the forming instructions. A transmissionmay be a movement of data between (i) at least two stages, (ii) at leasttwo modules, (iii) at least two processors, and/or (iv) a pre-formationapplication and a manufacturing device. A transmission may comprisemovement of data within (a) a bus (e.g., of a motherboard), or (b) anetwork. The transmission may be wireless.

In some embodiments, authentication is provided in an instructions daterelated file. The authentication may be used to validate completion of amodule and/or stage. The authentication may be regarding a source usedto generate instructions data for forming a requested 3D object. Theauthentication may comprise a characteristic of at least a portion of afile related to the forming instructions. The characteristic may includea file format, and/or an encryption mechanism. The characteristic mayform a section of the at least the portion of the file (e.g., related tothe forming instructions). For example, the characteristic may be storedwithin a body (e.g., payload), and/or as metadata, of a file. Theauthentication may be implemented by providing error detection of atleast a portion of file related to the forming instructions. In someembodiments, the error detection comprises a checksum or a hash.

In some embodiments, a security protocol is implemented to constrain(e.g., prevent) (i) a data breach, (ii) tampering, and/or (iii) propertyloss (e.g., and/or harm). In some embodiments, a security protocol(e.g., encryption) is implemented for at least a portion of a (e.g.,forming instructions) file that comprises manufacturing device (e.g.,apparatus) settings, and/or (e.g. requested 3D object) design data. Insome embodiments, a plurality of process parameters are specified byforming instructions data for a given requested 3D object. The pluralityof process parameters may correspond to one or more manufacturing devicesettings. For example, one or more settings may be specified for atleast one apparatus of a manufacturing device. The one or more settingsmay comprise (a) a voltage setpoint, (b) a current setpoint, (c) a(e.g., activation) timing (e.g., duty cycle), or (d) a power (e.g.,output), of an apparatus of the manufacturing device. The specificationof the plurality of process parameters may comprise (i) an attribute(e.g., a temperature) at one or more positions at a target surface(e.g., of a build region), (ii) a target surface height (e.g., exposedsurface of a material bed) at a position, (iii) a (e.g., average ormean) target surface planarity, (iv) a gas flow (e.g., within a buildregion), (v) a pressure (e.g., within a build volume), (vi) a power of atransforming agent generator (e.g., an energy source) that generates atransforming agent (e.g., an energy beam), (vii) an intensity of atransforming agent (e.g., power density of an energy beam), (viii) atransforming agent flux (e.g., energy beam fluence), (ix) a position ofa transforming agent (e.g., on the target surface), (x) speed of thetransforming agent, (xi) an area of effect (e.g., fundamental lengthscale) of a transforming agent on the target surface (e.g., energy beamfootprint), (xii) a focus (e.g., and/or de-focus) of a transformingagent, (xiii) a dwell time of the transforming agent, or (xiv) anintermission time of a transforming agent. A given process parameter(e.g., setpoint) may be achieved by control of a (e.g., at least one)manufacturing device apparatus. In some embodiments, specification ofthe plurality of process parameters is automatic, manual, or anycombination thereof. Automatic may comprise specification of at leastone process parameter value using at least one controller. Manual maycomprise default, user-specified, and/or automatically (e.g., preset)values. The plurality of process parameter (e.g., values) may beconstant (e.g., fixed) and/or varying. Varying may comprise time-varied.Specification of the plurality of process parameters, e.g., duringgeneration of the forming instructions, may be according to selectedforming process(es). The selected forming process(es) may consider oneor more forming parameters of the requested 3D object, as describedherein.

In some embodiments, a data breach constitutes disclosure of at least aportion of a file, e.g., that is related to forming instructions. Thedisclosure may be sufficient to cause damage to at least one party. Forexample, a data breach may reveal at least a portion of processparameter data. The revealed process parameter data may comprise atleast one setpoint of a manufacturing device (e.g., apparatus), e.g.,during formation of a requested 3D object. For example, a data breachmay reveal a confidential design, e.g., of a requested 3D object. Theconfidential design may be a design of an owner of a manufacturingdevice that is suitable for forming the requested 3D object, and/or adesign of a third party. In some embodiments, a data breach mayconstitute a violation of a contractual obligation. For example, acontractual obligation may exist between a (e.g., forming) company thatowns a manufacturing device that is suitable for forming a requested 3Dobject, and a third party that has requested (e.g., contracted with) theforming company to form the requested 3D object. In some embodiments, adata breach may violate a jurisdictional law or regulation. For example,a data breach may violate a rule, regulation, and/or law regarding (i)privacy, and/or (ii) data protection. For example, a requested 3D objectmay be intended for implantation into a (e.g., human and/or animal) body(e.g., an implant).

In some embodiments, tampering comprises an alteration to at least aportion of a file, e.g., that is related to forming instructions. Thealteration may comprise a change that causes a formed 3D object todeviate from a requested 3D object. The deviation may comprise adeviation in a (a) geometry, or (b) at least one material property, ofthe formed 3D object. The deviation may comprise a deviation that isoutside of a threshold value (e.g., tolerance). The alteration maycomprise a disruption to at least one component of (I) a pre-formationenvironment (e.g., stage and/or module), and/or (II) a manufacturingdevice. Tampering may promote at least partial loss of (e.g., owner)control for the at least one component. For example, tampering mayintroduce a virus, spyware, worm, trojan, botnet, or ransomware, intothe at least one component. The alteration may comprise a change thatplaces (i) a manufacturing device (e.g., apparatus), (ii) (e.g.,operating) personnel, (iii) an environment, and/or (iv) a facility, inan unsafe operating condition. An unsafe operating condition may promote(e.g., cause) an (e.g., increased) risk of property loss and/or harm.Increased may be with respect to an operating condition that is devoidof tampering (e.g., alteration).

In some embodiments, insufficient security (e.g., a lack thereof) for atleast a portion of a file, e.g., that is related to forminginstructions, promotes (e.g., enables and/or results in) damage toproperty and/or to person. The damage may comprise property loss and/or(e.g., personal) harm. The damage may result from (e.g., be caused by)tampering with the file. The damage may be by accessing the informationof the file and/or exposing at least part of the information in thefile. For example, damage may be to (i) a forming equipment, (ii)materials, (iii) a forming facility, (iv) a person (e.g., facilitypersonnel), or (v) intellectual property. The encryption describedherein may prevent, deter and/or hinder such insufficient security. Theforming equipment may be a manufacturing device (e.g., or a componentthereof) that is suitable for forming a requested 3D object. Damage(e.g., to material, equipment, or personnel) may comprise (a) wastedformation (e.g., starting) material, (b) wear and tear to one or morecomponents of a manufacturing device, or (c) wasted labor (e.g.,personnel work-hours). Damage to a forming facility may comprise damageto a forming environment. Damage to a forming environment may comprisedamage to one or more objects and/or property that is within or adjacentto the forming environment. For example, damage to a forming environmentmay be caused by a compromised manufacturing device and/or material,e.g., that has been subjected to tampering. Damage (e.g., or harm) to aperson may comprise harming (I) forming facility personnel, or (II) arecipient of a formed 3D object. A forming facility personnel maycomprise a person involved with the forming of a (e.g., requested) 3Dobject, and/or that is disposed in a location of forming the 3D object.A recipient of a formed 3D object may comprise a customer, e.g., of acompany that forms the requested 3D object. A recipient of a formed 3Dobject may comprise a patient e.g., where the formed 3D object is animplant and/or augmentation. Damage to intellectual property maycomprise theft and/or copying of a (e.g., object) design, or of secretinformation (e.g., a trade secret). The secret information may beembedded in the file. For example, damage to intellectual property maycomprise improper access to one or more process parameters that arespecified to form at least a portion of a requested 3D object, and/or tothe design of the 3D object.

In some embodiments, data from at least a portion of a file, e.g., thatis related to forming instructions, is passed (e.g., transmitted)between at least two communicatively coupled components. The at leasttwo communicatively coupled components may be operable to read, process,and/or manipulate the data. The communicatively coupled components maybe (e.g., embedded in) a processor. The communicatively coupledcomponents may be (e.g., embedded in) a non-transitory computer readablemedia. The communicatively coupled components may be (e.g., embedded in)a program (e.g., software). A component may comprise (a) a stage, (b) amodule, (c) a processor, or (d) any combination thereof. The at leasttwo components may be embodied in a pre-formation environment, amanufacturing device, and/or a combination thereof. In some embodiments,at least two components that transmit data (e.g., therebetween) comprisea (e.g., data) pipeline. In some embodiments, a security (e.g., level)is implemented (i) during entry, (ii) during processing (e.g.,manipulation), and/or (iii) prior to transmission, of the data by acomponent. In some embodiments, a security (e.g., level) is implemented(i) during access, (ii) during (e.g., data) processing, and/or (iii)prior to transmission, of the data by a processor.

In some embodiments, (e.g., at least) a second component considers dataprovided by (e.g., at least) a first component (e.g., in the pipeline).In some embodiments, the data comprises encrypted data of at least aportion of a file, e.g., that is related to forming instructions of the3D object(s). The second component may decrypt at least a portion (e.g.,all) of the data to form encrypted data. In some embodiments, at leasttwo (e.g., the first and second) components operate in parallel. In someembodiments, at least two components operate sequentially. For example,at least two stages may operate in parallel and/or sequentially. Forexample, at least two modules may operate in parallel and/orsequentially. For example, at least two processors may operate inparallel and/or sequentially. In some embodiments, at least one stagecomprises at least two modules. In some embodiments, at least twomodules are embodied on separate (e.g., computing) systems. For example,separate computing systems may comprise a distributed system (e.g.,network).

FIG. 3 depicts an example of an implementation of data assurance forinstructions data for forming at least a portion of a requested 3Dobject. The instructions data may be generated and/or transmitted in a(e.g., data) pipeline. In the example of FIG. 3 , in a (e.g., first)stage 315 data corresponding to a geometric model 301 of a (e.g.,requested) 3D object is considered in the generation of object formationinstructions, e.g., by a module 307. One or more modules (e.g., of adata pipeline) may be involved in the generation of object formationinstructions for a requested 3D object, e.g., modules as describedherein. The one or more modules may receive, process, manipulate, and/ortransmit at least a portion of a file, e.g., that is related to forminginstructions data. In the example of FIG. 3 , data corresponding to thegeometric model is provided to a (e.g., first) module 303, on to a(e.g., second) optional module 305, and then on to the module 307. Whilethe example FIG. 3 depicts three (3) modules in an object stage, in someembodiments a greater or fewer number of modules are utilized in theobject stage. In some embodiments, a data assurance (e.g., measure) isimplemented for at least a portion of a file in an object stage. Forexample, a security (e.g., level) may be implemented for at least aportion of a file in an object stage. For example, the data assurancemay comprise encryption (e.g., 313) and/or authentication (e.g., errordetection). The example depicted in FIG. 3 shows encryption and errordetection as data assurance options that may be implemented, however,any other data assurance option(s) can be implemented in their stead.Other data assurance option(s) may comprise (i) a certification, (ii) avalidation, (iii) a verification of integrity, or (iv) anauthentication. In some embodiments, the data assurance is implementedwithin a module, e.g., of the object stage. In some embodiments, thedata assurance is implemented prior to or following a data transmission,e.g., from a first module to a second module. In some embodiments,security (e.g., encryption) is implemented within a module (e.g.,encryption 315). In some embodiments, security (e.g., encryption) isimplemented prior to or following a data transmission, e.g., between atleast two modules (e.g., encryption 309). In some embodiments,authentication (e.g., error detection) is implemented within a module(e.g., error detection 311). In some embodiments, authentication (e.g.,error checking) is implemented prior to or following a datatransmission, e.g., between at least two modules (e.g., error detection316).

In some embodiments, data is provided from a first (e.g., object) stageto a second (e.g., formation environment) stage. In some embodiments, aplurality of objects may be prepared, e.g., in a first (e.g., object)stage. In the example of FIG. 3 , object formation instructionscorresponding to a plurality of requested objects (e.g., FIG. 3, 310,320, and 330 ) is provided to a (e.g., second) stage 335. A second stagemay comprise a formation environment stage. The stage may be referred toherein as phase, branch, or division. The formation environment stagemay comprise one or more modules. In the example of FIG. 3 , a module321 is for forming an arrangement (e.g., of requested 3D objects) of abuild volume (e.g., a formation layout); and a module 323 generateslayout instructions considering the formation layout. The instructionsdata for forming the requested 3D object(s), e.g., comprising forminginstructions and/or layout instructions, may be provided to amanufacturing device (e.g., FIG. 3, 325 ). In some embodiments, a dataassurance (e.g., measure) is implemented for at least a portion of afile in a formation environment stage. For example, a security (e.g.,level) may be implemented for at least a portion of a file in aformation environment stage. For example, encryption (e.g., FIG. 3, 333) may be implemented. In some embodiments, the data assurance comprises(i) a certification, (ii) a validation, (iii) a verification ofintegrity, (iv) an authentication, (v) encryption, or (vi) errordetection. In some embodiments, the data assurance is implemented withina module, e.g., of the formation environment stage. In some embodiments,the data assurance is implemented prior to or following a datatransmission, e.g., from a first module to a second module. In someembodiments, security (e.g., encryption) is implemented within a module,e.g., of the formation environment stage. In some embodiments, security(e.g., encryption) is implemented prior to or following a datatransmission, e.g., between at least two modules (e.g., encryption 319).In some embodiments, authentication (e.g., error detection) isimplemented within a module, e.g., of the formation environment stage.In some embodiments, authentication (e.g., error checking) isimplemented prior to or following a data transmission, e.g., between atleast two modules (e.g., error detection 327). While the example FIG. 3depicts two (2) modules in a formation environment stage, in someembodiments a greater or fewer number of modules are utilized in theformation environment stage.

In a forming process (e.g., 3D printing), a requested 3D object can beformed (e.g., printed) according to forming (e.g., printing)instructions. The forming instructions may at least in part consider a(e.g., geometric) model of a requested 3D object. The geometric modelmay be a virtual model (e.g., a computer-generated model of the 3Dobject). For example, the geometric model may comprise a CAD model. Thegeometric model may be a virtual representation of the geometry and/orthe topology of the 3D object (e.g., in the form of 3D imagery). Thegeometric model may correspond to an image (e.g., scan) of an object(e.g., a real object such as a test object). The image may be a scanimage.

A dispenser may deposit the binder and/or the reactive species, e.g.,through an opening in the dispenser. An energy source may generate theenergy beam. A dispenser may deposit the pre-transformed material, e.g.,to form a material bed. In some embodiments, the 3D object is formed ina material bed. The material bed (e.g., powder bed) may compriseflowable material (e.g., powder), e.g., that remains flowable during theforming process (e.g., powder that is not compressed or pressurized).During formation of the one or more 3D objects, the material bed mayexclude a pressure gradient. In some examples, the 3D object (or aportion thereof) may be formed in the material bed with diminishednumber of auxiliary supports and/or spaced apart auxiliary supports(e.g., spaced by at least about 2, 3, 5, 10, 40, or 60 millimeters). Insome examples, the 3D object (or a portion thereof) may be formed in thematerial bed without being anchored (e.g., to the platform). Forexample, the 3D object may be formed without auxiliary supports.

In some examples the 3D object may be formed above a platform, e.g.,without usage of a material bed. The 3D printing cycle may correspondwith (I) depositing a pre-transformed material toward the platform, and(II) transforming at least a portion of the pre-transformed material(e.g., by at least one energy beam) at or adjacent to the platform(e.g., during deposition of the pre-transformed material towards theplatform) to form one or more 3D objects disposed above the platform. Anadditional sequential layer (or part thereof) can be added to theprevious layer of a 3D object by transforming (e.g., fusing and/ormelting) a fraction of pre-transformed material that is introduced(e.g., as a pre-transformed material stream) to the prior-formed layer.The depositing in (i) and the transforming in (ii) may comprise aforming increment. A dispenser may deposit the pre-transformed material,e.g., through an opening of the dispenser.

In some embodiments, forming instructions for forming (e.g., a givenlayer of) the 3D object(s) may comprise the utilization (e.g.,selection) of one or more 3D forming (e.g., printing) procedures. Aforming procedure may comprise a forming feature (e.g., an auxiliarysupport) or a forming process (e.g., of a plurality of formingprocesses). The particular forming procedure(s) (e.g., of a plurality offorming procedures) that is used to generate a given portion of the(e.g., layer of) the 3D object may consider the geometry of the 3Dobject. For example, the forming procedure that is used may consider:(i) a position of the given portion (e.g., with respect to a geometry ofthe 3D object(t); (ii) an angle of the given portion (e.g., of a normalvector at a surface of the 3D object, and/or with respect to a globalvector); (iii) an intended use of the given portion (e.g., according toan intended use of the requested 3D object); (iv) a requested (e.g.,surface) characteristic of the given portion (e.g., a surface roughnessor a dimensional accuracy); and/or (v) a requested material property ofthe given portion. The given portion of the (e.g., layer of) requested3D object may comprise a (e.g., slice) feature. In some embodiments, aslice feature may be designated (e.g., specified) considering: (i) aposition (e.g., of a given portion) with respect to a geometry of the 3Dobject; and/or (ii) an angle of the given portion, e.g., of a normalvector at a point on surface of the 3D object, and/or with respect to aglobal vector. Examples of a geometry of a 3D object, e.g., a cavity, aledge, or an overhang, can be found in patent application serial numberPCT/US17/54043, which is incorporated herein by reference in itsentirety. In some embodiments, a (e.g., each) slice of a requested 3Dobject comprises a plurality of slice features. The particular formingprocedure(s) that is/are used to generate a given portion (e.g., slicefeature) of the 3D object may be selected manually and/or automatically(e.g., using a controller). The selection may be before and/or duringthe printing of the 3D object. For example, the selection may be alteredduring the printing of the 3D object. The alteration may be manual(e.g., by a user) and/or automatic (e.g., using a selection tree,simulation, and/or other procedure). The alteration may consider datafrom one or more sensors.

In some embodiments, a forming instructions module (e.g., engine and/orprogram) comprises code for generation of forming instructions for atleast one (e.g., each) virtual slice of a virtual geometric model. Theforming instructions module may receive data from one or more priormodules and/or stages, e.g., in a data pipeline. In some embodiments,the forming instructions engine considers (e.g., manual and/orautomatic) selection of at least one forming process (e.g. of aplurality of forming processes) for a (e.g., each) virtual slice orslice portion. The virtual slice of a model of the 3D object maycorrespond to a formed layer of the 3D object. The slice portion maycomprise a slice edge, or slice interior. The plurality of formingprocesses may comprise hatching, tiling, forming globular melt pools,forming high aspect ratio melt pools, re-transforming, annealing, orpre-heating. Examples of forming processes can be found in PatentApplication serial number PCT/US18/20406, titled “THREE-DIMENSIONALPRINTING OF THREE-DIMENSIONAL OBJECTS” that was filed Mar. 1, 2018, andin U.S. Patent Application Ser. No. 62/654,190, titled“THREE-DIMENSIONAL PRINTING OF THREE-DIMENSIONAL OBJECTS” that was filedApr. 6, 2018, each of which is incorporated herein by reference in itsentirety.

In some embodiments, the forming instructions that are generated in apre-formation software environment are sent to one or more forming tools(e.g., printer, extruder and/or welder). The generation of the forminginstructions may comprise a data pipeline. The data pipeline maycomprise one or more stages and/or modules. The data pipeline maycomprise security (e.g., an implementation thereof). The data pipelinemay comprise generation of and/or modification to one or more files. Theone or more files may be organized in a structure, e.g., in a directorycomprising folders and optionally sub-folders. Organization of the oneor more files may comprise data compression, e.g., into a zip and/orarchive file.

FIG. 4 depicts an example flowchart 400 comprising: receiving ageometric model (e.g., 401); an optional operation 402 for designating aportion of the geometric model as an ROI; an optional operation 403 fordesignating at least one forming (e.g., printing) procedure for an ROI;an optional operation 404 for estimating a likelihood of 3D objectformation failure; an optional operation 405 for performing a simulation(e.g., of the forming and/or the formed 3D object); and generatingforming instructions (e.g., 406). In some embodiments, at least twooperations (e.g., 402-406) are performed (e.g., implemented) by a firstmodule and a second module. In some embodiments, the first module andthe second module are the same. In some embodiments, the first moduleand the second module are different. In some embodiments, a separatemodule performs an (e.g., each) individual operation. In someembodiments, a data assurance (e.g., measure) is implemented (e.g.,within a data pipeline) for at least a portion of a file that is relatedto the forming instructions, e.g., in the pipeline that includes theforming instructions. For example, a security (e.g., level) may beimplemented (e.g., within a data pipeline) for at least a portion of afile that is related to the forming instructions. For example, securitymay be implemented by an encrypting operation and/or error detection(e.g., authentication) operation. An encrypting operation may encrypt atleast a portion of the file (e.g., 423), e.g., that is related to theforming instructions. In some embodiments, security (e.g., encryption)is implemented within a module (e.g., 421). In some embodiments,security (e.g., encryption) is implemented prior to or following a datatransmission (e.g., 420), e.g., between at least two operations (e.g.,modules). In some embodiments, error detection (e.g., authentication) isimplemented within a module (e.g., 425). In some embodiments, errordetection (e.g., authentication) is implemented prior to or following adata transmission, e.g., between at least two modules (e.g., 422). Theexample depicted in FIG. 4 shows encryption and error detection as dataassurance options that may be implemented, however, any other dataassurance option(s) can be implemented in their stead. Other dataassurance option(s) may comprise (i) a security, (ii) a certification,(Hi) a validation, (iv) a verification of integrity, or (v) anauthentication, for at least a portion of a file that is related to theforming instructions.

In some embodiments, forming instructions generated in an object stageare provided to a second (e.g., formation environment) stage. The secondstage may modify the forming instructions that were generated in theobject stage. In some embodiments, a modification of the forminginstructions (e.g., data) comprises a modification regarding: (i) anarrangement (e.g., of a plurality of objects) of a build volume; (ii) asequence (e.g., of at least two manufacturing device apparatuses); (iii)object labelling; (iv) any corrective deformation to a virtual model ofthe 3D objects arranged in the build volume (e.g., based at least inpart in a build volume simulation) and/or (v) assignment of forming(e.g., print) processes based on a requested structure and/or materialproperty of the objects arranged in the build volume. For example, thesecond stage may generate layout instructions.

In some embodiments, the layout instructions are generated in apre-formation software environment. The layout instructions may be sentto one or more forming tools (e.g., printer, extruder and/or welder).The generation of the layout instructions may comprise a data pipeline.The data pipeline may comprise one or more stages and/or modules. Thedata pipeline may comprise security (e.g., an implementation thereof).FIG. 5 depicts an example flowchart 500 comprising: receiving forminginstructions (e.g., 501); an operation of arranging one or morerequested 3D objects in a build volume (e.g., 502); an optionaloperation 503 for designating a sequence for at least two apparatuses ofa manufacturing device; an optional operation 504 for labelling at leasta portion of a requested 3D object; an optional operation 505 forperforming a (e.g., build volume) simulation, e.g., of the formingand/or the formed 3D object(s); and generating layout instructions(e.g., 506). In some embodiments, at least two operations (e.g.,502-506) are performed (e.g., implemented) by a first module and asecond module. In some embodiments, the first module and the secondmodule are the same. In some embodiments, the first module and thesecond module are different. In some embodiments, a separate moduleperforms an (e.g., each) individual operation. In some embodiments, adata assurance (e.g., measure) is implemented (e.g., within a datapipeline) for at least a portion of a file that is related to the layoutinstructions. For example, a security (e.g., level) may be implemented(e.g., within a data pipeline) for at least a portion of a file that isrelated to the layout instructions. For example, security may beimplemented by an encrypting operation and/or error detection (e.g.,authentication) operation. An encrypting operation may encrypt at leasta portion of the file (e.g., 523), e.g., that is related to the layoutinstructions. In some embodiments, security (e.g., encryption) isimplemented within a module (e.g., 521). In some embodiments, security(e.g., encryption) is implemented prior to or following a datatransmission (e.g., 520), e.g., between at least two operations (e.g.,modules). In some embodiments, error detection (e.g., authentication) isimplemented within a module (e.g., 525). In some embodiments, errordetection (e.g., authentication) is implemented prior to or following adata transmission, e.g., between at least two modules (e.g., 522). Theexample depicted in FIG. 5 shows encryption and error detection as dataassurance options that may be implemented, however, any other dataassurance option(s) can be implemented in their stead. Other dataassurance option(s) may comprise implementation of (i) a security, (ii)a certification, (lii) a validation, (iv) a verification of integrity,or (v) an authentication, for at least a portion of a file that isrelated to the forming instructions.

In some cases, performing the simulation (e.g., FIG. 4, 405 ; FIG. 5,505 ), generating forming instructions (e.g., FIG. 4, 406 ), generatinglayout instructions (e.g., FIG. 5, 506 ), sending the forming (e.g.,print) instructions (e.g., FIG. 4, 408 ), and/or sending the layoutinstruction (e.g., FIG. 5, 508 ) is/are performed during at least aportion of the forming. In some cases, performing the simulation (e.g.,FIG. 4, 405 ), generating forming instructions (e.g., FIG. 4, 406 ),and/or sending the forming instructions (e.g., FIG. 4, 408 ) is/areperformed before and/or during the forming. Each of operations 402-406and/or 502-506 can constitute a module. The operations 401-408 and/or501-508 can constitute a (e.g., object) stage. In some embodiments,forming instructions generated in an object stage are provided (e.g.,directly) to a manufacturing device, e.g., for forming a requested 3Dobject. In some embodiments, forming instructions generated in an objectstage are provided (e.g., for further processing) to a second (e.g.,formation environment) stage.

One or more objects can be formed (e.g., printed) (e.g., FIG. 4, 412 ;FIG. 5, 512 ) using one or more manufacturing devices (e.g., formingtools such as printers). In some embodiments, formation of the 3D objectis optionally monitored (e.g., FIG. 4, 414 ; FIG. 5, 514 ). Monitoringcan comprise using one or more detectors that detect one or more outputs(e.g., thermal, optical, chemical and/or tactile signals). The detectorcan comprise a sensor. In some cases, monitoring is performed inreal-time during formation of the one or more 3D objects. In some cases,monitoring is done before, during and/or after printing. The monitoringmay use historical measurements (e.g., as an analytical tool and/or toset a threshold value). Monitoring of one or more aspects of formationcan optionally be used to (e.g., directly) modify the forminginstructions (e.g., FIG. 4, 413 ) and/or adjust the one or moresimulations (e.g., FIG. 4, 415 ). Monitoring of one or more aspects offormation can optionally be used to (e.g., directly) modify the layoutinstructions (e.g., FIG. 5, 513 ) and/or adjust the one or moresimulations (e.g., FIG. 5, 515 ). For example, one or more thermaldetectors may gather (e.g., real time) thermal signals (e.g., real timethermal signature curve) at and/or in a location in proximity to (e.g.,vicinity of) an irradiation spot on the target surface during printingof a 3D object. The location in proximity to the irradiation spot mayinclude an area of at least about 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5,5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, or 10 FLS (e.g., diameter) of amelt pool. The location in proximity to the irradiation spot may includean area between any of the afore-mentioned values (e.g., from about 1FLS to about 10 FLS, from about 1 FLS to about 5 FLS, from about 5 FLSto about 10 FLS, or from about 1 FLS to about 6 FLS) of irradiationspots. The thermal signals can be compared to a target thermal signal(e.g., target thermal signature curve) during the formation process. Oneor more characteristics of a transforming agent may be altered duringformation of the 3D object to adjust the (e.g., real time) thermalsignal to (e.g., substantially) match the target temperature. Thealteration to the transforming may comprise an alteration to (i) atransformation density (or transformation strength), (ii) a trajectory,(iii) a FLS of a footprint of the transforming agent on the targetsurface, (iv) a hatch spacing, (v) a scan speed, (vi) a scanning scheme(v) a dwell time of the transforming agent, as it progresses along apath along the target surface, or (vi) an intermission time of thetransforming agent as it progresses along a path along the targetsurface. For example, the alteration may comprise an alteration to anenergy beam (a) power density at the target surface, (b) wavelength, (c)cross section, (d) path, (e) irradiation spot size, (f) scan speed, (g)dwell time, (h) intermission time, or (i) power of the energy sourcegenerating the energy beam. Matching the target temperature may be towithin a (e.g., pre-determined) tolerance.

In some embodiments, a target thermal signal is obtained from one ormore simulations (e.g., FIG. 4, 405 ; FIG. 5, 505 ), e.g., anysimulation described herein. The target signal may be a value, a set ofvalues, or a function (e.g., a time dependent function). The one or more3D objects may optionally be analyzed (e.g., FIG. 4, 416 ; FIG. 5, 516). In some embodiments, a target (e.g., thermal) signal is obtained fromhistorical data of 3D objects (or portions thereof) that have beenanalyzed. In some embodiments, the object(s) or portion(s) thereof isanalyzed using an inspection tool (e.g., optical camera, x-rayinstrument, sensor, and/or a microscope). The microscope may comprise anoptical, or an electron microscope. The microscope may comprise ascanning tunneling, scanning electron, or a transmission electronmicroscope. The measurement may be conducted using a method comprisingX-ray tomography, tensile tester, fatigue tester, eStress system, orX-ray diffraction (XRD). The measurements may be conducted at ambienttemperature. The surface roughness of the 3D object can be measured witha surface profilometer. In some cases, the analysis provides dataconcerning geometry of the object(s). In some cases, the analysisprovides data concerning one or more material properties (e.g.,porosity, surface roughness, grain structure, internal strain and/orchemical composition) of the object(s). In some embodiments, theanalysis data is compared to requested data. For example, a geometry ofthe printed object(s) may be compared with the geometry of the requestedobject(s). In some embodiments, the analysis data is used (e.g., FIG. 4,417 ; FIG. 5, 517 ) to adjust the simulation (e.g., FIG. 4, 410 ; FIG.5, 510 ). The adjusted simulation may be used, for example, in formationof subsequent object(s).

In some embodiments, error detection is implemented (e.g., provided) forat least a portion of a file, e.g., that is related to instructions datafor forming a requested 3D object. The instructions data may comprise(i) forming instructions data, or (ii) layout instructions data. Anerror detection (e.g., value) may be used to validate a completenessand/or integrity of the instructions data. An error detection (e.g.,value) may be used to validate completion of a module and/or stage. Anerror detection (e.g., value) may be used to authenticate (e.g., asource of) data, e.g., that is related to instructions for forming arequested 3D object. An error detection (e.g., value) may be used tovalidate and/or authenticate a version (e.g., revision) of a softwareand/or firmware. For example, error detection may be used forcertification of a software and/or firmware version. Certification maybe used (e.g., required) for generation of 3D objects that have anintended use in a regulated environment, e.g., aerospace and/or medicalapplications. Certification may indicate adherence to a jurisdictionaland/or industrial standard and/or regulation. The error detection maycomprise verification of a generated error detection value. In someembodiments, an error detection value is generated in a pre-formationsoftware environment, and verified by one or more manufacturing devices.In some embodiments, an error detection value is generated in a firstmodule and/or stage, and verified in a second module and/or stage.

In some embodiments, a verification attempt generates an unexpectederror detection value. A verification attempt that generates anunexpected error detection value may result in a response (e.g.,output), e.g., a verification error. A response may comprise (i) anotification, or (ii) a modification to a work flow for forming arequested 3D object. A notification may include generation of an alertof (a) any (e.g., portion(s) of a) file, (b) a module, and/or (c) astage, that is associated with an unexpected error detection value. Thealert may be a visual, tactile, audio, and/or olfactory alert. The alertmay be embedded in an output file. A modification to a work flow maycomprise halting (e.g., preventing) (I) transmission of (e.g.,instructions) data, or (II) formation of a requested 3D object, e.g., bya manufacturing device. Halting transmission may be for transmissionbetween at least two (A) stages, (B) modules, (C) manufacturingdevice(s), (D) processors, (E) a processor and a manufacturing device,or (F) any combination thereof.

In some embodiments, error detection comprises (a) a checksum, (b) acyclic redundancy check (CRC), or (c) a check (e.g., parity) bit, e.g.,of at least a portion of the file. A checksum may comprise a datamanipulation scheme (e.g., algorithm, and/or function). For example, thechecksum may comprise a (e.g., cryptographic) hash function. The hashfunction may receive an input (e.g., file, or portion thereof). The hashfunction may produce a (e.g., characteristic) output. For example, thehash function may produce a string, e.g., a sequence of numbers and/orletters. The string may have a characteristic (e.g., fixed) length. Insome embodiments, a function that generates a checksum comprises (A) amessage digest algorithm (e.g., MD5), or (B) a secure hash algorithm(SHA), e.g., SHA1 or SHA256. In some embodiments, error detection isimplemented within (e.g., by) a module and/or a stage. For example, agiven module may implement error detection by generating a checksum forany data including (i) received, (ii) generated, and/or (iii)transmitted data (e.g., file). Received and/or transmitted data maywithin a (e.g., single) stage, and/or within a (e.g., single) module.Received and/or transmitted data may be between at least two stages,and/or between at least two modules. The error detection may comprise afirst error detection value for a first (e.g., section of a) file, e.g.,that is related to instructions data for forming a requested 3D object.The error detection may comprise a second error detection value for asecond file. For example, the first section may be a body (e.g.,payload), and the second section may be a metadata, of the file. Forexample, the first file may be generated in a first module and/or stage,and the second file may be generated in a second module and/or stage.The first error detection value may be generated in a prior moduleand/or stage. The second error detection value may be generated in asubsequent module and/or stage. A plurality of (e.g., at least two)error detection values may be implemented by at least two stages and/ormodules. A plurality of (e.g., at least two) error detection values maybe implemented by the same stage and/or module.

In some embodiments, a manufacturing device (e.g., 3D printer) comprisesand/or communicates with (e.g., at least one component of) apre-formation (e.g., software) environment. The pre-formationenvironment may comprise one or more components, e.g., modules, stages,and/or processors. The pre-formation environment may generateinstructions data related to the formation of a requested 3D object. Thepre-formation environment and/or the manufacturing device may implementa data assurance (e.g., measure) for at least a portion of a file, e.g.,that is related to the instructions data. The data assurance measure maycomprise security (e.g., encryption) and/or verification (e.g., errordetection). In some embodiments, authorization for accessing (e.g.,reading and/or executing) a secured file is granted (e.g., bestowed).Grant of the authorization for access may be granted considering anidentity of an accessing party. The identity may be embedded in thefile, e.g., the file comprising the instructions data related to theformation of the 3D object. In some embodiments, accessing (e.g.,reading and/or executing) a secured file is hindered (e.g., prevented,or blocked) for a (e.g., any) would-be accessing party that lacksauthorization. In some embodiments, accessing a secured file is limitedto a (e.g., single) authorized accessing party. An accessing party maybe an entity that (i) manufactures, (ii) owns, (iii) controls, and/or(iv) operates a manufacturing device. An accessing party may be anentity that (i) develops, (ii) owns, (iii) controls, and/or (iv)operates a pre-formation environment (e.g., application), e.g., thatgenerates a file related to instructions data for forming a requested 3Dobject. An identity of an accessing party may comprise data relating toa forming apparatus (i) manufacturing party, (ii) owning party, (iii)controlling party, and/or (iv) operating party. An identity of anaccessing party may comprise (e.g., compatibility with): a system type,a system version, e.g., a manufacturing device model (e.g., number)and/or a pre-formation environment application revision. Authorizationfor accessing a secured file may be granted upon a verification (e.g.,authentication) of the identity of an accessing party. For example, theauthentication may be granted for a (e.g., any) manufacturing devicethat is of a same type, model, and/or that is manufactured by a samemanufacturing entity. The authentication may be granted for a (e.g.,any) manufacturing device, that is owned and/or operated by a same(e.g., legal) entity. The authentication may be embedded in the fileduring any of the stages or modules disclosed herein. The authenticationmay be granted for a (e.g., any) pre-formation environment applicationthat is of a same type, version, and/or that is developed by a same(e.g., developing) entity. The authentication may be granted for a(e.g., any) pre-formation environment application, that is controlled,owned and/or operated by a same (e.g., legal) entity. In someembodiments, at least one component and/or manufacturing device isoperable to read at least a portion of an assured data such as anencrypted data (e.g., file). For example, at least one component and/ormanufacturing device may be configured to read and/or execute at least aportion of encrypted data, e.g., prior to accessing and/or modifying thedata. For example, at least one component and/or manufacturing devicemay decrypt at least a portion of encrypted data, e.g., prior toaccessing and/or modifying the data. For example, an (e.g., authorized)at least one component may decrypt at least a portion of encrypted dataprior to modifying instructions data, e.g., by a stage and/or module.For example, an (e.g., authorized) manufacturing device may decrypt atleast a portion of encrypted data prior to executing the instructionsdata, e.g., for forming at least a portion of a requested 3D object.Decryption may be via use of a decryption key (e.g., password). In someembodiments, a decryption key is provided by a pre-formation environment(e.g., component) and/or a manufacturing device.

In some embodiments, the manufacturing device provides an output in theform of a (e.g., data) file. The manufacturing device may provideassurance to the output file, e.g., any assurance described herein. Forexample, the manufacturing device may include encryption. For example,the manufacturing device may embed identification information such as aserial number, type, location, ownership, control, and/or manufacturingentity, of the manufacturing device.

The pre-formation environment and the manufacturing device maycommunicate locally and/or remotely. Remote may comprise communicationthat is wireless and/or over a network architecture. The network maycomprise a peer-to-peer network. The network architecture may comprise aprotocol. FIG. 6 depicts an example 600 of an implementation of dataassurance, wherein a manufacturing device (e.g., 3D printer) 602 is incommunication with a local component (e.g., processor) 601, a remotecomponent 604, and an interface 603. A communication between at leasttwo components may comprise assured data (e.g., FIG. 6, 610 ). Forexample, a communication between at least two components may comprisesecured data. Secured data may comprise encryption and/or errordetection. In some embodiments, local, remote and/or protected (e.g.,through a firewall) communication comprises transmission of secured(e.g., encrypted) data (e.g., FIG. 6, 611-615 ). The communication maybe unidirectional (e.g., one-way, e.g., 614) or bidirectional (e.g.,two-way, e.g., 611). In some embodiments, local, remote and/or protected(e.g., through a firewall) communication comprises transmission ofunsecured data. The example arrows 611 and 613 designate localcommunications. The example arrow 614 designates a manufacturing devicetransmitting (e.g., encrypted) data through a firewall (shown as adiscontinuous line). The example arrows 612 and 615 designate a localcomponent communicating with a remote component (e.g., 604) and aninterface (e.g., 603), respectively. In some embodiments, a decryptionkey is provided by a pre-formation environment and/or a manufacturingdevice. The interface may comprise one or more input and/or displaydevices. The interface may comprise an input/output (I/O) interface. TheI/O interface(s) may comprise one or more wired or wireless connections.The device(s) can include one or more user interfaces (UI). The UI mayenable an interaction with a pre-formation environment and/or amanufacturing device. The UI may include one or more keyboards, one ormore pointer devices (e.g., mouse, trackpad, touchpad, or joystick), oneor more displays (e.g., computer monitor or touch screen), one or moresensors, and/or one or more switches (e.g., electronic switch). In somecases, the UI may be a web-based user interface. The communication ofthe manufacturing device with a remote component and/or a (e.g.,machine) interface may be through a server. The server may be integratedwithin the manufacturing device. The machine interface may be integratedwith, or situated adjacent to, the manufacturing device.

In some embodiments, data security is implemented for a plurality ofmanufacturing devices that are in communication with a server. Theserver may be in communication with (e.g., serve data from) one or morepre-formation environments, and/or one or more components of apre-formation environment, e.g., modules, stages, and/or processors. Theserver may receive and/or transmit encrypted data. In some embodiments,the server may implement a security (e.g., level). In some embodiments,the server may implement error detection.

FIG. 7 shows an example of a data assurance implementation 700 for aplurality of manufacturing devices 703, 713, and 723 that are incommunication with a server 702. The server may be external to theplurality of manufacturing devices. The manufacturing device(s) may bein communication with one or more interfaces. An interface (e.g., 707,717, and 727) may be adjacent to (e.g., integrated in) a (e.g.,respective) manufacturing device (e.g., 703, 713, and 723). An interface(e.g., 704 and 714) may be distant from the plurality of manufacturingdevices. An interface may communicate directly or indirectly with a oneor more processors. The one or more processors may be remote and/orlocal to (e.g., comprised by), a manufacturing device. In someembodiments, the manufacturing device comprises at least one processor.The manufacturing device may comprise a plurality of processors. Atleast two of the plurality of processors may interact with each other(e.g., directly or indirectly). At times, at least two of the pluralityof processors may not interact with each other. Any of the interfacesmay be optionally included in a manufacturing device. A communicationbetween at least two components may be unidirectional or bidirectional.A communication between at least two components may comprise assureddata (e.g., FIG. 7, 710 ). For example, a communication between at leasttwo components may comprise secured data. Secured data may compriseencryption and/or error detection.

In some embodiments, a bidirectional communication comprises secured(e.g., encrypted and/or verified) data. In some embodiments, aunidirectional communication comprises secured (e.g., encrypted and/orverified) data. The arrows in FIG. 7 illustration the directionality ofthe communication (e.g., flow of information direction) betweencomponents. A bidirectional communication may comprise a double-headedarrow, and a unidirectional communication may comprise a single-headedarrow. A manufacturing device may be connected directly or indirectly toone or more components. A manufacturing device may be connected directlyor indirectly (e.g., through a server) to one or more components thatgenerate and/or direct instructions data (e.g., 701, 711, 721 and/or706), e.g., related to forming a requested 3D object. The connection maybe local (e.g., in 701) or remote (e.g., in 706). The manufacturingdevice may communicate (e.g., transmit data) with at least onemonitoring device (e.g., 705 or 708). Communication may be through asecurity level, e.g., a firewall (e.g., 709). A component may be ownedby an entity supplying the forming instructions to a manufacturingdevice (e.g., 708), or by a client (e.g., 705). The client may be anentity or person that requests at least one formed 3D object. At leastone local processor may be in communication with at least one remoteprocessor. At least one processor may be in communication with a formingdevice (e.g., 3D printer). The communication may be direct or indirect,e.g., through a server. The communication may be unidirectional orbidirectional.

In some embodiments, the forming agent comprises an energy beam. Attimes, an energy beam is directed onto a specified area of at least aportion of the target surface for a specified time period. The materialin or on the target surface (e.g., powder material such as in a topsurface of a powder bed) can absorb the energy from the energy beam and,and as a result, a localized region of the material can increase intemperature. In some instances, one, two, or more 3D objects aregenerated in a material bed (e.g., a single material bed; the samematerial bed). The plurality of 3D objects may be generated in thematerial bed simultaneously or sequentially. At least two 3D objects maybe generated side by side. At least two 3D objects may be generated oneon top of the other. At least two 3D objects generated in the materialbed may have a gap between them (e.g., gap filled with pre-transformedmaterial). At least two 3D objects generated in the material bed maycontact (e.g., not connect to) each other. In some embodiments, the 3Dobjects may be independently built one above the other. The generationof a multiplicity of 3D objects in the material bed may allow continuouscreation of 3D objects.

A pre-transformed material may be a powder material. A pre-transformedmaterial layer (or a portion thereof) can have a thickness (e.g., layerheight) of at least about 0.1 micrometer (μm), 0.5 μm, 1.0 μm, 10 μm, 50μm, 100 μm, 150 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800μm, 900 μm, or 1000 μm. A pre-transformed material layer (or a portionthereof) may have any value of the afore-mentioned layer thicknessvalues (e.g., from about 0.1 μm to about 1000 μm, from about 1 μm toabout 800 μm, from about 20 μm to about 600 μm, from about 30 μm toabout 300 μm, or from about 10 μm to about 1000 μm).

At times, the pre-transformed material comprises a powder material. Thepre-transformed material may comprise a solid material. Thepre-transformed material may comprise one or more particles or clusters.The term “powder,” as used herein, generally refers to a solid havingfine particles. The powder may also be referred to as “particulatematerial.” Powders may be granular materials. The powder particles maycomprise micro particles. The powder particles may comprisenanoparticles. In some examples, a powder comprises particles having anaverage FLS of at least about 5 nanometers (nm), 10 nm, 20 nm, 30 nm, 40nm, 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 1 μm, 5 μm, 10 μm, 15μm, 20 μm, 25 μm, 30 μm, 35 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70μm, 75 μm, 80 μm, or 100 μm. In some embodiments, the powder may have anaverage fundamental length scale of any of the values of the averageparticle fundamental length scale listed above (e.g., from about 5 nm toabout 100 μm, from about 1 μm to about 100 μm, from about 15 μm to about45 μm, from about 5 μm to about 80 μm, from about 20 μm to about 80 μm,or from about 500 nm to about 50 μm). The powder in a material bed maybe flowable (e.g., retain its flowability) during the printing.

At times, the powder is composed of individual particles. The individualparticles can be spherical, oval, prismatic, cubic, or irregularlyshaped. The particles can have a FLS. The powder can be composed of ahomogenously shaped particle mixture such that all of the particles havesubstantially the same shape and fundamental length scale magnitudewithin at most about 1%, 5%, 8%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 50%,60%, or 70%, distribution of FLS. In some embodiments, the powder mayhave a distribution of FLS of any of the values of the average particleFLS listed above (e.g., from at most about 1% to about 70%, about 1% toabout 35%, or about 35% to about 70%). In some embodiments, the powdercan be a heterogeneous mixture such that the particles have variableshape and/or fundamental length scale magnitude.

At times, at least parts of the layer are transformed to a transformedmaterial that subsequently forms at least a fraction (also used herein“a portion,” or “a part”) of a hardened (e.g., solidified) 3D object. Attimes a layer of transformed or hardened material may comprise a crosssection of a 3D object (e.g., a horizontal cross section). At times alayer of transformed or hardened material may comprise a deviation froma cross section of a 3D object. The deviation may comprise vertical orhorizontal deviation.

At times, the pre-transformed material is requested and/orpre-determined for the 3D object. The pre-transformed material can bechosen such that the material is the requested and/or otherwisepredetermined material for the 3D object. A layer of the 3D object maycomprise a single type of material. For example, a layer of the 3Dobject may comprise a single metal alloy type. In some examples, a layerwithin the 3D object may comprise several types of material (e.g., anelemental metal and an alloy, several alloy types, several alloy-phases,or any combination thereof). In certain embodiments, each type ofmaterial comprises only a single member of that type. For example, asingle member of metal alloy (e.g., Aluminum Copper alloy). In somecases, a layer of the 3D object comprises more than one type ofmaterial. In some cases, a layer of the 3D object comprises more thanone member of a material type.

In some instances, the elemental metal comprises an alkali metal, analkaline earth metal, a transition metal, a rare-earth element metal, oranother metal. The alkali metal can be Lithium, Sodium, Potassium,Rubidium, Cesium, or Francium. The alkali earth metal can be Beryllium,Magnesium, Calcium, Strontium, Barium, or Radium. The transition metalcan be Scandium, Titanium, Vanadium, Chromium, Manganese, Iron, Cobalt,Nickel, Copper, Zinc, Yttrium, Zirconium, Platinum, Gold, Rutherfordium,Dubnium, Seaborgium, Bohrium, Hassium, Meitnerium, Ununbium, Niobium,Iridium, Molybdenum, Technetium, Ruthenium, Rhodium, Palladium, Silver,Cadmium, Hafnium, Tantalum, Tungsten, Rhenium, or Osmium. The transitionmetal can be mercury. The rare-earth metal can be a lanthanide, or anactinide. The lanthanide metal can be Lanthanum, Cerium, Praseodymium,Neodymium, Promethium, Samarium, Europium, Gadolinium, Terbium,Dysprosium, Holmium, Erbium, Thulium, Ytterbium, or Lutetium. Theactinide metal can be Actinium, Thorium, Protactinium, Uranium,Neptunium, Plutonium, Americium, Curium, Berkelium, Californium,Einsteinium, Fermium, Mendelevium, Nobelium, or Lawrencium. The othermetal can be Aluminum, Gallium, Indium, Tin, Thallium, Lead, or Bismuth.

In some instances, the metal alloy comprises an iron based alloy, nickelbased alloy, cobalt based allow, chrome based alloy, cobalt chrome basedalloy, titanium based alloy, magnesium based alloy, copper based alloy,or any combination thereof. The alloy may comprise an oxidation orcorrosion resistant alloy. The alloy may comprise a super alloy (e.g.,Inconel). The super alloy may comprise Inconel 600, 617, 625, 690, 718,or X-750. The metal (e.g., alloy or elemental) may comprise an alloyused for applications in industries comprising aerospace (e.g.,aerospace super alloys), jet engine, missile, automotive, marine,locomotive, satellite, defense, oil & gas, energy generation,semiconductor, fashion, construction, agriculture, printing, or medical.The metal (e.g., alloy or elemental) may comprise an alloy used forproducts comprising a device, medical device (human & veterinary),machinery, cell phone, semiconductor equipment, generators, turbine,stator, motor, rotor, impeller, engine, piston, electronics (e.g.,circuits), electronic equipment, agriculture equipment, gear,transmission, communication equipment, computing equipment (e.g.,laptop, cell phone, i-pad), air conditioning, generators, furniture,musical equipment, art, jewelry, cooking equipment, or sport gear. Theimpeller may be a shrouded (e.g., covered) impeller that is produced asone piece (e.g., comprising blades and cover) during one 3D printingprocedure. The 3D object may comprise a blade. The impeller may be usedfor pumps (e.g., turbo pumps). Examples of an impeller and/or blade canbe found in U.S. patent application Ser. No. 15/435,128, filed on Feb.16, 2017; PCT patent application number PCT/US17/18191, filed on Feb.16, 2017; or European patent application number. EP17156707.6, filed onFeb. 17, 2017, all titled “ACCURATE THREE-DIMENSIONAL PRINTING,” each ofwhich is incorporated herein by reference in its entirety wherenon-contradictory. The metal (e.g., alloy or elemental) may comprise analloy used for products for human and/or veterinary applicationscomprising implants, or prosthetics. The metal alloy may comprise analloy used for applications in the fields comprising human and/orveterinary surgery, implants (e.g., dental), or prosthetics.

In some instances, the alloy includes a superalloy. The alloy mayinclude a high-performance alloy. The alloy may include an alloyexhibiting at least one of: excellent mechanical strength, resistance tothermal creep deformation, good surface stability, resistance tocorrosion, and resistance to oxidation. The alloy may include aface-centered cubic austenitic crystal structure. The alloy may compriseHastelloy, Inconel, Waspaloy, Rene alloy (e.g., Rene-80, Rene-77,Rene-220, or Rene-41), Haynes alloy, Incoloy, MP98T, TMS alloy, MTEK(e.g., MTEK grade MAR-M-247, MAR-M-509, MAR-M-R41, or MAR-M-X-45), orCMSX (e.g., CMSX-3, or CMSX-4). The alloy can be a single crystal alloy.

In some instances, the iron alloy comprises Elinvar, Fernico,Ferroalloys, Invar, Iron hydride, Kovar, Spiegeleisen, Staballoy(stainless steel), or Steel. In some instances, the metal alloy issteel. The Ferroalloy may comprise Ferroboron, Ferrocerium, Ferrochrome,Ferromagnesium, Ferromanganese, Ferromolybdenum, Ferronickel,Ferrophosphorus, Ferrosilicon, Ferrotitanium, Ferrouranium, orFerrovanadium. The iron alloy may comprise cast iron, or pig iron. Thesteel may comprise Bulat steel, Chromoly, Crucible steel, Damascussteel, Hadfield steel, High speed steel, HSLA steel, Maraging steel,Maraging steel (M300), Reynolds 531, Silicon steel, Spring steel,Stainless steel, Tool steel, Weathering steel, or Wootz steel. Thehigh-speed steel may comprise Mushet steel. The stainless steel maycomprise AL-6XN, Alloy 20, celestrium, marine grade stainless,Martensitic stainless steel, surgical stainless steel, or Zeron 100. Thetool steel may comprise Silver steel. The steel may comprise stainlesssteel, Nickel steel, Nickel-chromium steel, Molybdenum steel, Chromiumsteel, Chromium-vanadium steel, Tungsten steel,Nickel-chromium-molybdenum steel, or Silicon-manganese steel. The steelmay be comprised of any Society of Automotive Engineers (SAE) gradesteel such as 440F, 410, 312, 430, 440A, 440B, 440C, 304, 305, 304L,304L, 301, 304LN, 301LN, 2304, 316, 316L, 316LN, 316, 316LN, 316L, 316L,316, 317L, 2205, 409, 904L, 321, 254SMO, 316Ti, 321 H, or 304H. Thesteel may comprise stainless steel of at least one crystalline structureselected from the group consisting of austenitic, superaustenitic,ferritic, martensitic, duplex, and precipitation-hardening martensitic.Duplex stainless steel may be lean duplex, standard duplex, superduplex, or hyper duplex. The stainless steel may comprise surgical gradestainless steel (e.g., austenitic 316, martensitic 420, or martensitic440). The austenitic 316 stainless steel may comprise 316L, or 316LVM.The steel may comprise 17-4 Precipitation Hardening steel (e.g., type630, a chromium-copper precipitation hardening stainless steel, 17-4PHsteel).

In some instances, the titanium-based alloy comprises alpha alloy, nearalpha alloy, alpha and beta alloy, or beta alloy. The titanium alloy maycomprise grade 1, 2, 2H, 3, 4, 5, 6, 7, 7H, 8, 9, 10, 11, 12, 13, 14,15, 16, 16H, 17, 18, 19, 20, 21, 2, 23, 24, 25, 26, 26H, 27, 28, 29, 30,31, 32, 33, 34, 35, 36, 37, 38, or higher. In some instances, thetitanium base alloy comprises Ti-6Al-4V or Ti-6Al-7Nb.

In some instances, the Nickel alloy comprises Alnico, Alumel, Chromel,Cupronickel, Ferronickel, German silver, Hastelloy, Inconel, Monelmetal, Nichrome, Nickel-carbon, Nicrosil, Nisil, Nitinol, orMagnetically “soft” alloys. The magnetically “soft” alloys may compriseMu-metal, Permalloy, Supermalloy, or Brass. The brass may compriseNickel hydride, Stainless or Coin silver. The cobalt alloy may compriseMegallium, Stellite (e. g. Talonite), Ultimet, or Vitallium. Thechromium alloy may comprise chromium hydroxide, or Nichrome.

In some instances, the aluminum alloy comprises AA-8000, Al—Li(aluminum-lithium), Alnico, Duralumin, Hiduminium, Kryron Magnalium,Nambe, Scandium-aluminum, or Y alloy. The magnesium alloy may compriseElektron, Magnox, or T-Mg—Al—Zn (Bergman-phase) alloy.

In some instances, the copper alloy comprises Arsenical copper,Beryllium copper, Billon, Brass, Bronze, Constantan, Copper hydride,Copper-tungsten, Corinthian bronze, Cunife, Cupronickel, Cymbal alloys,Devarda's alloy, Electrum, Hepatizon, Heusler alloy, Manganin,Molybdochalkos, Nickel silver, Nordic gold, Shakudo, or Tumbaga. TheBrass may comprise Calamine brass, Chinese silver, Dutch metal, Gildingmetal, Muntz metal, Pinchbeck, Prince's metal, or Tombac. The Bronze maycomprise Aluminum bronze, Arsenical bronze, Bell metal, Florentinebronze, Guanin, Gunmetal, Glucydur, Phosphor bronze, Ormolu, or Speculummetal. The copper alloy may be a high-temperature copper alloy (e.g.,GRCop-84).

In some instances, the metal alloys are Refractory Alloys. Therefractory metals and alloys may be used for heat coils, heatexchangers, furnace components, or welding electrodes. The RefractoryAlloys may comprise a high melting points, low coefficient of expansion,mechanically strong, low vapor pressure at elevated temperatures, highthermal conductivity, or high electrical conductivity.

In some examples, the material (e.g., pre-transformed material)comprises a material wherein its constituents (e.g., atoms or molecules)readily lose their outer shell electrons, resulting in a free-flowingcloud of electrons within their otherwise solid arrangement. In someexamples the material is characterized in having high electricalconductivity, low electrical resistivity, high thermal conductivity, orhigh density (e.g., as measured at ambient temperature (e.g., R.T., or20° C.)). The high electrical conductivity can be at least about 1*10⁵Siemens per meter (S/m), 5*10⁵ S/m, 1*10⁶ S/m, 5*10⁶ S/m, 1*10⁷ S/m,5*10⁷ S/m, or 1*10⁸ S/m. The symbol “*” designates the mathematicaloperation “times,” or “multiplied by.” The high electrical conductivitycan be any value between the afore-mentioned electrical conductivityvalues (e.g., from about 1*10⁵ S/m to about 1*10⁸ S/m). The lowelectrical resistivity may be at most about 1*10⁻⁵ ohm times meter(Ω*m), 5*10⁻⁶ Ω*m, 1*10⁻⁶ Ω*m, 5*10⁻⁷ Ω*m, 1*10⁻⁷ Ω*m, 5*10⁻⁸, or 1*10⁻⁸Ω*m. The low electrical resistivity can be any value between theafore-mentioned electrical resistivity values (e.g., from about 1*10⁻⁵Ω*m to about 1*10⁻⁸ Ω*m). The high thermal conductivity may be at leastabout 20 Watts per meters times Kelvin (W/mK), 50 W/mK, 100 W/mK, 150W/mK, 200 W/mK, 205 W/mK, 300 W/mK, 350 W/mK, 400 W/mK, 450 W/mK, 500W/mK, 550 W/mK, 600 W/mK, 700 W/mK, 800 W/mK, 900 W/mK, or 1000 W/mK.The high thermal conductivity can be any value between theafore-mentioned thermal conductivity values (e.g., from about 20 W/mK toabout 1000 W/mK). The high density may be at least about 1.5 grams percubic centimeter (g/cm³), 2 g/cm³, 3 g/cm³, 4 g/cm³, 5 g/cm³, 6 g/cm³, 7g/cm³, 8 g/cm³, 9 g/cm³, 10 g/cm³, 11 g/cm³, 12 g/cm³, 13 g/cm³, 14g/cm³, 15 g/cm³, 16 g/cm³, 17 g/cm³, 18 g/cm³, 19 g/cm³, 20 g/cm³, or 25g/cm³. The high density can be any value between the afore-mentioneddensity values (e.g., from about 1 g/cm³ to about 25 g/cm³, from about 1g/cm³ to about 10 g/cm³, or from about 10 g/cm³ to about 25 g/cm³).

At times, a metallic material (e.g., elemental metal or metal alloy)comprises small amounts of non-metallic materials, such as, for example,oxygen, sulfur, or nitrogen. In some cases, the metallic material cancomprise the non-metallic material in a trace amount. A trace amount canbe at most about 100000 parts per million (ppm), 10000 ppm, 1000 ppm,500 ppm, 400 ppm, 200 ppm, 100 ppm, 50 ppm, 10 ppm, 5 ppm, or 1 ppm(based on weight, w/w) of non-metallic material. A trace amount cancomprise at least about 10 ppt, 100 ppt, 1 ppb, 5 ppb, 10 ppb, 50 ppb,100 ppb, 200 ppb, 400 ppb, 500 ppb, 1000 ppb, 1 ppm, 10 ppm, 100 ppm,500 ppm, 1000 ppm, or 10000 ppm (based on weight, w/w) of non-metallicmaterial. A trace amount can be any value between the afore-mentionedtrace amounts (e.g., from about 10 parts per trillion (ppt) to about100000 ppm, from about 1 ppb to about 100000 ppm, from about 1 ppm toabout 10000 ppm, or from about 1 ppb to about 1000 ppm).

In some embodiments, a pre-transformed material within the enclosure isin the form of a powder, wires, sheets, or droplets. The material (e.g.,pre-transformed, transformed, and/or hardened) may comprise elementalmetal, metal alloy, ceramics, an allotrope of elemental carbon, polymer,and/or resin. The allotrope of elemental carbon may comprise amorphouscarbon, graphite, graphene, diamond, or fullerene. The fullerene may beselected from the group consisting of a spherical, elliptical, linear,and tubular fullerene. The fullerene may comprise a buckyball, or acarbon nanotube. The ceramic material may comprise cement. The ceramicmaterial may comprise alumina, zirconia, or carbide (e.g., siliconcarbide, or tungsten carbide). The ceramic material may comprise highperformance material (HPM). The ceramic material may comprise a nitride(e.g., boron nitride or aluminum nitride). The material may comprisesand, glass, or stone. In some embodiments, the material may comprise anorganic material, for example, a polymer or a resin (e.g., 114 W resin).The organic material may comprise a hydrocarbon. The polymer maycomprise styrene or nylon (e.g., nylon 11). The polymer may comprise athermoplast. The organic material may comprise carbon and hydrogenatoms. The organic material may comprise carbon and oxygen atoms. Theorganic material may comprise carbon and nitrogen atoms. The organicmaterial may comprise carbon and sulfur atoms. In some embodiments, thematerial may exclude an organic material. The material may comprise asolid or a liquid. In some embodiments, the material may comprise asilicon-based material, for example, silicon-based polymer or a resin.The material may comprise an organosilicon-based material. The materialmay comprise silicon and hydrogen atoms. The material may comprisesilicon and carbon atoms. In some embodiments, the material may excludea silicon-based material. The powder material may be coated by a coating(e.g., organic coating such as the organic material (e.g., plasticcoating)). The material may be devoid of organic material. The liquidmaterial may be compartmentalized into reactors, vesicles, or droplets.The compartmentalized material may be compartmentalized in one or morelayers. The material may be a composite material comprising a secondarymaterial. The secondary material can be a reinforcing material (e.g., amaterial that forms a fiber). The reinforcing material may comprise acarbon fiber, Kevlar®, Twaron®, ultra-high-molecular-weightpolyethylene, or glass fiber. The material can comprise powder (e.g.,granular material) and/or wires. The bound material can comprisechemical bonding. Transforming can comprise chemical bonding. Chemicalbonding can comprise covalent bonding. The pre-transformed material maybe pulverous. The printed 3D object can be made of a single material(e.g., single material type) or multiple materials (e.g., multiplematerial types). Sometimes one portion of the 3D object and/or of thematerial bed may comprise one material, and another portion may comprisea second material different from the first material. The material may bea single material type (e.g., a single alloy or a single elementalmetal). The material may comprise one or more material types. Forexample, the material may comprise two alloys, an alloy and an elementalmetal, an alloy and a ceramic, or an alloy and an elemental carbon. Thematerial may comprise an alloy and alloying elements (e.g., forinoculation). The material may comprise blends of material types. Thematerial may comprise blends with elemental metal or with metal alloy.The material may comprise blends excluding (e.g., without) elementalmetal or comprising (e.g., with) metal alloy. The material may comprisea stainless steel. The material may comprise a titanium alloy, aluminumalloy, and/or nickel alloy.

In some embodiments, the manufacturing device includes an opticalsystem. The optical system may be used to control the one or moretransforming agents (e.g., energy beams). The energy beams may comprisea single mode beam (e.g., Gaussian beam) or a multi-mode beam. Theoptical system may be coupled with or separate from an enclosure. Theoptical system may be enclosed in an optical enclosure (e.g., FIG. 1,131 ). FIG. 8A shows an example of an optical system in which an energybeam is projected from the energy source 810, is deflected by twomirrors 803 and 809, and travels through an optical element 806 prior toreaching target 805 (e.g., an exposed surface of a material bedcomprising a pre-transformed material and/or hardened or partiallyhardened material such as from a previous transformation operation). Theoptical system may comprise more than one optical element. In somecases, the optical element comprises an optical window (e.g., fortransmitting the energy beam into the enclosure). In some embodiments,the optical element comprises a focus altering device, e.g., foraltering (e.g., focusing or defocusing) an incoming energy beam (e.g.,FIG. 8A, 807 ) to an outgoing energy beam (e.g., FIG. 8A, 808 ). Thefocus altering device may comprise a lens. In some embodiments, aspectsof the optical system are controlled by one or more controllers of theprinter. For example, one or more controllers may control one or moremirrors (e.g., of galvanometer scanners) that directs movement of theone or more energy beams in real time. Examples of various aspects ofoptical systems and their components can be found in U.S. patentapplication Ser. No. 15/435,128, filed on Feb. 16, 2017, titled“ACCURATE THREE-DIMENSIONAL PRINTING;” international patent applicationnumber PCT/US17/18191, filed on Feb. 16, 2017, titled “ACCURATETHREE-DIMENSIONAL PRINTING;” European patent application numberEP17156707.6, filed on Feb. 17, 2017, titled “ACCURATE THREE-DIMENSIONALPRINTING;” international patent application number PCT/US17/64474, filedDec. 4, 2017, titled “OPTICS, DETECTORS, AND THREE-DIMENSIONALPRINTING;” and international patent application number PCT/US18/12250,filed Jan. 3, 2018, titled “OPTICS IN THREE-DIMENSIONAL PRINTING,” eachof which is entirely incorporated herein by reference.

In some cases, the optical system modifies a focus of the one or moreenergy beams at the target surface (or adjacent thereto, e.g., above orbelow the target surface to form a defocused beam spot at the targetsurface). In some embodiments, the energy beam is (e.g., substantially)focused at the target surface. In some embodiments, the energy beam isdefocused at the target surface. An energy beam that is focused at thetarget surface may have a (e.g., substantially) minimum spot size at thetarget surface. An energy beam that is defocused at the target surfacemay have a spot size at the target surface that is (e.g., substantially)greater than the minimum spot size, for example, by a pre-determinedamount. For example, a Gaussian energy beam that is defocused at thetarget surface can have spot size that is outside of a Rayleigh distancefrom the energy beams focus (also referred to herein as the beam waist).FIG. 8B shows an example profile of a Gaussian beam as a function ofdistance. The target surface of a focused energy beam may be within aRayleigh distance (e.g., FIG. 8B, R) from the beam waist (e.g., FIG. 8B,W₀).

In some cases, one or more controllers control the operation of one ormore components of a manufacturing device. For example, one or morecontrollers may control one or more aspects (e.g., movement and/orspeed) of a layer forming apparatus. One or more controllers may controlone or more aspects of an energy source (e.g., energy beam power, scanspeed and/or scan path). One or more controllers may control one or moreaspects of an energy beam optical system (e.g., energy beam scan pathand/or energy beam focus). One or more controllers may control one ormore operations of a gas flow system (e.g., gas flow speed and/ordirection). In some embodiments, one or more controllers control aspectsof multiple components or systems. For example, a first controller cancontrol aspects of the energy source(s), a second controller can controlaspects of a layer forming apparatus(es), and a third controller cancontrol aspects of a gas flow system. In some embodiments, one or morecontroller controls aspect of one component or system. For example,multiple controllers may control aspects of an optical system. Forinstance, a first controller can control the path of the one or moreenergy beams, a second controller may control scan speed of the one ormore energy beams, and a third controller may control a focus of the oneor more energy beams. As another example, multiple controllers maycontrol aspects of an energy source. For instance, a first controllercan control the power of one or more energy beams, a second controllermay control pulsing (e.g., pulse versus continuous, or pulse rate) ofthe one or more energy beams, and a third controller may control a powerprofile over time (e.g., ramp up and down) one or more energy beams. Attimes, the first controller, second controller, and the third controllerare the same controller. At times, at least two of the first controller,second controller, and the third controller are different controllers.Any combination of one or more controllers may control aspects of one ormore components or systems of a printer. The one or more controllers maycontrol the operations before, during, and/or after the printing, or aportion of the printing (irradiation operation). The controller maycomprise an electrical circuitry, one or more electrical wiring, asignal receiver, and/or a signal emitter. The controller may beoperatively coupled to one or more components of the forming apparatusvia a connecter and/or signal communication. The connection may be wiredand/or wireless. The controller may communicate via signal receiptand/or transmission. The signal may comprise electrical, optical oraudio signal.

In some instances, the controller(s) can include (e.g., electrical)circuitry that is configured to generate output (e.g., voltage signals)for directing one or more aspects of the apparatuses (or any partsthereof) described herein. FIG. 8C shows a schematic example of a (e.g.,automatic) controller (e.g., a control system, or a controller) 820 thatis programmed or otherwise configured to facilitate formation of one ormore 3D objects. The controller may comprise an electrical circuitry.The controller may comprise a connection to an electrical power. Thecontroller (e.g., FIG. 8C, 820 ) can comprise a subordinate-controller840 for controlling formation of at least one 3D object (e.g., FIG. 8C,850 ). The controller may comprise one or more loop schemes (e.g., openloop, feed-forward loop and/or feedback loop). In the example of FIG.8C, the controller optionally includes feedback control loop 860. Thesubordinate-controller may be an internal-controller. The controller(e.g., or subordinate controller) may comprise aproportion-integral-derivative (PID) loop. The subordinate-controllercan be a second-controller as part of the first controller. Thesubordinate-controller can be a linear controller. The controller may beconfigured to control one or more components of the forming tool. Thecontroller may be configured to control a transforming agent generator(e.g., an energy source, a dispenser of the binding agent and/orreactive agent), a guidance mechanism (e.g., scanner and/or actuator),at least one component of a layer dispenser, a dispenser (e.g., of apre-transformed material and/or a transforming agent), at least onecomponent of a gas flow system, at least one component of a chamber inwhich the 3D object is formed (e.g., a door, an elevator, a valve, apump, and/or a sensor). The controller may control at least onecomponent of the forming apparatus such as the forming agent (e.g.,transforming agent). For example, the controller (e.g., FIG. 8C, 820 )may be configured to control (e.g., in real time, during at least aportion of the 3D printing) a controllable property comprising: (i) anenergy beam power (e.g., delivered to the material bed), (ii)temperature at a position in the material bed (e.g., on the forming 3Dobject), (iii) energy beam speed, (iv) energy beam power density, (v)energy beam dwell time, (vi) energy beam irradiation spot (e.g., on theexposed surface of the material bed), (vii) energy beam focus (e.g.,focus or defocus), or (viii) energy beam cross-section (e.g., beamwaist). The controller (e.g., FIG. 8C, 820 ) may be configured tocontrol (e.g., in real time, during at least a portion of the 3Dprinting) a controllable (e.g., binding and/or reactive agent) propertycomprising: (i) strength (e.g., reaction rate), (ii) volume (e.g.,delivered to the material bed), (iii) density (e.g., on a location ofthe material bed), or (iv) dwell time (e.g., on the material bed). Thecontrollable property may be a control variable. The control may be tomaintain a target parameter (e.g., temperature) of one or more 3Dobjects being formed. The target parameter may vary in time (e.g., inreal time) and/or in location. The location may comprise a location atthe exposed surface of the material bed. The location may comprise alocation at the top surface of the (e.g., forming) 3D object. The targetparameter may correlate to the controllable property. The (e.g., input)target parameter may vary in time and/or location in the material bed(e.g., on the forming 3D object). The subordinate-controller may receivea pre-determined power per unit area (of the energy beam), temperature,and/or metrological (e.g., height) target value. For example, thesubordinate-controller may receive a target parameter (e.g., FIG. 8C,825 ) (e.g. temperature) to maintain at least one characteristic of theforming 3D object (e.g., dimension in a direction, and/or temperature).The controller can receive multiple (e.g., three) types of targetinputs: (i) characteristic of the transforming agent (e.g., energy beampower), (ii) temperature, and (iii) geometry. Any of the target inputmay be user defined. The geometry may comprise geometrical objectpre-print correction. The geometric information may derive from the 3Dobject (or a correctively deviated (e.g., altered) model thereof). Thegeometry may comprise geometric information of a previously printedportion of the 3D object (e.g., comprising a local thickness below agiven layer, local build angle, local build curvature, proximity to anedge on a given layer, or proximity to layer boundaries). The geometrymay be an input to the controller (e.g., via an open loop controlscheme). Some of the target values may be used to form 3D forminginstructions for generating the 3D object (e.g., FIG. 8C, 850 ). Theforming instructions may be dynamically adjusted in real time. Thecontroller may monitor (e.g., continuously) one or more signals from oneor more sensors for providing feedback (e.g., FIG. 8C, 860 ). Forexample, the controller may monitor the energy beam power, temperatureof a position in the material bed, and/or metrology (e.g., height) of aposition on the target surface (e.g., exposed surface of a materialbed). The position on the target surface may be of the forming 3Dobject. The monitor may be continuous or discontinuous. The monitor maybe in real-time during the 3D printing. The monitor may be using the oneor more sensors. The forming instructions may be dynamically adjusted inreal time (e.g., using the signals from the one or more sensors). Avariation between the target parameter and the sensed parameter may beused to estimate an error in the value of that parameter (e.g., FIG. 8C,835 ). The variation (e.g., error) may be used by thesubordinate-controller (e.g., FIG. 8C, 840 ) to adjust the forminginstructions. The controller may control (e.g., continuously) one ormore parameters (e.g., in real time). The controller may use historicaldata (e.g., for the parameters). The historical data may be ofpreviously printed 3D objects, or of previously printed layers of the 3Dobject. Configured may comprise built, constructed, designed, patterned,or arranged. The hardware of the controller may comprise thecontrol-model. The control-model may be linear or non-linear. Forexample, the control-model may be non-linear. The control-model maycomprise linear or non-linear modes. The control-model may comprise freeparameters which may be estimated using a characterization process. Thecharacterization process may be before, during and/or after the 3Dprinting. The control-model may be wired to the controller. The controlmodel can be configured into the controller (e.g., before and/or duringthe 3D printing). Examples of a controller, subordinate controller,and/or control-model can be found in patent application serial numberPCT/US16/59781; patent application serial number PCT/US17/18191; U.S.patent application Ser. No. 15/435,065; patent application serial numberEP17156707; and/or patent application serial number PCT/US17/54043; eachof which is incorporated herein by reference in its entirety.

In some embodiments, a (e.g., geometric) model comprises at least twolayers. Layers of the geometric model may correspond to (e.g.,successive) layers of the formed 3D object (e.g., that formed in alayer-wise manner) and/or (e.g., virtual) slices of the geometric model.In some cases, a layer comprises a layering plane that corresponds to anaverage layering plane. FIG. 9 shows an example schematic vertical crosssection of a portion of a 3D object having layers of hardened material900, 902, and 904 that are sequentially formed during a 3D formingprocedure. Boundaries (e.g., FIG. 9, 906, 908, 910 and 912 ) between thelayers may be visible (e.g., by human eye or using microscopy). Themicroscopy method may comprise optical microscopy, scanning electronmicroscopy, or transmission electron microscopy. The boundaries betweenthe layers may be evident by a microstructure of the 3D object. Theboundaries between the layers may be (e.g., substantially) planar. Theboundaries between the layers may have some irregularity (e.g.,roughness) due to the transformation (e.g., melting and or sintering)process (e.g., and formation of any microstructure such as melt pools).An average layering plane (e.g., FIG. 9, 914 ) may correspond to a(e.g., imaginary) plane that is an estimated or calculated average. Acalculated average may correspond to an arithmetic mean of (e.g., anumber of) point locations on a boundary between layers. A calculatedaverage may be calculated using, for example, a linear regressionanalysis. In some cases, the average layering plane consider deviationsfrom a nominal planar shape.

In some cases, (e.g., a portion of) auxiliary features (e.g., supports)are removed from the 3D object after printing. Removal can comprisemachining (e.g., cutting, sawing and/or milling), polishing (e.g.,sanding) and/or etching. Removal can comprise beam (e.g., laser) etchingor chemical etching. In some cases, the supports (or a portion thereof)remain in and/or on the 3D object after printing. In some cases, the oneor more supports leave respective one or more support marks on the 3Dobject that are indicative of a presence or removal of the one or moresupports. FIG. 10A shows an example of a vertical cross section of a 3Dobject that includes a main portion 1020 coupled with a support 1023. Insome cases, the main portion comprises multiple layers (e.g., 1021 and1022) that were sequentially added (e.g., after formation of thesupport) during a printing operation. In some cases, the support causesone or more layers of the portion of the 3D object to deform duringprinting. Sometimes, the deformed layers form a detectable (e.g.,visible) mark. The mark may be a region of discontinuity in the layer,such as a microstructure discontinuity and/or an abrupt microstructuralvariation (e.g., FIG. 10A). The discontinuity in the microstructure maybe explained by an inclusion of a foreign object (e.g., the support).The microstructural variation may include (e.g., abruptly) altered meltpools and/or grain structure (e.g., crystals, e.g., dendrites) at ornear the attachment point of the support. The microstructure variationmay be due to differential thermal gradients due to the presence of thesupport. The microstructure variation may be due to a forced melt pooland/or layer geometry due to the presence of the support. Thediscontinuity may be at an external surface of the 3D object. Thediscontinuity may arise from inclusion of the support to the surface ofthe 3D object (e.g. and may be visible as a breakage of the support whenremoved from the 3D object (e.g., after printing). In some instances,the 3D object includes two or more support and/or support marks. If morethan one support is used, the supports may be spaced apart by a (e.g.,pre-determined) distance. FIG. 10B shows an example 3D object havingpoints X and Y on a surface of the 3D object. In some embodiments, X isspaced apart from Y by a support spacing distance. For example, a sphereof radius XY that is centered at X may lack one or more supports (or oneor more support marks).

In some embodiments, an overhang is formed on a previously-transformedportion (also referred to herein as rigid portion) of the object. FIG.11A shows an example schematic depiction of an overhang 1122 connectedto a rigid portion 1120. The rigid portion may be connected (e.g.,anchored) to a platform (e.g., FIG. 11A, 1115 ) (e.g., base of theplatform). The overhang may be printed without auxiliary supports otherthan the connection to the one or more rigid portions (e.g., that arepart of the 3D object). The overhang may be formed at an angle (e.g.,FIG. 11A, 1130 ) with respect to the build plane and/or platform (e.g.,FIG. 11A, 1115 ). The overhang and/or the rigid portion may be formedfrom the same or different pre-transformed material (e.g., powder). Theoverhang can form a first angle (e.g., FIG. 11A, 1125 ) with respect tothe rigid portion (e.g., FIG. 11A, 1120 ). The overhang can form asecond angle (e.g., FIG. 11A, 1130 ) with respect to a plane (e.g., FIG.11A, 1131 ) that is (e.g., substantially) parallel with the supportsurface of the platform, to the layering plane, and/or normal to globalvector (e.g., were the layer refer to the layerwise deposition of thetransformed material to form the 3D object). In some embodiments, aplane (e.g., FIG. 11A, 1131 ) that is (e.g., substantially) parallelwith the support surface of the platform corresponds to a layeringplane.

In some embodiments, 3D printing methodologies are employed for forming(e.g., printing) at least one 3D object that is substantiallytwo-dimensional, such as a wire or a planar object. The 3D object maycomprise a plane-like structure (referred to herein as “planar object,”“three-dimensional plane,” or “3D plane”). The 3D plane may have arelatively small thickness as compared to a relatively large surfacearea. The 3D plane may have a relatively small height relative to itswidth and length. For example, the 3D plane may have a small heightrelative to a large horizontal plane. FIG. 11B shows an example of a 3Dplane that is substantially planar (e.g., flat). The 3D plane may beplanar, curved, or assume an amorphous 3D shape. The 3D plane may be astrip, a blade, or a ledge. The 3D plane may comprise a curvature. The3D plane may be curved. The 3D plane may be planar (e.g., flat). The 3Dplane may have a shape of a curving scarf. The term “3D plane” isunderstood herein to be a generic (e.g., curved) 3D surface. Forexample, the 3D plane may be a curved 3D surface. The one or more layerswithin the 3D object may be substantially planar (e.g., flat). Theplanarity of a surface or a boundary the layer may be (e.g.,substantially) uniform. Substantially uniform may be relative to theintended purpose of the 3D object. The height of the layer at a positionmay be compared to an average layering plane. The layering plane canrefer to a plane at which a layer of the 3D object is (e.g.,substantially) oriented during printing. A boundary between two adjacent(printed) layers of hardened material of the 3D object may define alayering plane. The boundary may be apparent by, for example, one ormore melt pool terminuses (e.g., bottom or top). A 3D object may includea plurality of layering planes (e.g., with each layering planecorresponding to each layer). In some embodiments, the layering planesare (e.g., substantially) parallel to one another. An average layeringplane may be defined by a linear regression analysis (e.g., leastsquares planar fit of the top-most part of the surface of the layer ofhardened material). An average layering plane may be a plane calculatedby averaging the material height at each selected point on the topsurface of the layer of hardened material. The selected points may bewithin a specified region of the 3D object. The deviation from any pointat the surface of the planar layer of hardened material may be at most20% 15%, 10%, 5%, 3%, 1%, or 0.5% of the height (e.g., thickness) of thelayer of hardened material.

FIG. 11C shows an example of a first (e.g., top) surface 1160 and asecond (e.g., bottom) surface 1162 of a 3D object. At least a portion ofthe first and second surface may be separated by a gap. At least aportion of the first surface may be separated from at least a portion ofthe second surface (e.g., to constitute a gap). The gap may be filledwith pre-transformed or transformed (e.g., and subsequently hardened)material, e.g., during the formation of the 3D object. The secondsurface may be a bottom skin layer. FIG. 11C shows an example of avertical gap distance 1140 that separates the first surface 1160 fromthe second surface 1162. Point A (e.g., in FIG. 11C) may reside on thetop surface of the first portion. Point B may reside on the bottomsurface of the second portion. The second portion may be a cavityceiling or hanging structure as part of the 3D object. Point B (e.g., inFIG. 11C) may reside above point A. Above (e.g., top) may be withrespect to a global vector 1100. For example, for two positions in a 3Dprinting system, a (e.g., second) position (e.g., FIG. 11C, B) that hasa lower global vector value than a (e.g., first) position (e.g., FIG. 11, A) is above the (e.g., second) position. The gap may be the (e.g.,shortest) distance (e.g., vertical distance) between points A and B.FIG. 11C shows an example of the gap 1168 that constitutes the shortestdistance dAB between points A and B. There may be a first normal to thebottom surface of the second portion at point B. FIG. 11C shows anexample of a first normal 1172 to the surface 1162 at point B. The anglebetween the first normal 1172 and a direction of global vector 1170 maybe any angle γ. A global vector may be (a) directed to a gravitationalcenter, (b) directed opposite to the direction of a layer-wisedeposition to print a three-dimensional object, and/or (c) normal to aplatform configured to support the three-dimensional object during itsprinting, and directed opposite to a surface of the platform thatsupports the three-dimensional object. Point C may reside on the bottomsurface of the second portion. There may be a second normal to thebottom surface of the second portion at point C. FIG. 11C shows anexample of the second normal 1174 to the surface 1162 at point C. Theangle between the second normal 1174 and the global vector 1170 may beany angle δ. Vectors 1180, and 1181 are parallel to the global vector1170. The angles γ and δ may be the same or different. The angle betweenthe first normal 1172 and/or the second normal 1174 to the global vector1100 may be any angle alpha disclosed herein. For example, alpha may beat most about 45°, 40°, 30°, 20°, 10°, 5°, 3°, 2°, 1°, or 0.5°. Theangle alpha may be any value of the afore-mentioned values (e.g., atmost about to about 0.5°, from about 45° to about 20°, or from about 20°to about 0.5°). Examples of an auxiliary support structure and auxiliarysupport feature spacing distance (e.g., the shortest distance betweenpoints B and C) can be found in Patent Application Serial No.PCT/US15/36802 filed on Jun. 19, 2015, titled “APPARATUSES, SYSTEMS ANDMETHODS FOR THREE-DIMENSIONAL PRINTING,” which is entirely incorporatedherein by reference in its entirety. For example, the shortest distanceBC (e.g., d_(BC)) may be at least about 0.1 millimeters (mm), 0.5 mm, 1mm, 1.5 mm, 2 mm, 3 mm, 4 mm, 5 mm, 10 mm, 15 mm, 20 mm, 25 mm, 35 mm,40 mm, 50 mm, 100 mm, 200 mm, 300 mm, 400 mm, or 500 mm. FIG. 11C showsan example of the shortest distance BC (e.g., 1190, d_(BC)). The bottomskin layer may be the first surface and/or the second surface. Thebottom skin layer may be the first formed layer of the 3D object. Thebottom skin layer may be a first formed hanging layer in the 3D object(e.g., that is separated by a gap from a previously formed layer of the3D object). The vertical distance of the gap may be at least about 30μm, 35 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 150 μm, 200μm, 0.05 mm, 0.1 mm, 0.25 mm, 0.5 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6mm, 7 mm, 8 mm, 9 mm, 10 mm or 20 mm. The vertical distance of the gapmay be any value between the afore-mentioned values (e.g., from about 30μm to about 200 μm, from about 100 μm to about 200 μm, from about 30 μmto about 100 mm, from about 80 mm to about 150 mm, from about to about20 mm, from about 0.05 mm to about 0.5 mm, from about 0.2 mm to about 3mm, from about 0.1 mm to about 10 mm, or from about 3 mm to about 20mm).

The one or more layers within the 3D object may be (e.g., substantially)planar (e.g., flat). The planarity of the layer may be (e.g.,substantially) uniform. The height of the layer at a particular positionmay be compared to an average plane. The average plane may be defined bya least squares planar fit of the top-most part of the surface of thelayer of hardened material. The average plane may be a plane calculatedby averaging the material height at each point on the top surface of thelayer of hardened material. The deviation from any point at the surfaceof the planar layer of hardened material may be at most 20% 15%, 10%,5%, 3%, 1%, or 0.5% of the height (e.g., thickness) of the layer ofhardened material. The (e.g., substantially) planar one or more layersmay have a large radius of curvature. An example of a layering plane canbe seen in FIG. 12 showing a vertical cross section of a 3D object 1211that comprises layers 1 to 6, each of which are substantially planar.FIG. 12 shows an example of a vertical cross section of a 3D object 1212comprising planar layers (layers numbers 1-4) and non-planar layers(e.g., layers numbers 5-6) that have a radius of curvature. Thecurvature can be positive or negative with respect to the platformand/or the exposed surface of the material bed. For example, layeredstructure 1212 comprises layer number 6 that has a curvature that isnegative, as the volume (e.g., area in a vertical cross section of thevolume) bound from the bottom of it to the platform 1218 is a convexobject 1219. Layer number 5 of 1212 has a curvature that is negative.Layer number 6 of 1212 has a curvature that is more negative (e.g., hasa curvature of greater negative value) than layer number 5 of 1212.Layer number 4 of 1212 has a curvature that is (e.g., substantially)zero. Layer number 6 of 1214 has a curvature that is positive. Layernumber 6 of 1212 has a curvature that is more negative than layer number5 of 1212, layer number 4 of 1212, and layer number 6 of 1214. Layernumbers 1-6 of 1213 are of substantially uniform (e.g., negativecurvature). FIG. 12, 1216 and 1217 are super-positions of curved layeron a circle 1215 having a radius of curvature “r.” The one or morelayers may have a radius of curvature equal to the radius of curvatureof the layer surface. The radius of curvature may equal infinity (e.g.,when the layer is flat). The radius of curvature of the layer surface(e.g., all the layers of the 3D object) may have a value of at leastabout 0.1 centimeter (cm), 0.2 cm, 0.3 cm, 0.4 cm, 0.5 cm, 0.6 cm, 0.7cm, 0.8 cm, 0.9 cm, 1 cm, 5 cm, 10 cm, 20 cm, 30 cm, 40 cm, 50 cm, 60cm, 70 cm, 80 cm, 90 cm, 1 meter (m), 1.5 m, 2 m, 2.5 m, 3 m, 3.5 m, 4m, 4.5 m, 5 m, 10 m, 15 m, 20 m, 25 m, 30 m, 50 m, or 100 m. The radiusof curvature of the layer surface (e.g., all the layers of the 3Dobject) may have a value of at most about 0.1 centimeter (cm), 0.2 cm,0.3 cm, 0.4 cm, 0.5 cm, 0.6 cm, 0.7 cm, 0.8 cm, 0.9 cm, 1 cm, 5 cm, 10cm, 20 cm, 30 cm, 40 cm, 50 cm, 60 cm, 70 cm, 80 cm, 90 cm, 1 meter (m),1.5 m, 2 m, 2.5 m, 3 m, 3.5 m, 4 m, 4.5 m, 5 m, 10 m, 15 m, 20 m, 25 m,30 m, 50 m, 100 m, or infinity (i.e., flat, or planar layer). The radiusof curvature of the layer surface (e.g., all the layers of the 3Dobject) may have any value between any of the afore-mentioned values ofthe radius of curvature (e.g., from about 10 cm to about 90 m, fromabout 50 cm to about 10 m, from about 5 cm to about 1 m, from about 50cm to about 5 m, from about 5 cm to infinity, or from about 40 cm toabout 50 m). In some embodiments, a layer with an infinite radius ofcurvature is a layer that is planar. In some examples, the one or morelayers may be included in a planar section of the 3D object, or may be aplanar 3D object (e.g., a flat plane). In some instances, part of atleast one layer within the 3D object has the radius of curvaturementioned herein.

At times, one or more controllers are configured to control (e.g.,direct) one or more apparatuses and/or operations. Control may compriseregulate, modulate, adjust, maintain, alter, change, govern, manage,restrain, restrict, direct, guide, oversee, manage, preserve, sustain,restrain, temper, or vary. The control configuration (e.g., “configuredto”) may comprise programming. The controller may comprise an electroniccircuitry, and electrical inlet, or an electrical outlet. Theconfiguration may comprise facilitating (e.g., and directing) an actionor a force. The force may be magnetic, electric, pneumatic, hydraulic,and/or mechanic. Facilitating may comprise allowing use of ambient(e.g., external) forces (e.g., gravity). Facilitating may comprisealerting to and/or allowing: usage of a manual force and/or action.Alerting may comprise signaling (e.g., directing a signal) thatcomprises a visual, auditory, olfactory, or a tactile signal.

The controller may comprise processing circuitry (e.g., a processingunit). The processing unit may be central. The processing unit maycomprise a central processing unit (herein “CPU”). The controllers orcontrol mechanisms (e.g., comprising a computer system) may beconfigured to, e.g., programmed to implement methods of the disclosure.The controller may control at least one component of the systems and/orapparatuses disclosed herein. FIG. 13 is a schematic example of acomputer system 1300 that is programmed or otherwise configured tofacilitate the formation of a 3D object according to the methodsprovided herein. The computer system 1300 can control (e.g., directand/or regulate) various features of printing methods, apparatuses andsystems of the present disclosure, such as, for example, generation offorming instructions for formation of a 3D object. Generated forminginstructions may comprise application of a pre-transformed material,application of an amount of energy (e.g., radiation) emitted to aselected location, a detection system activation and deactivation,sensor data and/or signal acquisition, image processing, processparameters (e.g., dispenser layer height, planarization, chamberpressure), or any combination thereof. The computer system 1300 canimplement at least one data assurance measure. The data assurancemeasure may comprise a security (e.g., level) and/or error detection forat least a part of a file, e.g., that is related to forming instructionsfor a requested 3D object. The computer system 1300 can be part of, orbe in communication with, a printing system or apparatus, such as a 3Dprinting system or apparatus of the present disclosure. The processormay be coupled to one or more mechanisms disclosed herein, and/or anyparts thereof. For example, the computer may be coupled to one or moreenergy sources, optical elements, processing chamber, build module,platform, sensors, valves, switches, motors, pumps, or any combinationthereof.

The computer system 1300 can include a processing unit 1306 (also“processor,” “computer” and “computer processor” used herein). Thecomputer system may include memory or memory location 1302 (e.g.,random-access memory, read-only memory, flash memory), electronicstorage unit 1304 (e.g., hard disk), communication interface 1303 (e.g.,network adapter) for communicating with one or more other systems, andperipheral devices 1305, such as cache, other memory, data storageand/or electronic display adapters. The memory 1302, storage unit 1304,interface 1303, and peripheral devices 1305 are in communication withthe processing unit 1306 through a communication bus (solid lines), suchas a motherboard. The storage unit can be a data storage unit (or datarepository) for storing data. The computer system can be operativelycoupled to a computer network (“network”) 1301 with the aid of thecommunication interface. The network can be the Internet, an Internetand/or extranet, or an intranet and/or extranet that is in communicationwith the Internet. The network in some cases is a telecommunicationand/or data network. The network can include one or more computerservers, which can enable distributed computing, such as cloudcomputing. The network, in some cases with the aid of the computersystem, can implement a peer-to-peer network, which may enable devicescoupled to the computer system to behave as a client or a server.

The processing unit can execute a sequence of machine-readableinstructions, which can be embodied in a program or software. Theinstructions may be stored in a memory location, such as the memory1302. The instructions can be directed to the processing unit, which cansubsequently program or otherwise configure the processing unit toimplement methods of the present disclosure. Examples of operationsperformed by the processing unit can include fetch, decode, execute, andwrite back. The processing unit may interpret and/or executeinstructions. The processor may include a microprocessor, a dataprocessor, a central processing unit (CPU), a graphical processing unit(GPU), a system-on-chip (SOC), a system on module (SOM) a co-processor,a network processor, an application specific integrated circuit (ASIC),an application specific instruction-set processor (ASIPs), a controller,a programmable logic device (PLD), a chipset, a field programmable gatearray (FPGA), or any combination thereof. The processing unit can bepart of a circuit, such as an integrated circuit. One or more othercomponents of the system 1300 can be included in the circuit.

The storage unit 1304 can store files, such as drivers, libraries, andsaved programs. The storage unit can store user data, e.g., userpreferences and user programs. The storage unit may store one or moregeometric models. The storage unit may store encryption and/ordecryption keys. The computer system in some cases can include one ormore additional data storage units that are external to the computersystem, such as located on a remote server that is in communication withthe computer system through an intranet or the Internet.

The computer system can communicate with one or more remote computersystems through the network. For instance, the computer system cancommunicate with a remote computer system of a user (e.g., operator).Examples of remote computer systems include personal computers (e.g.,portable PC), slate or tablet PC's (e.g., Apple® iPad, Samsung® GalaxyTab), telephones, Smart phones (e.g., Apple® iPhone, Android-enableddevice, Blackberry®), or personal digital assistants. The user canaccess the computer system via the network.

Methods as described herein can be implemented by way of machine (e.g.,computer processor) executable code stored on an electronic storagelocation of the computer system, such as, for example, on the memory1302 or electronic storage unit 1304. The machine executable ormachine-readable code can be provided in the form of software. Duringuse, the processor 1306 can execute the code. In some cases, the codecan be retrieved from the storage unit and stored on the memory forready access by the processor. In some situations, the electronicstorage unit can be precluded, and machine-executable instructions arestored on memory.

FIG. 14 shows an example computer system 1400, upon which the variousarrangements described, can be practiced. The computer system (e.g.,FIG. 14, 1400 ) can control and/or implement (e.g., direct and/orregulate) various features of printing methods, apparatus and/or systemoperations of the present disclosure. For example, the computer systemcan be used to instantiate a forming instructions engine. A forminginstructions engine may generate instructions to control energy sourceparameters, processing chamber parameters (e.g., chamber pressure, gasflow and/or temperature), energy beam parameters (e.g., scanning rate,path and/or power), platform parameters (e.g., location and/or speed),layer forming apparatus parameters (e.g., speed, location and/orvacuum), or any combination thereof. A forming instructions engine maygenerate instructions for forming a 3D object in a layerwise (e.g.,slice-by-slice) manner. The generated instructions may according todefault and/or designated (e.g., override) forming (e.g., printing)processes. The forming instructions may be provided to at least onecontroller (e.g., FIG. 14, 1406 ). The at least one controller mayimplement at least one data assurance measure. The data assurancemeasure may comprise a security (e.g., level) and/or error detection forat least a part of a file, e.g., that is related to forming instructionsfor a requested 3D object. The computer system can be part of, or be incommunication with, one or more 3D printers (e.g., FIG. 14, 1402 ) orany of their (e.g., sub-) components. The computer system can includeone or more computers (e.g., FIG. 14, 1404 ). The computer(s) may beoperationally coupled to one or more mechanisms of the printer(s). Forexample, the computer(s) may be operationally coupled to one or moresensors, valves, switches, actuators (e.g., motors), pumps, opticalcomponents, and/or energy sources of the printer(s). In some cases, thecomputer(s) controls aspects of the printer(s) via one or morecontrollers (e.g., FIG. 14, 1406 ). The controller(s) may be configuredto direct one or more operations of the one or more printer(s). Forexample, the controller(s) may be configured to direct one or moreactuators of printer(s). In some cases, the controller(s) is part of thecomputer(s) (e.g., within the same unit(s)). In some cases, thecontroller(s) is separate (e.g., a separate unit) from the computer(s).In some instances, the computer(s) communicates with the controller(s)via one or more input/output (I/O) interfaces (e.g., FIG. 14, 1408 ).The input/output (I/O) interface(s) may comprise one or more wired orwireless connections to communicate with the printer(s). In someembodiments, the I/O interface comprises Bluetooth technology tocommunicate with the controller(s).

The computer(s) (e.g., FIG. 14, 1404 ) may have any number ofcomponents. For example, the computer(s) may comprise one or morestorage units (e.g., FIG. 14, 1409 ), one or more processors (e.g., FIG.14, 1405 ), one or more memory units (e.g., FIG. 14, 1413 ), and/or oneor more external storage interfaces (e.g., FIG. 14, 1412 ). In someembodiments, the storage unit(s) includes a hard disk drive (HDD), amagnetic tape drive and/or a floppy disk drive. In some embodiments, thememory unit(s) includes a random access memory (RAM) and/or read onlymemory (ROM), and/or flash memory. In some embodiments, the externalstorage interface(s) comprises a disk drive (e.g., optical or floppydrive) and/or a universal serial bus (USB) port. The external storageinterface(s) may be configured to provide communication with one or moreexternal storage units (e.g., FIG. 14, 1415 ). The external storageunit(s) may comprise a portable memory medium. The external storageunit(s) may be a non-volatile source of data. In some cases, theexternal storage unit(s) is an optical disk (e.g., CD-ROM, DVD, Blu-rayDisc™), a USB-RAM, a hard drive, a magnetic tape drive, and/or a floppydisk. In some cases, the external storage unit(s) may comprise a diskdrive (e.g., optical or floppy drive). Various components of thecomputer(s) may be operationally coupled via a communication bus (e.g.,FIG. 14, 1425 ). For example, one or more processor(s) (e.g., FIG. 14,1405 ) may be operationally coupled to the communication bus by one ormore connections (e.g., FIG. 14, 1419 ). The storage unit(s) (e.g., FIG.14, 1409 ) may be operationally coupled to the communication bus one ormore connections (e.g., FIG. 14, 1428 ). The communication bus (e.g.,FIG. 14, 1425 ) may comprise a motherboard.

In some embodiments, methods described herein are implemented as one ormore software programs (e.g., FIG. 14, 1422 and/or 1424 ). For example,a pre-formation environment may be implemented as a software program.The software program(s) may be executable within the one or morecomputers (e.g., FIG. 14, 1404 ). The software may be implemented on anon-transitory computer readable media. The software program(s) maycomprise machine-executable code. The machine-executable code maycomprise program instructions. The program instructions may be carriedout by the computer(s) (e.g., FIG. 14, 1404 ). The machine-executablecode may be stored in the storage device(s) (e.g., FIG. 14, 1409 ). Themachine-executable code may be stored in the external storage device(s)(e.g., FIG. 14, 1415 ). The machine-executable code may be stored in thememory unit(s) (e.g., FIG. 14, 1413 ). The storage device(s) (e.g., FIG.14, 1409 ) and/or external storage device(s) (e.g., FIG. 14, 1415 ) maycomprise a non-transitory computer-readable medium. The processor(s) maybe configured to read the software program(s) (e.g., FIG. 14, 1422and/or 1424 ). In some cases, the machine-executable code can beretrieved from the storage device(s) and/or external storage device(s),and stored on the memory unit(s) (e.g., FIG. 14, 1406 ) for access bythe processor (e.g., FIG. 14, 1405 ). In some cases, the access is inreal-time (e.g., during printing). In some situations, the storagedevice(s) and/or external storage device(s) can be precluded, and themachine-executable code is stored on the memory unit(s). Themachine-executable code may be pre-compiled and configured for use witha machine have a processer adapted to execute the machine-executablecode, or can be compiled during runtime (e.g., in real-time). Themachine-executable code can be supplied in a programming language thatcan be selected to enable the machine-executable code to execute in apre-compiled or as-compiled fashion.

In some embodiments, the computer(s) is operationally coupled with, orcomprises, one or more devices (e.g., FIG. 14, 1410 ). In someembodiments, the device(s) (e.g., FIG. 14, 1410 ) is configured toprovide one or more (e.g., electronic) inputs to the computer(s). Insome embodiments, the device(s) (e.g., FIG. 14, 1410 ) is configured toreceive one or more (e.g., electronic) outputs from the computer(s). Thecomputer(s) may communicate with the device(s) via one or moreinput/output (I/O) interfaces (e.g., FIG. 14, 1407 ). The input/output(I/O) interface(s) may comprise one or more wired or wirelessconnections. The device(s) can include one or more user interfaces (UI).The UI may include one or more keyboards, one or more pointer devices(e.g., mouse, trackpad, touchpad, or joystick), one or more displays(e.g., computer monitor or touch screen), one or more sensors, and/orone or more switches (e.g., electronic switch). In some cases, the UImay be a web-based user interface. At times, the UI provides a modeldesign or graphical representation of a 3D object to be printed. Thesensor(s) may comprise a light sensor, a thermal sensor, an audio sensor(e.g., microphone), and/or a tactile sensor. In some cases, thesensor(s) are part of the printer(s) (e.g., FIG. 14, 1402 ). Forexample, the sensor(s) may be located within a processing chamber of aprinter (e.g., to monitor an atmosphere therein). The sensor(s) may beconfigured to monitor one or more signals (e.g., thermal and/or lightsignal) that is generated during a printing operation. In some cases,the sensor(s) are part of a component or apparatus that is separate fromthe printer(s). In some cases, the device(s) is a pre-printingprocessing apparatus. For example, in some cases, the device(s) can beone or more scanners (e.g., 2D or 3D scanner) for scanning (e.g.,dimensions of) a 3D object. In some cases, the device(s) is apost-printing processing apparatus (e.g., a docking station, unpackingstation, and/or a hot isostatic pressing apparatus). In someembodiments, the I/O interface comprises Bluetooth technology tocommunicate with the device(s).

In some embodiments, the computer(s) (e.g., FIG. 14, 1404 ),controller(s) (e.g., FIG. 14, 1406 ), printer(s) (e.g., FIG. 14, 1402 )and/or device(s) (e.g., FIG. 14, 1410 ) comprises one or morecommunication ports. For example, one or more I/O interfaces (e.g., FIG.14, 1407 or 1408 ) can comprise communication ports. The communicationport(s) may be a serial port or a parallel port. The communicationport(s) may be a Universal Serial Bus port (i.e., USB). The USB port canbe micro or mini USB. The USB port may relate to device classescomprising 00h, 01h, 02h, 03h, 05h, 06h, 07h, 08h, 09h, 0Ah, 0Bh, 0Dh,0Eh, 0Fh, 10h, 11h, DCh, E0h, EFh, FEh, or FFh. The communicationport(s) may comprise a plug and/or a socket (e.g., electrical, AC power,DC power). The communication port(s) may comprise an adapter (e.g., ACand/or DC power adapter). The communication port(s) may comprise a powerconnector. The power connector can be an electrical power connector. Thepower connector may comprise a magnetically coupled (e.g., attached)power connector. The power connector can be a dock connector. Theconnector can be a data and power connector. The connector may comprisepins. The connector may comprise at least 10, 15, 18, 20, 22, 24, 26,28, 30, 40, 42, 45, 50, 55, 80, or 100 pins.

In some embodiments, the computer(s) is configured to communicate withone or more networks (e.g., FIG. 14, 1420 ). The network(s) may comprisea wide-area network (WAN) or a local area network (LAN). In some cases,the computer(s) includes one or more network interfaces (e.g., FIG. 14,1411 ) that is configured to facilitate communication with thenetwork(s). The network interface(s) may include wired and/or wirelessconnections. In some embodiments, the network interface(s) comprises amodulator demodulator (modem). The modem may be a wireless modem. Themodem may be a broadband modem. The modem may be a “dial up” modem. Themodem may be a high-speed modem. The WAN can comprise the Internet, acellular telecommunications network, and/or a private WAN. The LAN cancomprise an intranet. In some embodiments, the LAN is operationallycoupled with the WAN via a connection, which may include a firewallsecurity device. The WAN may be operationally coupled the LAN by a highcapacity connection. In some cases, the computer(s) can communicate withone or more remote computers via the LAN and/or the WAN. In someinstances, the computer(s) may communicate with a remote computer(s) ofa user (e.g., operator). The user may access the computer(s) via the LANand/or the WAN. In some cases, the computer(s) (e.g., FIG. 14, 1404 )store and/or access data to and/or from data storage unit(s) that arelocated on one or more remote computers in communication via the LANand/or the WAN. The remote computer(s) may be a client computer. Theremote computer(s) may be a server computer (e.g., web server or serverfarm). The remote computer(s) can include desktop computers, personalcomputers (e.g., portable PC), slate or tablet PC's (e.g., Apple® iPad,Samsung® Galaxy Tab), telephones, smart phones (e.g., Apple® iPhone,Android-enabled device, Blackberry®), or personal digital assistants.

At times, the processor (e.g., FIG. 14, 1405 ) includes one or morecores. The computer system may comprise a single core processor, amultiple core processor, or a plurality of processors for parallelprocessing. The processor may comprise one or more central processingunits (CPU) and/or graphic processing units (GPU). The multiple coresmay be disposed in a physical unit (e.g., Central Processing Unit, orGraphic Processing Unit). The processor may be a single physical unit.The physical unit may be a die. The physical unit may comprise cachecoherency circuitry. The processor may include multiple physical units.The physical unit may comprise an integrated circuit chip. Theintegrated circuit chip may comprise one or more transistors. Theintegrated circuit chip may comprise at least about 0.2 billiontransistors (BT), 0.5 BT, 1BT, 2 BT, 3 BT, 5 BT, 6 BT, 7 BT, 8 BT, 9 BT,10 BT, 15 BT, 20 BT, 25 BT, 30 BT, 40 BT, or 50 BT. The integratedcircuit chip may comprise at most about 7 BT, 8 BT, 9 BT, 10 BT, 15 BT,20 BT, 25 BT, 30 BT, 40 BT, 50 BT, 70 BT, or 100 BT. The integratedcircuit chip may comprise any number of transistors between theafore-mentioned numbers (e.g., from about 0.2 BT to about 100 BT, fromabout 1 BT to about 8 BT, from about 8 BT to about 40 BT, or from about40 BT to about 100 BT). The integrated circuit chip may have an area ofat least about 50 mm², 60 mm², 70 mm², 80 mm², 90 mm², 100 mm², 200 mm²,300 mm², 400 mm², 500 mm², 600 mm², 700 mm², or 800 mm². The integratedcircuit chip may have an area of at most about 50 mm², 60 mm², 70 mm²,80 mm², 90 mm², 100 mm², 200 mm², 300 mm², 400 mm², 500 mm², 600 mm²,700 mm², or 800 mm². The integrated circuit chip may have an area of anyvalue between the afore-mentioned values (e.g., from about 50 mm² toabout 800 mm², from about 50 mm² to about 500 mm², or from about 500 mm²to about 800 mm²). The multiple cores may be disposed in closeproximity. The close proximity may allow substantial preservation ofcommunication signals that travel between the cores. The close proximitymay diminish communication signal degradation. A core as understoodherein is a computing component having independent central processingcapabilities. The computing system may comprise a multiplicity of cores,which are disposed on a single computing component. The multiplicity ofcores may include two or more independent central processing units. Theindependent central processing units may constitute a unit that read andexecute program instructions. The independent central processors mayconstitute parallel processing units. The parallel processing units maybe cores and/or digital signal processing slices (DSP slices). Themultiplicity of cores can be parallel cores. The multiplicity of DSPslices can be parallel DSP slices. The multiplicity of cores and/or DSPslices can function in parallel. The multiplicity of cores may includeat least about 2, 10, 40, 100, 400, 1000, 2000, 3000, 4000, 5000, 6000,7000, 8000, 9000, 10000, 11000, 12000, 13000, 14000 or 15000 cores. Themultiplicity of cores may include at most about 1000, 2000, 3000, 4000,5000, 6000, 7000, 8000, 9000, 10000, 11000, 12000, 13000, 14000, 15000,20000, 30000, or 40000 cores. The multiplicity of cores may includecores of any number between the afore-mentioned numbers (e.g., fromabout 2 to about 40000, from about 2 to about 400, from about 400 toabout 4000, from about 2000 to about 4000, from about 4000 to about10000, from about 4000 to about 15000, or from about 15000 to about40000 cores). In some processors (e.g., FPGA), the cores may beequivalent to multiple digital signal processor (DSP) slices (e.g.,slices). The plurality of DSP slices may be equal to any of pluralitycore values mentioned herein. The processor may comprise low latency indata transfer (e.g., from one core to another). Latency may refer to thetime delay between the cause and the effect of a physical change in theprocessor (e.g., a signal). Latency may refer to the time elapsed fromthe source (e.g., first core) sending a packet to the destination (e.g.,second core) receiving it (also referred as two-point latency).One-point latency may refer to the time elapsed from the source (e.g.,first core) sending a packet (e.g., signal) to the destination (e.g.,second core) receiving it, and the designation sending a packet back tothe source (e.g., the packet making a round trip). The latency may besufficiently low to allow a high number of floating point operations persecond (FLOPS). The number of FLOPS may be at least about 1 Tera Flops(T-FLOPS), 2 T-FLOPS, 3 T-FLOPS, 5 T-FLOPS, 6 T-FLOPS, 7 T-FLOPS, 8T-FLOPS, 9 T-FLOPS, or 10 T-FLOPS. The number of flops may be at mostabout 5 T-FLOPS, 6 T-FLOPS, 7 T-FLOPS, 8 T-FLOPS, 9 T-FLOPS, 10 T-FLOPS,20 T-FLOPS, 30 T-FLOPS, 50 T-FLOPS, 100 T-FLOPS, 1 P-FLOPS, 2 P-FLOPS, 3P-FLOPS, 4 P-FLOPS, 5 P-FLOPS, 10 P-FLOPS, 50 P-FLOPS, 100 P-FLOPS, 1EXA-FLOP, 2 EXA-FLOPS, or 10 EXA-FLOPS. The number of FLOPS may be anyvalue between the afore-mentioned values (e.g., from about 0.1 T-FLOP toabout 10 EXA-FLOPS, from about 0.1 T-FLOPS to about 1 T-FLOPS, fromabout 1 T-FLOPS to about 4 T-FLOPS, from about 4 T-FLOPS to about 10T-FLOPS, from about 1 T-FLOPS to about 10 T-FLOPS, or from about 10T-FLOPS to about 30 T-FLOPS, from about 50 T-FLOPS to about 1 EXA-FLOP,or from about 0.1 T-FLOP to about 10 EXA-FLOPS). In some processors(e.g., FPGA), the operations per second may be measured as (e.g., Giga)multiply-accumulate operations per second (e.g., MACs or GMACs). TheMACs value can be equal to any of the T-FLOPS values mentioned hereinmeasured as Tera-MACs (T-MACs) instead of T-FLOPS respectively. TheFLOPS can be measured according to a benchmark. The benchmark may be aHPC Challenge Benchmark. The benchmark may comprise mathematicaloperations (e.g., equation calculation such as linear equations),graphical operations (e.g., rendering), or encryption/decryptionbenchmark. The benchmark may comprise a High Performance LINPACK, matrixmultiplication (e.g., DGEMM), sustained memory bandwidth to/from memory(e.g., STREAM), array transposing rate measurement (e.g., PTRANS),Random-access, rate of Fast Fourier Transform (e.g., on a largeone-dimensional vector using the generalized Cooley-Tukey algorithm), orCommunication Bandwidth and Latency (e.g., MPI-centric performancemeasurements based on the effective bandwidth/latency benchmark).LINPACK may refer to a software library for performing numerical linearalgebra on a digital computer. DGEMM may refer to double precisiongeneral matrix multiplication. STREAM benchmark may refer to a syntheticbenchmark designed to measure sustainable memory bandwidth (in MB/s) anda corresponding computation rate for four simple vector kernels (Copy,Scale, Add and Triad). PTRANS benchmark may refer to a rate measurementat which the system can transpose a large array (global). MPI refers toMessage Passing Interface.

At times, the computer system includes hyper-threading technology. Thecomputer system may include a chip processor with integrated transform,lighting, triangle setup, triangle clipping, rendering engine, or anycombination thereof. The rendering engine may be capable of processingat least about 10 million polygons per second. The rendering engines maybe capable of processing at least about 10 million calculations persecond. As an example, the GPU may include a GPU by NVidia, ATITechnologies, S3 Graphics, Advanced Micro Devices (AMD), or Matrox. Theprocessor(s) may be able to process algorithms comprising a matrix or avector. The core may comprise a complex instruction set computing core(CISC), or reduced instruction set computing (RISC).

At times, the computer system includes an electronic chip that isreprogrammable (e.g., field programmable gate array (FPGA), e.g.,application programming unit (APU)). For example, the FPGA may compriseTabula, Altera, or Xilinx FPGA. The electronic chips may comprise one ormore programmable logic blocks (e.g., an array). The logic blocks maycompute combinational functions, logic gates, or any combinationthereof. The computer system may include custom hardware. The customhardware may comprise an algorithm.

At times, the computer system includes configurable computing, partiallyreconfigurable computing, reconfigurable computing, or any combinationthereof. The computer system may include a FPGA. The computer system mayinclude an integrated circuit that performs the algorithm. For example,the reconfigurable computing system may comprise FPGA, APU, CPU, GPU, ormulti-core microprocessors. The reconfigurable computing system maycomprise a High-Performance Reconfigurable Computing architecture(HPRC). The partially reconfigurable computing may include module-basedpartial reconfiguration, or difference-based partial reconfiguration.

At times, the computing system includes an integrated circuit thatperforms the algorithm (e.g., control algorithm). The physical unit(e.g., the cache coherency circuitry within) may have a clock time of atleast about 0.1 Gigabits per second (Gbit/s), 0.5 Gbit/s, 1 Gbit/s, 2Gbit/s, 5 Gbit/s, 6 Gbit/s, 7 Gbit/s, 8 Gbit/s, 9 Gbit/s, 10 Gbit/s, or50 Gbit/s. The physical unit may have a clock time of any value betweenthe afore-mentioned values (e.g., from about 0.1 Gbit/s to about 50Gbit/s, or from about 5 Gbit/s to about 10 Gbit/s). The physical unitmay produce the algorithm output in at most about 0.1 microsecond (μs),1 μs, 10 μs, 100 μs, or 1 millisecond (ms). The physical unit mayproduce the algorithm output in any time between the afore-mentionedtimes (e.g., from about 0.1 μs, to about 1 ms, from about 0.1 μs, toabout 100 μs, or from about 0.1 μs to about 10 μs).

In some instances, the controller(s) (e.g., FIG. 14, 1406 ) uses realtime measurements and/or calculations to regulate one or more componentsof the printer(s). In some cases, the controller(s) regulatecharacteristics of the energy beam(s). The sensor(s) (e.g., on theprinter) may provide a signal (e.g., input for the controller and/orprocessor) at a rate of at least about 0.1 KHz 1 KHz, 10 KHz, 100 KHz,1000 KHz, or 10000 KHz). The sensor(s) may be a temperature and/orpositional sensor(s). The sensor(s) may provide a signal at a ratebetween any of the above-mentioned rates (e.g., from about 0.1 KHz toabout 10000 KHz, from about 0.1 KHz to about 1000 KHz, or from about1000 KHz to about 10000 KHz). The memory bandwidth of the processor(s)may be at least about 1 gigabytes per second (Gbytes/s), 10 Gbytes/s,100 Gbytes/s, 200 Gbytes/s, 300 Gbytes/s, 400 Gbytes/s, 500 Gbytes/s,600 Gbytes/s, 700 Gbytes/s, 800 Gbytes/s, 900 Gbytes/s, or 1000Gbytes/s. The memory bandwidth of the processor(s) may be at most about1 gigabytes per second (Gbytes/s), 10 Gbytes/s, 100 Gbytes/s, 200Gbytes/s, 300 Gbytes/s, 400 Gbytes/s, 500 Gbytes/s, 600 Gbytes/s, 700Gbytes/s, 800 Gbytes/s, 900 Gbytes/s, or 1000 Gbytes/s. The memorybandwidth of the processor(s) may have any value between theafore-mentioned values (e.g., from about 1 Gbytes/s to about 1000Gbytes/s, from about 100 Gbytes/s to about 500 Gbytes/s, from about 500Gbytes/s to about 1000 Gbytes/s, or from about 200 Gbytes/s to about 400Gbytes/s). The sensor measurements may be real-time measurements. Thereal-time measurements may be conducted during at least a portion of the3D printing process. The real-time measurements may be in-situmeasurements in the 3D printing system and/or apparatus. The real-timemeasurements may be during at least a portion of the formation of the 3Dobject. In some instances, the processor(s) may use the signal obtainedfrom the at least one sensor to provide a processor(s) output, whichoutput is provided by the processing system at a speed of at most about100 minute (min), 50 min, 25 min, 15 min, 10 min, 5 min, 1 min, 0.5 min(i.e., 30 seconds (sec)), 15 sec, 10 sec, 5 sec, 1 sec, 0.5 sec, 0.25sec, 0.2 sec, 0.1 sec, 80 milliseconds (ms), 50 ms, 10 ms, 5 ms, or 1ms. In some instances, the processor(s) may use the signal obtained fromthe at least one sensor to provide a processor(s) output, which outputis provided at a speed of any value between the aforementioned values(e.g., from about 100 min to about 1 ms, from about 100 min to about 10min, from about 10 min to about 1 min, from about 5 min to about 0.5min, from about 30 sec to about 0.1 sec, or from about 0.1 sec to about1 ms). The processor(s) output may comprise an evaluation of theattribute (e.g., temperature) at a location, position at a location(e.g., vertical and/or horizontal), or a map of locations. The locationmay be on the target surface. The map may comprise a topological and/orattribute (e.g., temperature) related map.

At times, the processor(s) (e.g., FIG. 14, 1405 ) uses the signalobtained from one or more sensors (e.g., on the printer) in an algorithmthat is used in controlling the energy beam. The algorithm may comprisethe path of the energy beam. In some instances, the algorithm may beused to alter the path of the energy beam on the target surface. Thepath may deviate from a cross section of a model corresponding to therequested 3D object. The processor may use the output in an algorithmthat is used in determining the manner in which a model of the requested3D object may be sliced. The processor may use the signal obtained fromthe at least one sensor in an algorithm that is used to configure one ormore parameters and/or apparatuses relating to the 3D printingprocedure. The parameters may comprise a characteristic of the energybeam. The parameters may comprise movement of the platform and/ormaterial bed. The parameters may include characteristics of the gas flowsystem. The parameters may include characteristics of the layer formingapparatus. The parameters may comprise relative movement of the energybeam and the material bed. In some instances, the energy beam, theplatform (e.g., material bed disposed on the platform), or both maytranslate. Alternatively, or additionally, the controller(s) (e.g., FIG.14, 1410 ) may use historical data for the control. Alternatively, oradditionally, the processor may use historical data in its one or morealgorithms. The parameters may comprise the height of the layer ofpre-transformed material disposed in the enclosure and/or the gap bywhich the cooling element (e.g., heat sink) is separated from the targetsurface. The target surface may be the exposed layer of the materialbed.

At times, the memory (e.g., FIG. 14, 1406 ) comprises a random-accessmemory (RAM), dynamic random access memory (DRAM), static random accessmemory (SRAM), synchronous dynamic random access memory (SDRAM),ferroelectric random access memory (FRAM), read only memory (ROM),programmable read only memory (PROM), erasable programmable read onlymemory (EPROM), electrically erasable programmable read only memory(EEPROM), a flash memory, or any combination thereof. The flash memorymay comprise a negative-AND (NAND) or NOR logic gates. A NAND gate(negative-AND) may be a logic gate which produces an output which isfalse only if all its inputs are true. The output of the NAND gate maybe complement to that of the AND gate. The storage may include a harddisk (e.g., a magnetic disk, an optical disk, a magneto-optic disk, asolid-state disk, etc.), a compact disc (CD), a digital versatile disc(DVD), a floppy disk, a cartridge, a magnetic tape, and/or another typeof computer-readable medium, along with a corresponding drive.

At times, all or portions of the software program(s) (e.g., FIG. 14,1427 ) are communicated through the WAN or LAN networks. Suchcommunications, for example, may enable loading of the softwareprogram(s) from one computer or processor into another, for example,from a management server or host computer into the computer platform ofan application server. Thus, another type of media that may bear thesoftware elements includes optical, electrical, and electromagneticwaves, such as used across physical interfaces between local devices,through wired and optical landline networks and over various air-links.The physical elements that carry such waves, such as wired or wirelesslinks, optical links, or the like, also may be considered as mediabearing the software program(s). As used herein, unless restricted tonon-transitory, tangible “storage” media, terms such as computer ormachine “readable medium” refer to any medium that participates inproviding instructions to a processor for execution. Hence, amachine-readable medium, such as computer-executable code, may take manyforms, including but not limited to, a tangible storage medium, acarrier wave medium, or physical transmission medium. Non-volatilestorage media include, for example, optical or magnetic disks, such asany of the storage devices in any computer(s) or the like, such as maybe used to implement the databases. Volatile storage media can includedynamic memory, such as main memory of such a computer platform.Tangible transmission media can include coaxial cables, wire (e.g.,copper wire), and/or fiber optics, including the wires that comprise abus within a computer system. Carrier-wave transmission media may takethe form of electric or electromagnetic signals, or acoustic or lightwaves such as those generated during radio frequency (RF) and/orinfrared (IR) data communications. Common forms of computer-readablemedia therefore include for example: a floppy disk, a flexible disk,hard disk, magnetic tape, any other magnetic medium, a CD-ROM, DVD orDVD-ROM, any other optical medium, punch cards paper tape, any otherphysical storage medium with patterns of holes, a RAM, a ROM, a PROM andEPROM, a FLASH-EPROM, any other memory chip or cartridge, a carrier wavetransporting data or instructions, cables or links transporting such acarrier wave, any other medium from which a computer may readprogramming code and/or data, or any combination thereof. The memoryand/or storage may comprise a storing device external to and/orremovable from device, such as a Universal Serial Bus (USB) memorystick, or/and a hard disk. Many of these forms of computer readablemedia may be involved in carrying one or more sequences of one or moreinstructions to a processor for execution.

At times, the computer system monitors and/or controls various aspectsof the 3D printer(s). In some cases, the control is via controller(s)(e.g., FIG. 14, 1406 ). The control may be manual and/or programmed. Thecontrol may comprise an open loop control or a closed loop control(e.g., including feed forward and/or feedback) control scheme. Theclosed loop control may utilize signals from the one or more sensors.The control may utilize historical data. The control scheme may bepre-programmed. The control scheme may consider an input from one ormore sensors (described herein) that are connected to the control unit(i.e., control system or control mechanism) and/or processor(s). Thecomputer system (including the processor(s)) may store historical dataconcerning various aspects of the operation of the 3D printing system.The historical data may be retrieved at predetermined times and/or at awhim. The historical data may be accessed by an operator and/or by auser. The historical, sensor, and/or operative data may be provided inan output unit such as a display unit. The output unit (e.g., monitor)may output various parameters of the 3D printing system (as describedherein) in real time or in a delayed time. The output unit may outputthe current 3D printed object, the ordered 3D printed object, or both.The output unit may output the printing progress of the 3D printedobject. The output unit may output at least one of the total time, timeremaining, and time expanded on printing the 3D object. The output unitmay output (e.g., display, voice, and/or print) the status of sensors,their reading, and/or time for their calibration or maintenance. Theoutput unit may output the type of material(s) used and variouscharacteristics of the material(s) such as temperature and flowabilityof the pre-transformed material. The output unit may output a (e.g.,current, or historical) state of at least one control variable that iscontrolled via integrated and/or adaptive control. The output maycomprise an indication of (e.g., which of) at least two controlvariables that are controlled via integrated control. The output maycomprise an indication of (e.g., any) processing operation thatcomprises adaptive control. The output may comprise an indication of(e.g., a duration) of an adaptive timing for the processing operationthat is under adaptive control. The computer may generate a reportcomprising various parameters of the 3D printing system, method, and orobjects at predetermined time(s), on a request (e.g., from an operator),and/or at a whim. The output unit may comprise a screen, printer, alight source (e.g., lamp), or speaker. The control system may provide areport. The report may comprise any items recited as optionally outputby the output unit.

At times, the systems, methods, and/or apparatuses disclosed hereincomprise providing data assurance for instruction data related toforming a requested 3D object. The instructions data may be generatedconsidering a requested 3D object. The request can include a geometricmodel (e.g., a CAD file) of the requested 3D object. Alternatively, oradditionally, a model of the requested 3D object may be generated. Themodel may be used to generate (e.g., 3D forming) instructions. Thesoftware program(s) (e.g., FIG. 14, 1422 and/or 1424 ) may comprise the3D forming instructions. The 3D forming instructions may exclude the 3Dmodel. The 3D forming instructions may be based on the 3D model. The 3Dforming instructions may take the 3D model into account. The 3D forminginstructions may be alternatively or additionally based on simulations(e.g., a control model). The 3D forming instructions may use the 3Dmodel. The 3D forming instructions may comprise using a calculation(e.g., embedded in a software program(s)) that considers the 3D model,simulations, historical data, sensor input, or any combination thereof.The 3D forming instructions may be provided to at least one controller(e.g., FIG. 14, 1406 ) that implements at least one data assurance(e.g., measure). The data assurance measure may comprise a security(e.g., level) and/or error detection for at least a part of a file,e.g., that is related to forming instructions for a requested 3D object.The data assurance measure may comprise computing a calculation (e.g., ahash value). The at least one controller may compute the calculationduring generation of forming instructions, during generation of layoutinstructions, prior to the 3D forming procedure, after the 3D formingprocedure, or any combination thereof. The at least one controller maycompute the calculation during the 3D forming procedure (e.g., inreal-time), during the formation of the 3D object, prior to the 3Dforming procedure, after the 3D forming procedure, or any combinationthereof. The at least one controller may compute a calculation in theinterval between activations of a transforming agent. For example,between pulses of an energy beam, during the dwell time of the energybeam, before the energy beam translates to a new position, while theenergy beam is not translating, while the energy beam does not impingeupon the target surface, while the (e.g., at least one) energy beamimpinges upon the target surface, or any combination thereof. Forexample, between depositions of a binding agent, during a persistencetime of the binding agent, before a dispenser (e.g., that provides thebinding agent) translates to a new position, while the dispenser is nottranslating, while the binding agent is not provided to the targetsurface, while the binding agent is provided to the target surface, orany combination thereof. The processor may compute a calculation in theinterval between a movement of at least one guidance (e.g., optical)element from a first position to a second position, while the at leastone optical element moves (e.g., translates) to a new (e.g., second)position. For example, the processor(s) may compute a calculation whilethe energy beam translates and does substantially not impinge upon theexposed surface. For example, the processor(s) may compute thecalculation while the energy beam does not translate and impinges uponthe exposed surface. For example, the processor(s) may compute thecalculation while the energy beam does not substantially translate anddoes substantially not impinge upon the exposed surface. For example,the processor(s) may compute the calculation while the energy beam doestranslate and impinges upon the exposed surface. The transforming agentmay be provided along a path that corresponds to a cross section of themodel of the 3D object. For example, a translation of the energy beammay be translation along at least one energy beam path. For example, adispenser movement may be along at least one dispenser path.

EXAMPLES

The following are illustrative and non-limiting examples of methods ofthe present disclosure.

Example 1

For a first virtual geometric model of a first requested 3D objecthaving dimensions of 5 centimeters (cm) in width×20 cm in length×5 cm inheight (e.g., FIG. 2A, 205 ), a pre-print environment application wasused to generate a printing instructions file for printing the firstrequested 3D object. The pre-print environment application included afirst stage (e.g., FIG. 2A, 200 ) in which the printing instructionsfile was generated comprising printing procedures for transforminglayers of material using a layerwise manufacturing process as describedherein. This process was repeated for a second requested 3D object(e.g., 255) and for a third requested 3D object (e.g., 257). The secondrequested 3D object and the third requested 3D object each haddimensions (at the base) of 8.65 cm in width×8.65 cm in length×5.5 cm inheight (e.g., FIG. 2B, 255 and 257 ). The 3D printing includedlayer-wise melting of powder material disposed in sequential layers toform a powder bed. Each of the powder layers had an average thickness ofabout 50 μm. The pre-print environment application included a secondstage (e.g., FIG. 2B, 250 ) comprising a representation of a buildvolume of the 3D printer. The first virtual geometric model (e.g., FIG.2B, 270 ), having the printing instructions file from the first stageassociated therewith, was arranged alongside the second and the thirdvirtual geometric models (e.g., FIG. 2B, 255 and 257 ). The arrangementof the three (3) virtual geometric models was used to form a layoutinstructions file for printing the three requested 3D objects in a printcycle of the 3D printer in the second stage. The layout instructionsfile and the printing instructions file were stored as an instructionsdata file that was encrypted. The encrypted instructions data file wastransmitted to a 3D printer. The 3D printer had a 320 mm diameter and400 mm maximal height container, in which Inconel 718 powder of averageparticle size 35 μm was deposited to form a powder bed. The containerwas disposed in an enclosure to separate the powder bed from an ambientenvironment. The enclosure was purged with Argon gas. The 3D printer wasauthenticated according to its manufacturing model number, and grantedaccess to the encrypted instructions data file. A controller was used tocommand a 1000 W fiber laser beam to melt portions of the powder bed toform respective portions of the 3D objects above a platform, accordingto a portion of the encrypted instructions data file that was read bythe 3D printer. The controller included the functionality depicted inFIG. 13, 1300 . The respective portions of the 3D objects were printedusing the layer-wise melting of powder material that was disposed insequential layers. Selected portions of the sequentially depositedpowder layers were melted in accordance with respective slices of one ormore virtual models of the three requested 3D objects.

While preferred embodiments of the present invention have been shown,and described herein, it will be obvious to those skilled in the artthat such embodiments are provided by way of example only. It is notintended that the invention be limited by the specific examples providedwithin the specification. While the invention has been described withreference to the afore-mentioned specification, the descriptions andillustrations of the embodiments herein are not meant to be construed ina limiting sense. Numerous variations, changes, and substitutions willnow occur to those skilled in the art without departing from theinvention. Furthermore, it shall be understood that all aspects of theinvention are not limited to the specific depictions, configurations, orrelative proportions set forth herein which depend upon a variety ofconditions and variables. It should be understood that variousalternatives to the embodiments of the invention described herein may beemployed in practicing the invention. It is therefore contemplated thatthe invention shall also cover any such alternatives, modifications,variations, or equivalents. It is intended that the following claimsdefine the scope of the invention and that methods and structures withinthe scope of these claims and their equivalents be covered thereby.

1.-12. (canceled)
 13. An apparatus for printing at least onethree-dimensional object, the apparatus comprising: one or morecontrollers configured to operatively couple with a transforming agentgenerator configured to generate a transforming agent to transform astarting material to a transformed material to print at least a portionof the at least one three-dimensional object, the one or morecontrollers comprising a power connector, the one or more controllersbeing collectively or individually configured to: (i) authenticate, ordirect authentication of, an identity of an accessing party, theaccessing party excluding (a) an owning party of a printer configured toprint the at least one three-dimensional object, (b) a controlling partyof the printer, and/or (c) an operating party of the printer; (ii)process at least one encrypted file to yield instructions for printingthe at least one three-dimensional object, the accessing party beingable to access the at least one encrypted file; and (iii) at least inpart by using the instructions, direct the transforming agent generatorto generate the transforming agent to transform the starting material tothe transformed material to print the at least one three-dimensionalobject in a printing cycle.
 14. (canceled)
 15. (canceled)
 16. (canceled)17. (canceled)
 18. The apparatus of claim 13, wherein the one morecontrollers are configured to process the at least one encrypted file,wherein at least a portion of the at least one encrypted file isgenerated by a pre-print application software; and wherein the one ormore controllers are configured to utilize an output of the pre-printapplication software to yield the instructions.
 19. (canceled) 20.(canceled)
 21. The apparatus of claim 18, wherein the pre-printapplication software is configured to perform operations associatedwith: (A) a region of interest designation in a model of the at leastone three-dimensional object requested, (B) an estimation of alikelihood of print failure of the requested three-dimensional objectmodel, and/or (C) a simulation of printing the requestedthree-dimensional object model, wherein the requested three-dimensionalobject model is associated with a three-dimensional object of the atleast one three-dimensional object.
 22. The apparatus of claim 18,wherein the pre-print application software is configured to performoperations associated with: (A) a requested three-dimensional objectmodel, and/or (B) the instructions for the printer to print therequested three-dimensional object model, wherein the requestedthree-dimensional object model is associated with a three-dimensionalobject of the at least one three-dimensional object.
 23. The apparatusof claim 13, wherein the one or more controllers are configured toprocess the at least one encrypted file to yield the instructions thatcomprise a geometric model of the at least one three-dimensional objectrequested.
 24. The apparatus of claim 23, wherein the one or morecontrollers are configured to process the at least one encrypted file toyield layout instructions comprising commands for the printer to printthe at least one three-dimensional object (i) according to a requestedarrangement comprising placement of the at least one three-dimensionalobject in a build volume in which the at least one three-dimensionalobject is printed during the printing, (ii) according to a specifiedsequence with which one or more transforming agents of the printer areoperated, the one or more transforming agents comprising thetransforming agent, and/or (iii) to incorporate requested marking on theat least one three-dimensional object during the printing.
 25. Theapparatus of claim 13, wherein the one or more controllers areconfigured to authenticate, or direct authentication of, the identity ofthe accessing party that is an entity that (i) develops a pre-printapplication software, (ii) owns the pre-print application software,(iii) controls the pre-print application software, and/or (iv) operatesthe pre-print application software; and wherein the one or morecontrollers are configured to utilize an output of the pre-printapplication software to yield the instructions.
 26. The apparatus ofclaim 13, wherein the printer is configured to embed identificationinformation comprising a type of the printer, or a location of theprinter.
 27. The apparatus of claim 13, wherein the one or morecontrollers are configured to authenticate, or direct authentication of,the identity of the accessing party at least in part by considering asystem type and/or a system version, the system being athree-dimensional printing system configured to print the at least onethree-dimensional object.
 28. The apparatus of claim 13, wherein the oneor more controllers are configured to authenticate, or directauthentication of, the identity of the accessing party, theauthentication being granted at least in part by considering a systemtype and/or a system version, the system being a pre-print environmentapplication.
 29. The apparatus of claim 13, wherein the one or morecontrollers are configured to authenticate, or direct authentication of,the identity of the accessing party, the authentication being grantedfor at least one manufacturing device of manufacturing devicesconfigured for the printing of the at least one three-dimensionalobject.
 30. The apparatus of claim 13, wherein the one or morecontrollers are configured to authenticate, or direct authentication of,the identity of the accessing party, the authentication being grantedfor a pre-print environment application that is of a same type, sameversion, and/or that is developed by an entity.
 31. The apparatus ofclaim 13, wherein the one or more controllers are configured toauthenticate, or direct authentication of, the identity of the accessingparty, the authentication being granted for a pre-print environmentapplication that is controlled, owned, and/or operated by an entity. 32.The apparatus of claim 13, wherein the one or more controllers areconfigured to process the at least one encrypted file at least in partby decrypting at least a portion of the at least one encrypted file viause of a decryption key, wherein the decryption key is provided by apre-print environment.
 33. The apparatus of claim 13, wherein the one ormore controllers are configured to process the at least one encryptedfile at least in part by decrypting at least a portion of the at leastone encrypted file via use of a decryption key, wherein the decryptionkey is provided by a manufacturing device configured for the printing ofthe at least one three-dimensional object.
 34. The apparatus of claim13, wherein the one or more controllers are configured to authenticate,or direct authentication of, the identity of the accessing party, theauthentication being related to a date.
 35. The apparatus of claim 13,wherein the one or more controllers are configured to authenticate, ordirect authentication of, the identity of the accessing party, theauthentication being configured to protect from damage to anintellectual property (i) of a design of the at least onethree-dimensional object, (ii) of the at least one three-dimensionalobject printed, and/or (iii) of the instructions for the printing of theat least one three-dimensional object.
 36. The apparatus of claim 35,wherein the one or more controllers are configured to authenticate, ordirect authentication of, the identity of the accessing party, theauthentication being configured to protect from damage to theintellectual property of the instructions for the printing of the atleast one three-dimensional object, the instructions including one ormore process parameters of the printing.
 37. The apparatus of claim 35,wherein the one or more controllers are configured to authenticate, ordirect authentication of, the identity of the accessing party, theauthentication being configured to protect from damage to theintellectual property of the design of the at least onethree-dimensional object.
 38. A method for printing at least onethree-dimensional object, the method comprising (a) providing theapparatus of claim 13; and (b) using the apparatus to print the at leastone three-dimensional object.
 39. Non-transitory computer readableprinting instructions, the printing instructions, when read by one ormore processors operatively coupled with, or include, the apparatus ofclaim 13, are configured to execute one or more operations associatedwith the apparatus to print the at least one three-dimensional object,the non-transitory computer readable printing instructions beinginscribed on one or more media.